制造商是'Intel'
Intel 嵌入式 - 片上系统(SoC)
(1712)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 可编程逻辑类型 | 主要属性 | 逻辑单元数 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
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![]() | 10AS032E2F29I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | YES | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B780 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 320K Logic Elements | 3.35mm | 29mm | 29mm | 符合RoHS标准 | ||||||||||
![]() | 10AS027H1F35I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 270K Logic Elements | 3.5mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||
![]() | 10AS032H2F35E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 384 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 现场可编程门阵列 | FPGA - 320K Logic Elements | 320000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | ||||
![]() | 10AS027H1F35E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 270K Logic Elements | 3.5mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||
![]() | 10AS027H1F34E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 270K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||
![]() | 10AS016E3F29E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | YES | 288 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B780 | 288 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 现场可编程门阵列 | FPGA - 160K Logic Elements | 160000 | 3.35mm | 29mm | 29mm | 符合RoHS标准 | |||
![]() | 10AS032E2F29E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | YES | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B780 | 360 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 现场可编程门阵列 | FPGA - 320K Logic Elements | 320000 | 3.35mm | 29mm | 29mm | 符合RoHS标准 | |||
![]() | 10AS032H1F34I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 320K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||
![]() | 10AS027H2F35E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 384 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 现场可编程门阵列 | FPGA - 270K Logic Elements | 270000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | ||||
![]() | 10AS032H1F35E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 320K Logic Elements | 3.5mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||
![]() | 10AS032H2F34I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 320K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||
![]() | 10AS027E2F29I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | YES | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B780 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 270K Logic Elements | 3.35mm | 29mm | 29mm | 符合RoHS标准 | ||||||||||
![]() | 10AS032E1F29E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | YES | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B780 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 320K Logic Elements | 3.35mm | 29mm | 29mm | 符合RoHS标准 | ||||||||||
![]() | 10AS048E1F29I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | YES | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B780 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 480K Logic Elements | 3.35mm | 29mm | 29mm | 符合RoHS标准 | ||||||||||
![]() | 10AS016E4F27I3LG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 672-BBGA, FCBGA | YES | 240 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B672 | 240 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 现场可编程门阵列 | FPGA - 160K Logic Elements | 160000 | 3.25mm | 27mm | 27mm | 符合RoHS标准 | ||
![]() | 10AS032E2F29E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||
![]() | 10AS032E2F29I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||
![]() | 10AS032E1F29I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 780-BBGA, FCBGA | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||
![]() | 10AS032E2F27I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 672-BBGA, FCBGA | YES | 240 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B672 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 320K Logic Elements | 3.25mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||
![]() | 10AS027E1F27E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B672 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 270K Logic Elements | 3.25mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||
![]() | 1SX280LN3F43I1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||
![]() | 1SX280LN3F43I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||
![]() | 1SX250LN3F43I3VG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||
![]() | 1SX280LN3F43E1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||
![]() | 1SX280LN3F43E3VG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1760-BBGA, FCBGA | 688 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 |