制造商是'Infineon'
Infineon 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 最大功率耗散 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 振荡器类型 | 电源电流 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 位元大小 | 访问时间 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 无卤素 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 最高频率 | A/D转换器数量 | 外部数据总线宽度 | 可编程I/O数 | UART 通道数 | ADC通道数量 | 最大结点温度（Tj） | PWM通道数 | I2C通道数 | 环境温度范围高 | SPI 通道数 | USB 通道数 | 以太网通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XMC4500F144K1024ACXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 91 | 有 | 160K x 8 | 表面贴装 | 144-LQFP Exposed Pad | YES | 144 | 1.290414g | A/D 32x12b; D/A 2x12b | -40°C~125°C TA | Tray | 2013 | XMC4000 | e3 | 活跃 | 3 (168 Hours) | 144 | Tin (Sn) | 根据O文件考虑的adc转换器 | 1W | QUAD | 鸥翼 | 3.3V | 0.5mm | 120MHz | 1.3V | 3.63V | CAN, EBI/EMI, Ethernet, I2C, I2S, LIN, SPI, UART, USB | Internal | 1MB | 3.13V~3.63V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LED, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB | 32 | YES | YES | 32b | YES | 无卤素 | 4 | ARM | 8 | 32 | 1.6mm | 20mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | XMC4500F100K1024ACXQSA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 55 | 有 | 160K x 8 | 表面贴装 | 表面贴装 | 100-LQFP Exposed Pad | 100 | 1.319103g | A/D 24x12b; D/A 2x12b | -40°C~125°C TA | Tray | 2013 | XMC4000 | e3 | 活跃 | 3 (168 Hours) | Tin (Sn) | 1W | 120MHz | XMC4500 | 3.3V | CAN, EBI/EMI, Ethernet, I2C, I2S, LIN, SPI, UART, USB | Internal | 1MB | 3.13V~3.63V | ARM® Cortex®-M4 | DMA, I2S, LED, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB | 32b | 无卤素 | 4 | ARM | 73 | 24 | 2 | 1 | 1.4mm | 14mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | XC167CI32F40FBBAKXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 103 | 有 | 12K x 8 | 表面贴装 | TQFP | 144 | A/D 16x8/10b | -40°C~85°C TA | 2001 | XC16x | e3 | 不用于新设计 | 3 (168 Hours) | 144 | Tin (Sn) | 800mW | QUAD | 鸥翼 | 2.5V | 40MHz | 144 | 2.7V | CAN, EBI/EMI, I2C, SPI, UART, USART | Internal | 256kB | 2.35V~2.7V | MICROCONTROLLER | C166SV2 | PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SPI, UART/USART | 16 | YES | NO | 16b | YES | NO | 5 | 16 | 1.6mm | 20mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||
 | TC297TP128F300NBCKXUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 263 | 745472 | 8388608 | 表面贴装 | 292-LFBGA | YES | A/D 60x12b, 10 x Sigma-Delta | -40°C~125°C TA | Tape & Reel (TR) | AURIX™ | yes | 活跃 | 3 (168 Hours) | 292 | 3A001.A.3 | IT HAS 21 ADC MODULE, 60 A/D LINES | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 未说明 | S-PBGA-B292 | External | 300MHz | 240K x 8 | 1.17V~1.43V 2.97V~5.5V | MICROCONTROLLER | TriCore™ | DMA, WDT | 300MHz | FLASH | 32-Bit Tri-Core | 8MB 8M x 8 | ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT | 32 | YES | YES | 768K x 8 | 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | XE167F96F66LACFXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 118 | 有 | 82K x 8 | 表面贴装 | 表面贴装 | 144-LQFP Exposed Pad | 144 | A/D 24x10b | -40°C~85°C TA | Tray | 2008 | XE16x | 不用于新设计 | 3 (168 Hours) | 1W | 未说明 | 66MHz | 未说明 | SA*XE167F | 3.3V | CAN, EBI/EMI, I2C, I2S, LIN, SPI, UART, USART | Internal | 768kB | 3V~5.5V | MICROCONTROLLER, RISC | C166SV2 | I2S, POR, PWM, WDT | FLASH | 16-Bit | 768KB 768K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI | 16b | 5 | 24 | 16 | 6 | 1.5mm | 20mm | 20mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XC167CI16F40FBBKXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 103 | 有 | 8K x 8 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | A/D 16x8/10b | -40°C~125°C TA | Tray | 2001 | XC16x | e3 | 不用于新设计 | 3 (168 Hours) | 144 | Tin (Sn) | 800mW | QUAD | 鸥翼 | 2.5V | 40MHz | 144 | 2.7V | CAN, EBI/EMI, I2C, SPI, UART, USART | Internal | 128kB | 2.35V~2.7V | MICROCONTROLLER | C166SV2 | PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | 16 | YES | NO | 16b | YES | NO | 5 | 24 | 1.6mm | 20mm | 无 | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||
| XMC4500F144F1024ACXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 91 | 有 | 160K x 8 | 表面贴装 | 144-LQFP Exposed Pad | 144 | 1.290414g | A/D 32x12b; D/A 2x12b | -40°C~85°C TA | Tray | 2014 | XMC4000 | e3 | 活跃 | 3 (168 Hours) | Tin (Sn) | 1W | 120MHz | 1.3V | CAN, EBI/EMI, Ethernet, I2C, I2S, LIN, SPI, UART, USB | Internal | 1MB | 3.13V~3.63V | ARM® Cortex®-M4 | DMA, I2S, LED, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB | 32b | 无卤素 | 4 | ARM | 117 | 32 | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| TC277TP64F200NDCKXUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 169 | 472K x 8 | 表面贴装 | 292-LFBGA | YES | A/D 60x12b, 6 x Sigma-Delta | -40°C~125°C TA | Tape & Reel (TR) | 2010 | AURIX™ | 不用于新设计 | 3 (168 Hours) | 292 | BOTTOM | BALL | 未说明 | 200MHz | 未说明 | S-PBGA-B292 | CAN, Ethernet, I2C, LIN, SPI | External | 4MB | 3V~5.5V | MICROCONTROLLER | TriCore™ | DMA, WDT | FLASH | 32-Bit Tri-Core | 4MB 4M x 8 | ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT | 32 | YES | YES | 32b | NO | 64K x 8 | 8 | 8 | 60 | 150°C | 125°C | 4 | 1 | 1.7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| XC167CI16F40FBBFXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 103 | 131072 | 有 | 8K x 8 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | A/D 16x8/10b | -40°C~85°C TA | Tray | 2001 | XC16x | yes | 不用于新设计 | 3 (168 Hours) | 144 | 800mW | QUAD | 鸥翼 | 未说明 | 2.5V | 40MHz | 未说明 | SA*XC167CI | 2.7V | CAN, I2C, SPI, USART | Internal | 128kB | 2.35V~2.7V | MICROCONTROLLER | C166SV2 | PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, SPI, UART/USART | 16 | YES | NO | 16b | YES | NO | 5 | 24 | 8 | 1.6mm | 20mm | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||
 | TC1782F320F180HRBAKXUMA2 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 86 | 有 | 176K x 8 | 表面贴装 | 176-LQFP | 176 | A/D 8x10b, 32x12b | -40°C~125°C TA | Tape & Reel (TR) | 2007 | TC17xx | e4 | 活跃 | 3 (168 Hours) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | 8542.31.00.01 | 1.143W | 未说明 | 180MHz | 未说明 | CAN, SPI, UART | External | 2.5MB | 1.17V~3.63V | MICROCONTROLLER, RISC | TriCore™ | DMA, POR, WDT | FLASH | 32-Bit | 2.5MB 2.5M x 8 | ASC, CANbus, FlexRay, MLI, MSC, SSC | 32b | 无卤素 | 128K x 8 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC886CM8FFA5VACKXUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 32768 | 34 | A/D 8x10b | 1.75K x 8 | 表面贴装 | 表面贴装 | 48-TQFP | 48 | 有 | -40°C~125°C TA | Tape & Reel (TR) | 1998 | XC8xx | 不用于新设计 | 3 (168 Hours) | 48 | ALSO REQUIRES 5V SUPPLY | QUAD | 鸥翼 | 未说明 | 2.5V | 0.5mm | 24MHz | 未说明 | SA*XC886CM | 不合格 | 2.7V | 2.55V | 2.3V | CAN, SPI, UART, USART | Internal | 103.2 MHz | 32kB | 4.5V~5.5V | MICROCONTROLLER | XC800 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, SSI, UART/USART | 8 | YES | NO | 8b | YES | 无卤素 | NO | 4 | 8051 | 1.2mm | 7mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
 | XMC4700F144K2048AAXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 119 | 有 | 352K x 8 | 表面贴装 | 144-LQFP Exposed Pad | YES | 144 | A/D 32x12b; D/A 2x12b | -40°C~125°C TA | Tray | 2015 | XMC4000 | yes | 活跃 | 3 (168 Hours) | 144 | 1.4W | QUAD | 鸥翼 | 未说明 | 1.3V | 0.5mm | 144MHz | 未说明 | 3.3V | CAN, Ethernet, I2C, I2S, LIN, SPI, UART, USB | External | 2MB | 3.13V~3.63V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LED, POR, Touch-Sense, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC | 32 | YES | YES | 32b | NO | 无卤素 | ARM | 8 | 117 | 4 | 32 | 150°C | 125°C | 6 | 1 | 1.6mm | 20mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
| TC1766192F80HLBDKXUMA2 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 81 | 有 | 108K x 8 | 表面贴装 | 表面贴装 | 176-LQFP | 176 | A/D 2x10b, 32x12b | -40°C~125°C TA | Tape & Reel (TR) | 2008 | TC17xx | e3 | 不用于新设计 | 3 (168 Hours) | 176 | Tin (Sn) | QUAD | 鸥翼 | 1.5V | 0.5mm | 80MHz | 3.3V | CAN | External | 1.5MB | 1.42V~1.58V | MICROCONTROLLER | TriCore™ | DMA, POR, WDT | FLASH | 32-Bit | 1.5MB 1.5M x 8 | ASC, CANbus, MLI, MSC, SSC | 32 | YES | YES | 32b | NO | 无卤素 | NO | 1 | 24mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| XE167F96F80LACFXUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 118 | 有 | 82K x 8 | 表面贴装 | 表面贴装 | 144-LQFP Exposed Pad | 144 | A/D 24x10b | -40°C~85°C TA | Tape & Reel (TR) | 2001 | XE16x | e3 | yes | 不用于新设计 | 3 (168 Hours) | 144 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | 1W | QUAD | 鸥翼 | 未说明 | 1.5V | 0.5mm | 80MHz | 未说明 | SA*XE167F | 144 | 3.3V | 1.6V | CAN, EBI/EMI, I2C, LIN, SPI, UART, USART | Internal | 768kB | 3V~5.5V | MICROCONTROLLER, RISC | C166SV2 | I2S, POR, PWM, WDT | FLASH | 16-Bit | 768KB 768K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI | 16 | YES | NO | 16b | YES | 无卤素 | NO | 11 | 1.6mm | 20mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
 | XC164CS16F40FBBFXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 79 | 8192 | 131072 | 有 | 8K x 8 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | A/D 14x8/10b | -40°C~85°C TA | Tray | 2001 | XC16x | yes | 不用于新设计 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 2.5V | 40MHz | 未说明 | 5V | 2.7V | CAN, EBI/EMI, SPI, UART, USART | Internal | 128kB | 2.35V~2.7V | MICROCONTROLLER | C166SV2 | PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, SPI, UART/USART | 16 | 40 μs | YES | NO | 16b | YES | NO | 5 | 24 | 8 | 1.6mm | 14mm | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||
 | XMC4800F100K2048AAXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 75 | 有 | 352K x 8 | 表面贴装 | 100-LQFP Exposed Pad | YES | 100 | A/D 24x12b; D/A 2x12b | -40°C~125°C TA | Tray | 1997 | XMC4000 | yes | 活跃 | 3 (168 Hours) | 100 | 1.4W | QUAD | 鸥翼 | 未说明 | 1.3V | 0.5mm | 144MHz | 未说明 | 3.3V | CAN, Ethernet, I2C, I2S, LIN, SPI, UART, USB | External | 2MB | 3.13V~3.63V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LED, POR, Touch-Sense, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC | 32 | YES | YES | 32b | 无卤素 | 6 | ARM | 8 | 4 | 73 | 24 | 150°C | 32 | 125°C | 1 | 1.6mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
| XMC4300F100K256AAXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 73 | 131072 | 262144 | 有 | 128K x 8 | 表面贴装 | 100-LQFP Exposed Pad | YES | A/D 16x12b; D/A 2x12b | -40°C~125°C TA | Tray | 2016 | XMC4000 | yes | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 1.3V | 0.5mm | 未说明 | S-PQFP-G100 | External | 256kB | 3.13V~3.63V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LED, POR, Touch-Sense, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC | 32 | YES | YES | NO | 无卤素 | YES | 8 | 144MHz | 1.6mm | 14mm | 14mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
| XMC4300F100F256AAXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 73 | 有 | 128K x 8 | 表面贴装 | 100-LQFP Exposed Pad | YES | A/D 16x12b; D/A 2x12b | -40°C~85°C TA | Tray | 2016 | XMC4000 | yes | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 未说明 | 1.3V | 0.5mm | 144MHz | 未说明 | CAN, Ethernet, I2C, I2S, LIN, SPI, UART, USB | External | 2.5mA | 256kB | 3.13V~3.63V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LED, POR, Touch-Sense, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC | 32 | YES | YES | 32b | 无卤素 | 12 | 8 | 2 | 14 | 150°C | 16 | 4 | 85°C | 1 | 1.6mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| XC2287M104F80LRABKXUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 118 | 32768 | 851968 | 有 | 50K x 16 | 表面贴装 | 144-LQFP Exposed Pad | YES | A/D 24x10b | -40°C~125°C TA | Tape & Reel (TR) | 2011 | XC22xxM | e4 | 不用于新设计 | 3 (168 Hours) | 144 | 3A991.A.2 | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.5mm | 80MHz | 未说明 | S-PQFP-G144 | 5.5V | 3V | CAN, EBI/EMI, I2C, LIN, SPI, UART, USART | Internal | 832kB | 3V~5.5V | MICROCONTROLLER | C166SV2 | I2S, POR, PWM, WDT | FLASH | 16/32-Bit | 832KB 832K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI | 32 | YES | NO | YES | 无卤素 | NO | 24 | 8 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
 | XC2365B40F80LRABKXUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 76 | 有 | 34K x 8 | 表面贴装 | 100-LQFP Exposed Pad | YES | 100 | A/D 16x10b | -40°C~125°C TA | Tape & Reel (TR) | 2001 | XC23xxB | e4 | 不用于新设计 | 3 (168 Hours) | 100 | 3A991.A.2 | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 80MHz | 未说明 | 1.6V | 1.4V | CAN, EBI/EMI, I2C, LIN, SPI, UART, USART | Internal | 320kB | 3V~5.5V | MICROCONTROLLER, RISC | C166SV2 | I2S, POR, PWM, WDT | FLASH | 16/32-Bit | 320KB 320K x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI | 32 | YES | NO | YES | 无卤素 | NO | 24 | 16 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
.png) | XC167CI32F40FBBAFXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 103 | 有 | 12K x 8 | 表面贴装 | TQFP | 144 | A/D 16x8/10b | -40°C~85°C TA | 2001 | XC16x | yes | 不用于新设计 | 3 (168 Hours) | 未说明 | 40MHz | 未说明 | CAN, EBI/EMI, I2C, SPI, UART, USART | Internal | 256kB | 2.35V~2.7V | MICROCONTROLLER | C166SV2 | PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SPI, UART/USART | 16b | 5 | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XMC4800F144K2048AAXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 119 | 2097152 | 有 | 352K x 8 | 表面贴装 | 144-LQFP Exposed Pad | YES | 144 | A/D 32x12b; D/A 2x12b | -40°C~125°C TA | Tray | 2015 | XMC4000 | yes | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 1.4W | QUAD | 鸥翼 | 未说明 | 1.3V | 0.5mm | 144MHz | 未说明 | 3.3V | CAN, EBI/EMI, Ethernet, I2C, I2S, LIN, MMC, SD, SPI, UART, USART, USB | External | 2MB | 3.13V~3.63V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LED, POR, Touch-Sense, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC | 32 | YES | YES | 32b | NO | 无卤素 | YES | 4 | ARM | 8 | 117 | 1.6mm | 20mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
 | XMC1302T038X0032ABXUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 26 | 有 | 16K x 8 | 表面贴装 | 38-TFSOP (0.173, 4.40mm Width) | 38 | A/D 16x12b | -40°C~105°C TA | Tape & Reel (TR) | 2009 | XMC1000 | yes | 活跃 | 3 (168 Hours) | 未说明 | 32MHz | 未说明 | I2C, I2S, LIN, SPI, UART, USART | Internal | 32kB | 1.8V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, I2S, POR, PWM, WDT | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 32b | 无卤素 | 4 | ARM | 34 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC161CJ16F40FBBFXQMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 99 | 有 | 8K x 8 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | A/D 12x8/10b | -40°C~85°C TA | Tray | 2001 | XC16x | e3 | yes | 不用于新设计 | 3 (168 Hours) | 144 | Tin (Sn) | QUAD | 鸥翼 | 未说明 | 2.5V | 40MHz | 未说明 | 144 | 5V | 2.7V | CAN, EBI/EMI, I2C, SPI, UART, USART | Internal | 128kB | 2.35V~2.7V | MICROCONTROLLER | C166SV2 | PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART | 16 | YES | NO | 16b | YES | NO | 5 | 24 | 1.6mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| XC886CM8FFI5VACFXUMA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 34 | 有 | 1.75K x 8 | 表面贴装 | 表面贴装 | 48-TQFP | 48 | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 1998 | XC8xx | e4 | 不用于新设计 | 3 (168 Hours) | 48 | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | IT ALSO OPERATES IN 3.3V NOMINAL SUPPLY VOLTAGE | QUAD | 鸥翼 | 未说明 | 2.5V | 0.5mm | 24MHz | 未说明 | SA*XC886CM | 5V | 2.7V | CAN, SPI, UART, USART | Internal | 32kB | 4.5V~5.5V | MICROCONTROLLER | XC800 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, SSI, UART/USART | 8 | YES | NO | 8b | YES | 无卤素 | NO | 4 | 8051 | 1.2mm | 7mm | Non-RoHS Compliant | 无铅 |