制造商是'Infineon'
Infineon 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 越来越多的功能 | 外壳材料 | 供应商器件包装 | 插入材料 | 后壳材料,电镀 | 第一种连接器安装类型 | 第二个连接器安装类型 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 组成 | 颜色 | 应用 | 性别 | 功率(瓦特) | 紧固类型 | 子类别 | 额定电流 | 方向 | 屏蔽/屏蔽 | 入口保护 | 样式 | 外壳完成 | 外壳尺寸-插入 | 接头数量 | 失败率 | 配置 | 电感,电感 | 直流电阻(DCR) | 振荡器类型 | 速度 | 内存大小 | 外壳尺寸,MIL | 电压 - 供电 (Vcc/Vdd) | 电压 - 正向 (Vf) (类型) | 核心处理器 | 视角 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 谐振@频率 | 电缆开口 | 测试电流 | 镜头风格 | 镜头尺寸 | 产品类别 | Millicandela评级 | 镜头透明度 | 波长 - 峰值 | 第一个连接器 | 第二个连接器 | EEPROM 大小 | 镜头颜色 | 特征 | 产品类别 | 座位高度(最大) | 长度 | 触点表面处理厚度 - 配套 | 高度(最大) | 材料可燃性等级 | 辐射硬化 | 评级结果 | ||||||||||||||||||||||||||
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![]() | CY8C4147LQE-S263T | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 34 | Tape & Reel (TR) | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | SoC FPGA | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Non-Compliant | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | ARM Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C624ABZI-S2D04 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Cable | 100 | Tray | CY8C624A | A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b | 活跃 | 有 | 1300 | Infineon | Infineon Technologies | ARM Microcontrollers - MCU | 表面贴装 | 124-VFBGA | 124-VFBGA (9x9) | Infineon Technologies | Non-Compliant | -40°C ~ 85°C (TA) | Bulk | PSoC® 6 | Crimp | Female | Microcontrollers - MCU | Straight | 16 | External, Internal | 100MHz, 150MHz | 1M x 8 | 1.7V ~ 3.6V | ARM® Cortex®-M0+, ARM® Cortex®-M4F | Brown-out Detect/Reset, CapSense, I²S, LCD, LVD, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 2MB (2M x 8) | eMMC/SD/SDIO, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB | - | ARM Microcontrollers - MCU | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MB91F522FWCPMC-GSE2 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RNC50 | Bulk | 76 | A/D 37x12b; D/A 2x8b | 表面贴装 | Axial | Axial | Vishay Dale | 活跃 | -65°C ~ 175°C | Military, MIL-PRF-55182/07, RNC50 | 0.070 Dia x 0.150 L (1.78mm x 3.81mm) | ±0.1% | 2 | ±25ppm/°C | 4.02 kOhms | Metal Film | 0.1W, 1/10W | S (0.001%) | External | 80MHz | 56K x 8 | 2.7V ~ 5.5V | FR81S | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 320KB (320K x 8) | CANbus, CSIO, I²C, LINbus, SPI, UART/USART | 64K x 8 | Military, Moisture Resistant, Weldable | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY9AF156MBPMC-G-JNE2 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RLR05 | 活跃 | 66 | A/D 17x12b | 1190 | Infineon | Infineon Technologies | Details | ARM Microcontrollers - MCU | 表面贴装 | Axial | Axial | Vishay Dale | Bulk | -65°C ~ 150°C | Tray | Military, MIL-PRF-39017/05, RLR05 | 0.066 Dia x 0.150 L (1.68mm x 3.81mm) | ±1% | 2 | ±100ppm/°C | 33.2 kOhms | Metal Film | 0.125W, 1/8W | Microcontrollers - MCU | S (0.001%) | Internal | 40MHz | 64K x 8 | 1.65V ~ 3.6V | ARM® Cortex®-M3 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 544KB (544K x 8) | CSIO, EBI/EMI, I²C, SPI, UART/USART | - | Military, Moisture Resistant, Weldable | ARM Microcontrollers - MCU | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MB96F346RWAPMC-GSE2 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | 80 | MB96F346 | A/D 24x10b | 表面贴装 | 1206 (3216 Metric) | 1206 | Vishay Dale | 活跃 | -65°C ~ 155°C | RCP | 0.122 L x 0.060 W (3.10mm x 1.52mm) | ±2% | 2 | ±150ppm/°C | 1.8 kOhms | 厚膜 | 2.4W | - | Internal | 56MHz | 16K x 8 | 3V ~ 5.5V | F²MC-16FX | DMA, LVD, LVR, POR, PWM, WDT | FLASH | 16-Bit | 288KB (288K x 8) | CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART | - | Moisture Resistant | 0.025 (0.64mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MB90352ESPMC-GS-111E1 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 036914 | 活跃 | 51 | A/D 15x8/10b | 表面贴装 | 64-LQFP | 64-LQFP (12x12) | Molex | Bulk | -40°C ~ 125°C (TA) | * | Internal | 24MHz | 4K x 8 | 3.5V ~ 5.5V | F²MC-16LX | DMA, LVD, POR, WDT | 掩膜ROM | 16-Bit | 128KB (128K x 8) | CANbus, EBI/EMI, I²C, LINbus, UART/USART | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQA-S263 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | MCA1206 | 34 | A/D 16x10b, 20x12b SAR | 有 | 4900 | Infineon | Infineon Technologies | Details | SoC FPGA | Surface Mount, Wettable Flank | 1206 (3216 Metric) | 1206 | Vishay Beyschlag/Draloric/BC Components | 活跃 | -55°C ~ 125°C | Tray | MCA - Precision | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.1% | 2 | ±25ppm/°C | 768 Ohms | Thin Film | 0.25W, 1/4W | SOC - Systems on a Chip | - | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | Anti-Sulfur | ARM Microcontrollers - MCU | 0.026 (0.65mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4146LQS-S453 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RN731J | Obsolete | 34 | A/D 16x10b, 12x12b SAR; D/A 2x7b | 有 | 4900 | Infineon | Infineon Technologies | Details | SoC FPGA | Surface Mount, Wettable Flank | 0603 (1608 Metric) | 0603 | KOA Speer Electronics, Inc. | Tape & Reel (TR) | -55°C ~ 155°C | Tray | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.05% | 2 | ±10ppm/°C | 4.22 kOhms | Thin Film | 0.063W, 1/16W | SOC - Systems on a Chip | External, Internal | 48MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | Moisture Resistant | ARM Microcontrollers - MCU | 0.022 (0.55mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4146AZE-S255 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | A/D 16x10b, 20x12b SAR | 54 | 有 | 1600 | Infineon | Infineon Technologies | Details | SoC FPGA | 表面贴装 | 64-LQFP | 64-TQFP (10x10) | Panduit Corp | Bulk | -40°C ~ 125°C (TA) | Tray | * | SOC - Systems on a Chip | Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 64KB (64K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | ARM Microcontrollers - MCU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147AZE-S265 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RN73H2E | 活跃 | 54 | A/D 16x10b, 20x12b SAR | 有 | 1600 | Infineon | Infineon Technologies | Details | SoC FPGA | 表面贴装 | 1210 (3225 Metric) | 1210 | KOA Speer Electronics, Inc. | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | -55°C ~ 155°C | Tray | RN73H | 0.126 L x 0.098 W (3.20mm x 2.50mm) | ±0.05% | 2 | ±25ppm/°C | 820 Ohms | Metal Film | 0.25W, 1/4W | SOC - Systems on a Chip | - | Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 128KB (128K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | Automotive AEC-Q200, Moisture Resistant | ARM Microcontrollers - MCU | 0.028 (0.70mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQA-S293 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MS27473T14B | 活跃 | 34 | A/D 16x10b, 20x12b SAR | 有 | 4900 | Infineon | Infineon Technologies | Details | SoC FPGA | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Corsair | Bag | -40°C ~ 85°C (TA) | Tray | * | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | ARM Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147AZE-S455 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | RN732A | A/D 16x10b, 20x12b SAR | 54 | 有 | 1600 | Infineon | Infineon Technologies | Details | SoC FPGA | 表面贴装 | 0805 (2012 Metric) | 0805 | KOA Speer Electronics, Inc. | Obsolete | -55°C ~ 155°C | Tray | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | 2 | ±50ppm/°C | 43 kOhms | Thin Film | 0.1W, 1/10W | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | Moisture Resistant | ARM Microcontrollers - MCU | 0.024 (0.60mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQE-S253 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 100182 | 活跃 | 34 | A/D 16x10b, 20x12b SAR | 有 | 4900 | Infineon | Infineon Technologies | Details | SoC FPGA | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Molex | Bulk | -40°C ~ 125°C (TA) | Tray | * | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | ARM Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147AZE-S245 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Copper Alloy | Silver | - | Bulk | Metal | 54 | A/D 16x10b, 20x12b SAR | 有 | 1600 | Infineon | Infineon Technologies | Details | SoC FPGA | Free Hanging (In-Line), Right Angle | 64-LQFP | - | 铝合金 | 64-TQFP (10x10) | Neoprene | Aluminum Alloy, Olive Drab Cadmium | ITT Cannon, LLC | CIR08 | -55°C ~ 125°C | Tray | CIR | 焊杯 | Plug, Female Sockets | 10 | 橄榄色 | - | 卡口锁 | SOC - Systems on a Chip | 13A | W | - | 环境防护 | 橄榄色镉 | 18-1 | Internal | 24MHz | 16K x 8 | - | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 128KB (128K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | - | - | Backshell, Cable Clamp, Coupling Nut | ARM Microcontrollers - MCU | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY9AF156MBBGL-GK9E1 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 090650 | Bulk | 66 | A/D 17x12b | 4900 | Infineon | Infineon Technologies | Details | ARM Microcontrollers - MCU | 表面贴装 | 96-LFBGA | 96-FBGA (6x6) | Molex | 活跃 | -40°C ~ 85°C (TA) | Tray | * | Microcontrollers - MCU | Internal | 40MHz | 64K x 8 | 1.65V ~ 3.6V | ARM® Cortex®-M3 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 544KB (544K x 8) | CSIO, EBI/EMI, I²C, SPI, UART/USART | - | ARM Microcontrollers - MCU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY9BF415NBGL-GK9E1 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Obsolete | 100 MHz | Bulk | 12GHz | 83 | CY9BF415 | A/D 16x12b | 1980 | Infineon | Infineon Technologies | Details | ARM Microcontrollers - MCU | 表面贴装 | 0603 (1608 Metric) | 0603 | 中央技术 | - | -40°C ~ 125°C | Tray | CTLC0603F | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.2nH | - | Microcontrollers - MCU | 1.5 A | Unshielded | 1.8 nH | 33mOhm Max | Internal | 144MHz | 48K x 8 | 2.7V ~ 5.5V | ARM® Cortex®-M3 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 416KB (416K x 8) | CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART | 12 @ 100MHz | - | - | ARM Microcontrollers - MCU | 0.037 (0.95mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY9AF116NABGL-GK9E1 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Bulk | 83 | CY9AF116 | A/D 16x12b | 1980 | Infineon | Infineon Technologies | Details | ARM Microcontrollers - MCU | 表面贴装 | 112-LFBGA | 112-PFBGA (10x10) | Panduit Corp | Obsolete | -40°C ~ 105°C (TA) | Tray | - | Microcontrollers - MCU | Internal | 40MHz | 32K x 8 | 2.7V ~ 5.5V | ARM® Cortex®-M3 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 512KB (512K x 8) | CSIO, EBI/EMI, I²C, LINbus, SPI, UART/USART | - | ARM Microcontrollers - MCU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C3665PVI-008T | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | TNPW1206 | 25 | A/D 16x12b; D/A 4x8b | 表面贴装 | 1206 (3216 Metric) | 1206 | Vishay Dale | 活跃 | -55°C ~ 155°C | TNPW e3 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.1% | 2 | ±10ppm/°C | 64.9 kOhms | Thin Film | 0.25W, 1/4W | - | Internal | 67MHz | 4K x 8 | 1.71V ~ 5.5V | 8051 | CapSense, DMA, POR, PWM, WDT | FLASH | 8-Bit | 32KB (32K x 8) | EBI/EMI, I²C, LINbus, SPI, UART/USART | 1K x 8 | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant | 0.026 (0.65mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MB90922NCSPMC-GS-163E1 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | TLMP3107 | Obsolete | 93 | A/D 8x8/10b | 表面贴装 | 2-SMD, J-Lead | 2-PLCC | 威世半导体光电事业部 | 560nm | -40°C ~ 105°C (TA) | - | 3.00mm L x 2.80mm W | Green | Standard | External | 32MHz | 10K x 8 | 4V ~ 5.5V | 2.1V | F²MC-16LX | 120° | LCD, LVD, POR, PWM, WDT | 掩膜ROM | 16-Bit | 256KB (256K x 8) | CANbus, LINbus, UART/USART | 10mA | 圆形,带平顶 | 2.40mm Dia | 3.75mcd | Clear | 555nm | - | - | - | 1.85mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYT3BBBCEBQ0BZEGST | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 220 | A/D 90x12b SAR | 800 | Infineon | Infineon Technologies | Details | ARM Microcontrollers - MCU | 表面贴装 | 1206 (3216 Metric) | 1206 | Stackpole Electronics Inc | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | -55°C ~ 155°C | Reel | RMCF | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±5% | 2 | ±200ppm/°C | 1.8 MOhms | 厚膜 | 0.25W, 1/4W | Microcontrollers - MCU | - | External, Internal | 100MHz, 250MHz | 768K x 8 | 2.7V ~ 5.5V | ARM® Cortex®-M0+, ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 4.0625MB (4.0625M x 8) | CANbus, Ethernet, I²C, LINbus, eMMC/SD, SPI, UART/USART | 256K x 8 | Automotive AEC-Q200 | ARM Microcontrollers - MCU | 0.028 (0.70mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MB90F342CEPMC-GE1 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 221050 | 活跃 | 80 | A/D 24x8/10b | 表面贴装 | 100-LQFP | 100-LQFP (14x14) | Molex | Bulk | -40°C ~ 105°C (TA) | * | External | 24MHz | 16K x 8 | 3.5V ~ 5.5V | F²MC-16LX | DMA, POR, WDT | FLASH | 16-Bit | 256KB (256K x 8) | CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYT2BL7CAAQ0AZSGST | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Bulkhead - Front Side Nut | 活跃 | Female | 4 GHz | Bulkhead - Front Side Nut | RG-316 | Female | Bag | 50 Ohms | 122 | A/D 54x12b SAR | 300 | Infineon | Infineon Technologies | Details | 表面贴装 | 144-LQFP | 144-LQFP (20x20) | 面板安装 | 面板安装 | Amphenol Custom Cable | Q-0404F0 | - | Reel | - | Copper | - | BNC 转 TNC | External, Internal | 100MHz, 160MHz | 512K x 8 | 2.7V ~ 5.5V | ARM® Cortex®-M0+, ARM® Cortex®-M4F | Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT | FLASH | 32-Bit Dual-Core | 4.16MB (4.16M x 8) | CANbus, FIFO, I²C, LINbus, SPI, UART/USART | BNC Jack | TNC 插孔 | 128K x 8 | Shielded | Infineon | 6.000 (152.40mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MB96F623RBPMC-GSE2 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Bulk | Composite | ACT90 | Discontinued at Digi-Key | Copper Alloy | Gold | 52 | A/D 21x8/10b | 面板安装 | 64-LQFP | Flange | Composite | 64-LQFP (12x12) | Thermoplastic | - | TE Connectivity Deutsch 连接器 | - | -65°C ~ 175°C | MIL-DTL-38999 Series III, ACT | Crimp | Receptacle, Male Pins | 10 | 橄榄色 | Aerospace, Military | Threaded | 7.5A | B | Shielded | 抗环境干扰 | 橄榄色镉 | 13-98 | Internal | 32MHz | 10K x 8 | C | 2.7V ~ 5.5V | F²MC-16FX | DMA, LVD, POR, PWM, WDT | FLASH | 16-Bit | 96KB (96K x 8) | CANbus, I²C, LINbus, SCI, UART/USART | - | - | - | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MB96F356RSBPMC1-GSE2 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RN731J | Obsolete | 51 | A/D 15x10b | 表面贴装 | 0603 (1608 Metric) | 0603 | KOA Speer Electronics, Inc. | Tape & Reel (TR) | -55°C ~ 155°C | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±1% | 2 | ±25ppm/°C | 215 Ohms | Thin Film | 0.063W, 1/16W | Internal | 56MHz | 12K x 8 | 3V ~ 5.5V | F²MC-16FX | DMA, LVD, LVR, POR, PWM, WDT | FLASH | 16-Bit | 288KB (288K x 8) | CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART | - | Moisture Resistant | 0.022 (0.55mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C3444AXI-106 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RNC50 | 活跃 | 62 | A/D 16x12b; D/A 2x8b | 表面贴装 | Axial | Axial | Vishay Dale | Bulk | -65°C ~ 175°C | Military, MIL-PRF-55182/07, RNC50 | 0.070 Dia x 0.150 L (1.78mm x 3.81mm) | ±1% | 2 | ±50ppm/°C | 28 Ohms | Metal Film | 0.1W, 1/10W | R (0.01%) | Internal | 50MHz | 2K x 8 | 1.71V ~ 5.5V | 8051 | CapSense, DMA, POR, PWM, WDT | FLASH | 8-Bit | 16KB (16K x 8) | EBI/EMI, I²C, LINbus, SPI, UART/USART, USB | 512 x 8 | Military, Moisture Resistant, Weldable | - |