制造商是'Intel'
Intel 嵌入式 - CPLD（复杂可编程逻辑器件）
(1038)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 时钟频率 | 传播延迟 | 阀门数量 | 输出功能 | 宏细胞数 | JTAG BST | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | EPM7128EQC160-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160-BQFP | YES | 100 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 160 | EAR99 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | 鸥翼 | 220 | 5V | 0.65mm | compliant | 30 | EPM7128 | S-PQFP-G160 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 15 ns | 2500 | MACROCELL | 128 | NO | 4.75V~5.25V | 15ns | 8 | 4.07mm | Non-RoHS Compliant | ||||||||
 | EPM7160EQI100-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-BQFP | YES | 84 | -40°C~85°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.65mm | 30 | EPM7160 | 不合格 | 5.5V | 3.3/55V | 4.5V | EE PLD | 15 ns | 3200 | MACROCELL | 160 | NO | 4.75V~5.25V | 15ns | 10 | 3.65mm | 20mm | 14mm | Non-RoHS Compliant | |||||||
 | EPM9320RC208-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP Exposed Pad | 208-RQFP (28x28) | 132 | 0°C~70°C TA | Tray | MAX® 9000 | Obsolete | 3 (168 Hours) | EPM9320 | 系统内可编程 | 6000 | 320 | 4.75V~5.25V | 15ns | 20 | ||||||||||||||||||||||||||||||
 | EPM2210GF324I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-BGA | YES | 272 | -40°C~100°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 324 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM2210 | S-PBGA-B324 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 11.2 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | 符合RoHS标准 | ||||||
 | EPM7064SLC84-5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000S | e3 | Obsolete | 3 (168 Hours) | 84 | EAR99 | Matte Tin (Sn) | QUAD | J BEND | 245 | 5V | 1.27mm | compliant | 40 | EPM7064 | 不合格 | 5.25V | 3.3/55V | 系统内可编程 | 250MHz | 5 ns | 1250 | MACROCELL | 64 | NO | 4.75V~5.25V | 5ns | 4 | 5.08mm | 29.3116mm | 29.3116mm | 符合RoHS标准 | ||||||||
 | 5M160ZM68C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 68-TFBGA | YES | 52 | 0°C~85°C TJ | Tray | MAX® V | e1 | 活跃 | 3 (168 Hours) | 68 | EAR99 | 锡银铜 | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 40 | 5M160Z | S-PBGA-B68 | 不合格 | 1.89V | 1.2/3.31.8V | 1.71V | 系统内可编程 | 184.1MHz | 7.9 ns | MACROCELL | 128 | YES | 1.71V~1.89V | 7.5ns | 160 | 1.2mm | 5mm | 5mm | 符合RoHS标准 | |||||
 | EPM1270GF256C4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 212 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM1270 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 8.1 ns | MACROCELL | 980 | YES | 1.71V~1.89V | 6.2ns | 1270 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||
| EPM7128ELC84-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 84 | 锡铅 | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7128 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 166.7MHz | 7.5 ns | 2500 | MACROCELL | 128 | NO | 4.75V~5.25V | 7.5ns | 8 | 29.3116mm | 29.3116mm | Non-RoHS Compliant | ||||||||||
 | EPM7064LC44-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 36 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 44 | 锡铅 | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7064 | 不合格 | 5.25V | 5V | EE PLD | 125MHz | 12 ns | 1250 | MACROCELL | 64 | NO | 4.75V~5.25V | 12ns | 4 | 16.5862mm | 16.5862mm | Non-RoHS Compliant | |||||||||||
 | EPM7096LC68-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 68-LCC (J-Lead) | 68-PLCC (24x24) | 52 | 0°C~70°C TA | Tray | MAX® 7000 | Obsolete | 3 (168 Hours) | EPM7096 | EE PLD | 1800 | 96 | 4.75V~5.25V | 12ns | 6 | ||||||||||||||||||||||||||||||
| EPM7128AEFC256-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 100 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991 | 锡铅 | YES | BOTTOM | BALL | 220 | 3.3V | 1mm | compliant | 30 | EPM7128 | S-PBGA-B256 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 10 ns | 2500 | MACROCELL | 128 | YES | 3V~3.6V | 10ns | 8 | 2.1mm | 17mm | 17mm | Non-RoHS Compliant | ||||||
 | EPM3512AQC208-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP | YES | 172 | 0°C~70°C TA | Tray | MAX® 3000A | e0 | Obsolete | 3 (168 Hours) | 208 | 3A991 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPM3512 | S-PQFP-G208 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 7.5 ns | 10000 | MACROCELL | 512 | YES | 3V~3.6V | 7.5ns | 32 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||||
 | EPM570GT144C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | 144 | EAR99 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | EPM570 | S-PQFP-G144 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||
 | 5M40ZM64I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 64-TFBGA | YES | 30 | -40°C~100°C TJ | Tray | 2003 | MAX® V | e1 | 活跃 | 3 (168 Hours) | 64 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 30 | 5M40Z | S-PBGA-B64 | 不合格 | 1.89V | 1.71V | 系统内可编程 | 118.3MHz | 14 ns | MACROCELL | 32 | 1.71V~1.89V | 7.5ns | 40 | 1.2mm | 4.5mm | 4.5mm | 符合RoHS标准 | ||||||||
 | EPM570GT100C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 76 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡铅 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 235 | 1.8V | 0.5mm | 30 | EPM570 | S-PQFP-G100 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 5.4 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | ||||||
| EPM570GT100C4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 76 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡铅 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 235 | 1.8V | 0.5mm | 30 | EPM570 | S-PQFP-G100 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | ||||||
| EPM3064ALI44-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 34 | -40°C~85°C TA | Tray | MAX® 3000A | e3 | Obsolete | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | J BEND | 245 | 3.3V | 1.27mm | compliant | 40 | EPM3064 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 100MHz | 10 ns | 1250 | MACROCELL | 64 | YES | 3V~3.6V | 10ns | 4 | 16.5862mm | 16.5862mm | 符合RoHS标准 | |||||||
| EPM570T144C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 144 | EAR99 | 锡铅 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPM570 | S-PQFP-G144 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 5.4 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||
| EPM7160EQC100-20 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-BQFP | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.65mm | compliant | 30 | EPM7160 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 83.3MHz | 20 ns | 3200 | MACROCELL | 160 | NO | 4.75V~5.25V | 20ns | 10 | 3.65mm | 20mm | 14mm | Non-RoHS Compliant | |||||
| EPM7256AEFC256-5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000A | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991 | 锡银铜 | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | compliant | 40 | EPM7256 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 172.4MHz | 5.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 5.5ns | 16 | 2.1mm | 17mm | 17mm | 符合RoHS标准 | |||||
 | EPM7064BTC44-7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-TQFP | YES | 36 | 0°C~70°C TA | Tray | MAX® 7000B | e3 | Obsolete | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 2.5V | 0.8mm | compliant | 40 | EPM7064 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 303MHz | 3.5 ns | 1250 | MACROCELL | 64 | YES | 2.375V~2.625V | 7.5ns | 4 | 1.27mm | 10mm | 10mm | 符合RoHS标准 | ||||||
 | EPM7192EGC160-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160-BPGA | NO | 124 | 0°C~70°C TA | Tray | MAX® 7000 | Obsolete | 3 (168 Hours) | 160 | TIN/LEAD (SN/PB) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 220 | 5V | 2.54mm | compliant | 30 | EPM7192 | S-CPGA-P160 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 3750 | MACROCELL | 192 | NO | 4.75V~5.25V | 12ns | 12 | 5.34mm | 39.624mm | 39.624mm | Non-RoHS Compliant | ||||||||
| EPM7096LC84-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | 84-PLCC (29.31x29.31) | 68 | 0°C~70°C TA | Tray | MAX® 7000 | Obsolete | 3 (168 Hours) | EPM7096 | EE PLD | 1800 | 96 | 4.75V~5.25V | 12ns | 6 | ||||||||||||||||||||||||||||||
| EPM7032STC44-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-TQFP | 36 | 0°C~70°C TA | Tray | MAX® 7000S | Obsolete | 3 (168 Hours) | EPM7032 | 系统内可编程 | 600 | 32 | 4.75V~5.25V | 5ns | 2 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| EPM2210GF324C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 324 | 3A991 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B324 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | Non-RoHS Compliant |