制造商是'Intel'
Intel 嵌入式 - CPLD（复杂可编程逻辑器件）
(1038)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 时钟频率 | 传播延迟 | 阀门数量 | 输出功能 | 宏细胞数 | JTAG BST | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | EPM7256SRC208-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP Exposed Pad | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000S | e0 | Obsolete | 3 (168 Hours) | 208 | 3A991 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.5mm | 30 | EPM7256 | S-PQFP-G208 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 125MHz | 10 ns | 5000 | MACROCELL | 256 | YES | 4.75V~5.25V | 10ns | 16 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||
 | EPM570GF256C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 160 | 0°C~85°C TJ | Tray | 2014 | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | EAR99 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM570 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 5.4 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||
 | EPM1270GT144C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991 | Matte Tin (Sn) - annealed | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | EPM1270 | S-PQFP-G144 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 10 ns | MACROCELL | 980 | YES | 1.71V~1.89V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||
 | EPM7032AETC44-4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 44-TQFP | YES | 36 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 44 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 235 | 3.3V | 0.8mm | 30 | EPM7032 | S-PQFP-G44 | 不合格 | 3.6V | 3V | 系统内可编程 | 4.5 ns | 600 | MACROCELL | 32 | YES | 3V~3.6V | 4.5ns | 2 | 10mm | 10mm | Non-RoHS Compliant | |||||||||
 | EPM7256AETC100-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 84 | 0°C~70°C TA | Tray | 1998 | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 100 | 3A991 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 235 | 3.3V | 0.5mm | not_compliant | 30 | EPM7256 | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 126.6MHz | 7.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 7.5ns | 16 | 1.27mm | 14mm | 14mm | Non-RoHS Compliant | |
| EPM1270T144C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | 2003 | MAX® II | e0 | 活跃 | 3 (168 Hours) | 144 | 3A991 | 锡铅 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPM1270 | S-PQFP-G144 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 6.2 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||
 | EPM7064SLC84-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000S | e0 | Obsolete | 2 (1 Year) | 84 | Tin/Lead (Sn/Pb) | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7064 | 不合格 | 5.25V | 3.3/55V | 系统内可编程 | 125MHz | 10 ns | 1250 | MACROCELL | 64 | YES | 4.75V~5.25V | 10ns | 4 | 5.08mm | 29.3116mm | 29.3116mm | Non-RoHS Compliant | ||||||||
 | EPM7064QC100-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-BQFP | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 100 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | 鸥翼 | 220 | 5V | 0.65mm | compliant | 30 | EPM7064 | R-PQFP-G100 | 不合格 | 5.25V | 3.3/55V | EE PLD | 125MHz | 12 ns | 1250 | MACROCELL | 64 | NO | 4.75V~5.25V | 12ns | 4 | 3.65mm | 20mm | Non-RoHS Compliant | |||||||
 | EPM240F100C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-LBGA | YES | 80 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM240 | S-PBGA-B100 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 6.1 ns | MACROCELL | 192 | YES | 2.5V 3.3V | 4.7ns | 240 | 1.7mm | 11mm | 11mm | 符合RoHS标准 | |||||
| EPM570GF256C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 160 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 256 | EAR99 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM570 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 5.4 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | 符合RoHS标准 | |||||
| EPM1270T144C4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | 2003 | MAX® II | e0 | 活跃 | 3 (168 Hours) | 144 | 3A991 | 锡铅 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPM1270 | S-PQFP-G144 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 8.1 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||
| EPM1270F256C3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 212 | 0°C~85°C TJ | Tray | 2003 | MAX® II | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM1270 | S-PBGA-B256 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 6.2 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 2.2mm | 17mm | 17mm | 符合RoHS标准 | |||||
| EPM7256AEFC100-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-LBGA | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 100 | 3A991 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 235 | 3.3V | 1mm | 30 | EPM7256 | S-PBGA-B100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 172.4MHz | 5.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 5.5ns | 16 | 1.7mm | 11mm | 11mm | 符合RoHS标准 | |||
 | EPM2210F324I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-BGA | YES | 272 | -40°C~100°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 324 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM2210 | S-PBGA-B324 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 11.2 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 19mm | 19mm | 符合RoHS标准 | |||||
 | EPM7064LC68-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | 52 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 2 (1 Year) | 68 | EAR99 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7064 | S-PQCC-J68 | 不合格 | 5.25V | 3.3/55V | EE PLD | 100MHz | 15 ns | 1250 | MACROCELL | 64 | NO | 4.75V~5.25V | 15ns | 4 | 5.08mm | Non-RoHS Compliant | ||||||||
| EPM7128BTC144-4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | YES | 100 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 144 | 3A991 | Tin/Lead (Sn/Pb) | YES | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | compliant | 30 | EPM7128 | S-PQFP-G144 | 不合格 | 2.625V | 2.375V | 系统内可编程 | 243.9MHz | 4 ns | 2500 | MACROCELL | 128 | YES | 2.375V~2.625V | 4ns | 8 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||
| EPM570GT100C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 76 | 0°C~85°C TJ | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 哑光锡 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | EPM570 | S-PQFP-G100 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | |||||
| EPM7064STC100-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000S | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 5V | 0.5mm | compliant | 40 | EPM7064 | S-PQFP-G100 | 不合格 | 5.25V | 3.3/55V | 系统内可编程 | 125MHz | 10 ns | 1250 | MACROCELL | 64 | NO | 4.75V~5.25V | 10ns | 4 | 1.27mm | 符合RoHS标准 | ||||||||
 | EPM3064ALC44-4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 34 | 0°C~70°C TA | Tray | 1998 | MAX® 3000A | e3 | Obsolete | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | J BEND | 245 | 3.3V | 1.27mm | compliant | 40 | EPM3064 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 222.2MHz | 1250 | MACROCELL | 64 | YES | 3V~3.6V | 4.5ns | 4 | 16.5862mm | 16.5862mm | 符合RoHS标准 | ||||||
| EPM3032ALC44-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 34 | 0°C~70°C TA | Tray | 1998 | MAX® 3000A | e3 | Obsolete | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | J BEND | 245 | 3.3V | compliant | 40 | EPM3032 | S-PQCC-J44 | 不合格 | 3.6V | 3V | 系统内可编程 | 103.1MHz | 10 ns | 600 | MACROCELL | 32 | YES | 3V~3.6V | 10ns | 2 | 符合RoHS标准 | ||||||||
| EPM7256AEFC100-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-LBGA | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 100 | 3A991 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 235 | 3.3V | 1mm | 30 | EPM7256 | S-PBGA-B100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 126.6MHz | 7.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 7.5ns | 16 | 1.7mm | 11mm | 11mm | 符合RoHS标准 | |||
| EPM3064ATC100-4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 66 | 0°C~70°C TA | Tray | 1998 | MAX® 3000A | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | YES | QUAD | 鸥翼 | 235 | 3.3V | 0.5mm | 30 | EPM3064 | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 222.2MHz | 1250 | MACROCELL | 64 | YES | 3V~3.6V | 4.5ns | 4 | 1.27mm | Non-RoHS Compliant | ||||||||
| EPM3256ATI144-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | YES | 116 | -40°C~85°C TA | Tray | 1998 | MAX® 3000A | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPM3256 | S-PQFP-G144 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 95.2MHz | 10 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 10ns | 16 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||
| EPM2210F256C4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn63Pb37) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | not_compliant | 30 | EPM2210 | S-PBGA-B256 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 9.1 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||
| EPM7256AETC144-7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 120 | 0°C~70°C TA | Tray | MAX® 7000A | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991 | MATTE TIN (472) OVER COPPER | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | EPM7256 | S-PQFP-G144 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 126.6MHz | 7.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 7.5ns | 16 | 1.6mm | 20mm | 20mm | 符合RoHS标准 |