制造商是'Amphenol'
Amphenol 卡边缘连接器 - 边缘板连接器
(2717)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 引脚数 | 房屋材料 | 材料 - 绝缘 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | ECCN 代码 | 连接器类型 | 定位的数量 | 最高工作温度 | 最小工作温度 | 颜色 | 行数 | 性别 | 附加功能 | HTS代码 | MIL一致性 | 符合 DIN 标准 | IEC一致性 | 过滤功能 | 触点类型 | 混合接触 | 选项 | 螺距 | 触头总数 | 方向 | 深度 | Reach合规守则 | 额定电流 | 导体数量 | 参考标准 | 触点表面处理 | 电压 - 额定交流 | 可靠性 | 本体长度/直径 | PCB行数 | 接头数量 | PCB接触图案 | UL可燃性规范 | 房屋颜色 | 额定电流（信号） | 触点电阻 | 磁卡种类 | 读出 | 绝缘电阻 | 定位/湾/行数 | 法兰特性 | 最大额定电压（交流） | 介电耐压 | PCB 触点行距 | 耐用性 | 触点图案 | 拉坯力 - 最小值 | 特征 | 长度 | 宽度 | 触点表面处理厚度 | 电镀厚度 | 磁卡厚度 | 板厚 | 辐射硬化 | 达到SVHC | RoHS状态 | 可燃性等级 | 无铅 | |
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 | 10076266-101TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | Nylon | Nylon, Glass Filled | Copper Alloy | Tray | 活跃 | 1 (Unlimited) | Solder | 64 | 85°C | -55°C | Black | 2 | Female | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | Black | 30mOhm | PCI Express™ | Dual | 1GOhm | 300V | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||
 | 10128787-004RLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold, Tin | 表面贴装 | Surface Mount, Right Angle | Thermoplastic | Copper Alloy | -40°C~80°C | Tape & Reel (TR) | HPCE® | 活跃 | 1 (Unlimited) | Solder | EAR99 | 板连接器 | 67 | Black | 2 | Female | 8536.69.40.40 | 0.020 0.50mm | 67 | 直角 | ONE | UL | Gold | COMMERCIAL | 2 | STAGGERED | 0.5A | 55mOhm | M.2 (NGFF) Mini Card | Dual | 500000000Ohm | 400VAC V | 60 Cycles | STAGGERED | .973 N | 电路板指南 | 15.0μin 0.38μm | 15μin | 0.031 0.79mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | 10018784-10001TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 64 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 64 | Black | 40mOhm | PCI Express™ | Dual | 1GOhm | 11; 21 | 300V | Board Guide, Locking Ramp | 39mm | 7.4mm | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 无 | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||
 | 10121506-001216BLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | 28 | Thermoplastic | Thermoplastic | Copper Alloy | -55°C~105°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Press-Fit | 28 (16 + 12 Power) | 105°C | -55°C | Black | 2 | Female | Straight | Gold or Gold, GXT™ | Non Specified - Dual Edge | Dual | 6; 8 | 板锁 | 0.062 1.57mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 10018783-00200TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder, Staggered | 36 | 85°C | -55°C | White | 2 | Female | 0.039 1.00mm | Straight | Gold or Gold, GXT™ | Natural | PCI Express™ | Dual | 300V | Board Guide, Locking Ramp | 30.0μin 0.76μm | 0.062 1.57mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
| 10018783-00002MLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder, Staggered | 98 | 85°C | -55°C | White | 2 | Female | 0.039 1.00mm | Straight | Gold or Gold, GXT™ | Natural | PCI Express™ | Dual | 300V | Board Guide, Locking Ramp | 30.0μin 0.76μm | 0.062 1.57mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
| 10018783-00113TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder, Staggered | 164 | 85°C | -55°C | White | 2 | Female | 0.039 1.00mm | Straight | Gold or Gold, GXT™ | Natural | PCI Express™ | Dual | 300V | Board Guide, Locking Ramp | 30.0μin 0.76μm | 0.093 2.36mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 10018784-10212TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder | Cantilever | 98 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 98 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 56mm | 7.4mm | Flash | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||||
| 10018783-10022TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder, Staggered | 98 | 85°C | -55°C | Black | 2 | Female | 0.039 1.00mm | Straight | 1.1A | Gold or Gold, GXT™ | 300V | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | MDT180A03001 | Amphenol ICC (Commercial Products) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Gold | 表面贴装 | Surface Mount, Right Angle | 67 | Liquid Crystal Polymer (LCP) | Copper Alloy | -40°C~80°C | Tape & Reel (TR) | 2014 | M.2 | 活跃 | 1 (Unlimited) | Solder | 67 | 80°C | -40°C | Black | 2 | Female | 0.020 0.50mm | Gold | Dual | Board Lock, Keyed | Flash | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 10018783-11002TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 98 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 98 | Black | 30mOhm | PCI Express™ | Dual | 1GOhm | 300V | Board Lock, Locking Ramp | 56mm | 7.4mm | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||||
 | 10018784-11103TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 164 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 164 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Lock, Locking Ramp | 89mm | 7.4mm | 15.0μin 0.38μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||||
 | 10018784-11003TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 164 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 164 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Lock, Locking Ramp | 89mm | 7.4mm | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||||
 | 10046971-050LF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Gold | 通孔 | 通孔 | Thermoplastic | Copper Alloy | -5°C~105°C | Tray | 功率边缘 | 活跃 | 1 (Unlimited) | Kinked Pin, Solder | Cantilever | 105°C | -5°C | Black | 2 | Female | Cantilever | 0.100 2.54mm | Gold | Non Specified - Dual Edge | Dual | 30.0μin 0.76μm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | 10018783-10003TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 2008 | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | 164 | Black | 2 | Female | Cantilever | 0.039 1.00mm | Gold | 164 | Black | PCI Express™ | Dual | Board Guide, Locking Ramp | 30.0μin 0.76μm | 0.062 1.57mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MDT275A02001 | Amphenol ICC (Commercial Products) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP) | Copper Alloy | -40°C~80°C | Tape & Reel (TR) | 2014 | M.2 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 卡边缘连接器 | 67 | Black | 2 | Female | 8536.69.40.40 | 0.020 0.50mm | 75 | unknown | ONE | UL | Gold | COMMERCIAL | 0.866 inch | 2 | STAGGERED | 0.5A | 55mOhm | Dual | 500000000Ohm | 300VAC V | 7.5438 mm | STAGGERED | Board Lock, Keyed | 15.0μin 0.38μm | 30μin | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| MDT275E02001 | Amphenol ICC (Commercial Products) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | Surface Mount, Right Angle | Liquid Crystal Polymer (LCP) | Copper Alloy | -40°C~80°C | Tape & Reel (TR) | M.2 | 活跃 | 1 (Unlimited) | Solder | EAR99 | 卡边缘连接器 | 67 | Black | 2 | Female | 8536.69.40.40 | 0.020 0.50mm | 75 | unknown | ONE | UL | Gold | COMMERCIAL | 0.866 inch | 2 | STAGGERED | 0.5A | 55mOhm | Dual | 500000000Ohm | 300VAC V | 7.5438 mm | STAGGERED | Board Lock, Keyed | 15.0μin 0.38μm | 30μin | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| 10018783-11200TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 36 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 36 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Lock, Locking Ramp | 25mm | 7.4mm | Flash | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||||
 | 10039755-10102TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 2009 | e3 | 活跃 | 1 (Unlimited) | Solder, Staggered | EAR99 | 卡边缘连接器 | 98 | Black | 2 | Female | 面板安装 | 8536.69.40.40 | NO | NO | NO | NO | Cantilever | NO | GENERAL PURPOSE | 0.039 1.00mm | 98 | Straight | 9mm | 1.1A | ONE | UL | Gold | 300V | COMMERCIAL | 4 | 94V-0 | 30mOhm | PCI Express™ | Dual | 1GOhm | 300V | 400VAC V | 500 Cycles | Board Guide, Locking Ramp | 56mm | 11.25mm | 15.0μin 0.38μm | 15μin | 0.062 1.57mm | 2.36mm | 无 | 符合RoHS标准 | ||||||||||||||||||||
 | 10061913-101TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder | 64 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | Black | 30mOhm | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
| 10018784-11213TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 164 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 164 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Lock, Locking Ramp | 89mm | 7.4mm | Flash | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||||
 | 10018783-10122TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 98 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 98 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 56mm | 7.4mm | 15.0μin 0.38μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||||
 | 10118139-001LF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | GXT, Tin | Edge, Straddle Mount | Board Edge, Straddle Mount | Thermoplastic | Thermoplastic | Copper Alloy | -55°C~105°C | Tray | 2016 | HPCE® | 活跃 | 1 (Unlimited) | Solder | 60 (24 + 36 Power) | 105°C | -55°C | Black | 2 | Female | Straight | Non Specified - Dual Edge | Dual | 18; 12 | Straddle Mount Opening, Unthreaded, 0.154 (3.90mm) | 卡扩展器 | 0.062 1.57mm | 无SVHC | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
| 10128788-001RLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Gold, Tin | 表面贴装 | Surface Mount, Right Angle | Thermoplastic | Copper Alloy | -40°C~80°C | Tape & Reel (TR) | HPCE® | 活跃 | 1 (Unlimited) | Solder | EAR99 | 板连接器 | 67 | Black | 2 | Female | 8536.69.40.40 | 0.020 0.50mm | 直角 | Gold | M.2 (NGFF) Mini Card | Dual | 电路板指南 | Flash | 0.031 0.79mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 10085429-41223TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Gold, Tin | 通孔 | 通孔 | Thermoplastic | Thermoplastic, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder | 164 | 85°C | -55°C | Blue | 2 | Female | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 164 | Blue | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Card Latch, Locking Ramp | 15.0μin 0.38μm | 0.062 1.57mm | 3.1mm | 符合RoHS标准 |