制造商是'Amphenol'
Amphenol 卡边缘连接器 - 边缘板连接器
(2717)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 引脚数 | 房屋材料 | 材料 - 绝缘 | 操作温度 | 包装 | 已出版 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | ECCN 代码 | 连接器类型 | 定位的数量 | 最高工作温度 | 最小工作温度 | 颜色 | 行数 | 性别 | HTS代码 | MIL一致性 | 符合 DIN 标准 | IEC一致性 | 过滤功能 | 触点类型 | 混合接触 | 选项 | 螺距 | 触头总数 | 方向 | 深度 | 额定电流 | 导体数量 | 参考标准 | 触点表面处理 | 电压 - 额定交流 | 可靠性 | 本体长度/直径 | PCB行数 | 螺纹距离 | 接头数量 | PCB接触图案 | 本体宽度 | UL可燃性规范 | 房屋颜色 | 本体深度 | 触点样式 | 触点电阻 | 磁卡种类 | 读出 | 绝缘电阻 | 定位/湾/行数 | 行间距 | 法兰特性 | 主体/外壳样式 | 最大额定电压（交流） | 耐用性 | 触点图案 | 特征 | 长度 | 宽度 | 触点表面处理厚度 | 电镀厚度 | 磁卡厚度 | 板厚 | 辐射硬化 | 达到SVHC | RoHS状态 | 可燃性等级 | 无铅 | ||
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 | 10018783-10103TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | Through Hole, Vertical | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 164 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 2mm | 164 | Black | 30mOhm | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 89mm | 7.4mm | 15.0μin 0.38μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||
 | MDT420B02001 | Amphenol ICC (Commercial Products) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Gold | 表面贴装 | Surface Mount, Right Angle | 67 | Liquid Crystal Polymer (LCP) | Copper Alloy | -40°C~80°C | Tape & Reel (TR) | 2014 | M.2 | 活跃 | 1 (Unlimited) | Solder | 67 | 80°C | -40°C | Black | 2 | Female | 0.020 0.50mm | Gold | Dual | Board Lock, Keyed | 15.0μin 0.38μm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 10018784-11212TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 2015 | HPCE® | 活跃 | 1 (Unlimited) | Solder | Cantilever | 98 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 98 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Lock, Locking Ramp | 56mm | 7.4mm | Flash | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||||
 | 10121510-080024ELF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | GXT, Gold, Tin | 通孔 | Through Hole, Right Angle | 32 | Thermoplastic | Thermoplastic | Copper Alloy | -55°C~105°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder | 32 (24 + 8 Power) | 105°C | -55°C | Black | 2 | Female | 直角 | Gold or Gold, GXT™ | Non Specified - Dual Edge | Dual | 4; 12 | 板锁 | 0.062 1.57mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 10111616-001LF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | 74 | Thermoplastic | Thermoplastic | Copper Alloy | -55°C~105°C | Tray | 活跃 | 1 (Unlimited) | Solder | 74 (22 + 52 Power) | 105°C | -55°C | Black | 2 | Female | 2.54mm | Straight | Gold or Gold, GXT™ | Non Specified - Dual Edge | Dual | 26; 11 | 板锁 | 0.062 1.57mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 10046971-024LF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold, Tin | 通孔 | 通孔 | 46 | Thermoplastic | Thermoplastic | Copper Alloy | -5°C~105°C | Tray | 功率边缘 | 活跃 | 1 (Unlimited) | Solder | Cantilever | 46 (Power) | 105°C | -5°C | Black | 2 | Female | Cantilever | 0.100 2.54mm | Straight | Gold | Non Specified - Dual Edge | Dual | 23 | 30.0μin 0.76μm | 0.062 1.57mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
 | 10046971-004LF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold | 通孔 | 通孔 | Thermoplastic | Thermoplastic | Copper Alloy | -5°C~105°C | Tray | 2016 | 功率边缘 | 活跃 | 1 (Unlimited) | Kinked Pin, Solder | Cantilever | 38 (Power) | 105°C | -5°C | Black | 2 | Female | Cantilever | 0.100 2.54mm | Straight | 7A | Gold | 1kV | 38 | Black | 20mOhm | Non Specified - Dual Edge | Dual | 5GOhm | 19 | 1kV | 30.0μin 0.76μm | 0.062 1.57mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
 | 10025026-10000TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold, Tin | Edge, Straddle Mount | Board Edge, Straddle Mount | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 2016 | 活跃 | 1 (Unlimited) | Solder | Cantilever | 36 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | Black | 30mOhm | PCI Express™ | Dual | 1GOhm | Straddle Mount Opening, Unthreaded, 0.079 (2.00mm) | 300V | Card Extender, Locking Ramp | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
 | 10066356-10120TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Gold, Tin | 通孔 | 通孔 | Nylon | Nylon, Glass Filled | Copper Alloy | Tray | 2015 | 活跃 | 1 (Unlimited) | Solder | 卡边缘连接器 | 280 | 85°C | -55°C | Black | 2 | Female | 0.039 1.00mm | 280 | Straight | 1.1A | ONE | UL | Gold | 300V | COMMERCIAL | 5.866 inch | 4 | STAGGERED | 0.346 inch | 0.433 inch | 黄光型 | 30mOhm | PCI Express™ | Dual | 1GOhm | 30V | 500 Cycles | RECTANGULAR | Board Guide, Locking Ramp | 15.0μin 0.38μm | 15μin | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | 10018784-10011TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 64 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 64 | Black | PCI Express™ | Dual | 1GOhm | 11; 21 | 300V | Board Guide, Locking Ramp | 39mm | 7.4mm | 30.0μin 0.76μm | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||||
 | 10116809-002LF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | GXT, Gold | Edge, Straddle Mount | Board Edge, Straddle Mount | 32 | Thermoplastic | Copper Alloy | -55°C~105°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder | 卡边缘连接器 | 32 (12 + 20 Power) | Black | 2 | Female | NO | NO | NO | NO | YES | GENERAL PURPOSE | 32 | Gold or Gold, GXT™ | 94V-0 | Non Specified - Dual Edge | Dual | Flush Mount, Side Opening, Unthreaded, M3 | RECEPTACLE | 卡扩展器 | 0.062 1.57mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
 | 10018783-10203TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 300V | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 164 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 11.25mm | 1.1A | Gold | 300V | 164 | Black | 30mOhm | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 71.65mm | 8.8mm | Flash | 0.062 1.57mm | 1.56mm | 无SVHC | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||
| 10018783-11103TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 164 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 164 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Lock, Locking Ramp | 89mm | 7.4mm | 15.0μin 0.38μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||||
| 10127976-002LF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | GXT, Gold | 通孔 | 通孔 | 18 | Thermoplastic | Copper Alloy | -40°C~125°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Press-Fit | EAR99 | 板连接器 | 18 (16 + 2 Power) | Black | 2 | Female | 8536.69.40.40 | 2.54mm | Straight | Gold or Gold, GXT™ | Non Specified - Dual Edge | Dual | Board Lock, Guide Pin | 0.062 1.57mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 10025026-10002TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Gold, Tin | Edge, Straddle Mount | Board Edge, Straddle Mount | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder | Cantilever | 98 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 98 | Black | PCI Express™ | Dual | 1GOhm | Straddle Mount Opening, Unthreaded, 0.079 (2.00mm) | 300V | Card Extender, Locking Ramp | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | 10028886-003BLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | Gold | 通孔 | Through Hole, Right Angle | Thermoplastic | Thermoplastic | Copper Alloy | -5°C~105°C | Tray | 2012 | 功率边缘 | 活跃 | 1 (Unlimited) | Solder | 80 (70 Loaded) | 105°C | -5°C | Black | 2 | Female | 直角 | Gold | 70 | Black | Non Specified - Dual Edge | Dual | 14; 12; 14 | 2.54 mm | 1kV | 板锁 | 0.062 1.57mm | 无SVHC | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | 10018784-00100TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder, Staggered | 36 | 85°C | -55°C | White | 2 | Female | 0.039 1.00mm | Straight | Gold or Gold, GXT™ | White | PCI Express™ | Dual | 300V | Board Guide, Locking Ramp | 15.0μin 0.38μm | 0.062 1.57mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 10018784-10010TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 36 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 36 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 25mm | 7.4mm | 30.0μin 0.76μm | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||||
| 10018784-11210TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | HPCE® | 活跃 | 1 (Unlimited) | Solder, Staggered | Cantilever | 36 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 36 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Lock, Locking Ramp | 25mm | 7.4mm | Flash | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | UL94 V-0 | 无铅 | |||||||||||||||||||||||||||||||||||
| 10018783-10010MLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder, Staggered | 36 | 85°C | -55°C | Black | 2 | Female | 0.039 1.00mm | Straight | 1.1A | Gold or Gold, GXT™ | 300V | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 30.0μin 0.76μm | 0.093 2.36mm | 2.36mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | 10018784-10202MLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 2015 | 活跃 | 1 (Unlimited) | Solder, Staggered | 98 | 85°C | -55°C | Black | 2 | Female | 0.039 1.00mm | Straight | 1.1A | Gold or Gold, GXT™ | 300V | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | Flash | 0.062 1.57mm | 1.56mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| 10018783-00101TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder, Staggered | 64 | 85°C | -55°C | White | 2 | Female | 0.039 1.00mm | Straight | Gold or Gold, GXT™ | Natural | PCI Express™ | Dual | 300V | Board Guide, Locking Ramp | 30.0μin 0.76μm | 0.062 1.57mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
| 10018784-00102TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder, Staggered | 98 | 85°C | -55°C | White | 2 | Female | 0.039 1.00mm | Straight | Gold or Gold, GXT™ | White | PCI Express™ | Dual | 300V | Board Guide, Locking Ramp | 15.0μin 0.38μm | 0.062 1.57mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 10018784-10112TLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Gold | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 2015 | HPCE® | 活跃 | 1 (Unlimited) | Solder | Cantilever | 98 | 85°C | -55°C | Black | 2 | Female | Cantilever | 0.039 1.00mm | Straight | 1.1A | Gold | 300V | 98 | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 56mm | 7.4mm | 15.0μin 0.38μm | 0.062 1.57mm | 2.36mm | 符合RoHS标准 | UL94 V-0 | 无铅 | ||||||||||||||||||||||||||||||||||
| 10018783-10033ZLF | Amphenol ICC (FCI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | GXT, Gold, Tin | 通孔 | 通孔 | Nylon | Polyamide (PA), Nylon, Glass Filled | Copper Alloy | -55°C~85°C | Tray | 活跃 | 1 (Unlimited) | Solder, Staggered | 164 | 85°C | -55°C | Black | 2 | Female | 0.039 1.00mm | Straight | 1.1A | Gold or Gold, GXT™ | 300V | Black | PCI Express™ | Dual | 1GOhm | 300V | Board Guide, Locking Ramp | 30.0μin 0.76μm | 0.062 1.57mm | 1.56mm | 符合RoHS标准 |