AMD - Embedded - Microcontrollers - Application Specific - 产品分销商 - 目录 - Embedded - Microcontrollers - Application Specific - 页 4

制造商是'AMD'

AMD 嵌入式 - 微控制器 - 应用特定
(158)

产品型号	品牌	数据表	有效性	单价(CNY)	询价	表面安装	终端数量			厂商																			系列	JESD-609代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	温度等级	端口的数量	uPs/uCs/外围ICs类型	座位高度-最大
XCZU6CG-1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.876 V	0.825 V	0.85 V	900		有		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL		PROGRAMMABLE SoC	2.88 mm		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)		31 mm	31 mm
XCZU6CG-1LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	900		有		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		INDUSTRIAL		PROGRAMMABLE SoC	3.42 mm		CAN, I2C, SPI, UART		31 mm	31 mm
XCZU6CG-1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	784		有		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC	3.32 mm		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)		23 mm	23 mm
XCZU6CG-L1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA78428X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.742 V	0.698 V	0.72 V	784		有		e1		锡银铜	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC	3.32 mm		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)		23 mm	23 mm
XCZU3EG-2LSBVA484I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-484	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	484		有							BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B484		INDUSTRIAL		PROGRAMMABLE SoC	2.61 mm		CAN, I2C, SPI, UART		19 mm	19 mm
XCZU17EG-1LFFVC1760I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1760	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1760,42X42,40	SQUARE	网格排列	0.85 V	1760		有		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1760		INDUSTRIAL		PROGRAMMABLE SoC	3.71 mm		CAN, I2C, SPI, UART		42.5 mm	42.5 mm
AM33C93A-20KC/W	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	活跃			Advanced Micro Devices	Bulk	*
XCZU27DR-2FFVE1156E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	100 °C	PLASTIC/EPOXY	BGA	RECTANGULAR	网格排列	0.876 V	0.825 V	0.85 V	1156		有		e1		锡银铜			BOTTOM	BALL	245		compliant	30		R-PBGA-B1156		OTHER		RFSOC				4
ID82C55A	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	NO	ADVANCED MICRO DEVICES INC	DIP	HERMETIC SEALED, CERAMIC, DIP-40	2.5 MHz	24	70 °C	CERAMIC, METAL-SEALED COFIRED	DIP	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	40		Obsolete			EAR99			8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		40	R-CDIP-T40	不合格	COMMERCIAL	3	PARALLEL IO PORT, GENERAL PURPOSE	5.715 mm	8			52.324 mm	15.24 mm
XCVP1402-2MSEVSVD2197	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1
XCVE2802-2MSEVSVH1760	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1
XCZU7CG-1LFFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	1517		有		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1517		INDUSTRIAL		PROGRAMMABLE SoC	3.51 mm		CAN, I2C, SPI, UART		40 mm	40 mm
XCZU19EG-2LFFVB1517E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517	4	110 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	1517		有		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1517		OTHER		PROGRAMMABLE SoC	3.51 mm		CAN, I2C, SPI, UART		40 mm	40 mm
XCZU3EG-1LSFVA625I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	625		有		e1		锡银铜			BOTTOM	BALL		0.8 mm	compliant			S-PBGA-B625		INDUSTRIAL		PROGRAMMABLE SoC	3.43 mm		CAN, I2C, SPI, UART		21 mm	21 mm
XCZU7EV-2LFFVF1517E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517	4	110 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	1517		有		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1517		OTHER		PROGRAMMABLE SoC	3.51 mm		CAN, I2C, SPI, UART		40 mm	40 mm
XCZU7EV-2LFFVC1156E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1156	4	110 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	1156		有		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		OTHER		PROGRAMMABLE SoC	3.51 mm		CAN, I2C, SPI, UART		35 mm	35 mm
XCZU3CG-1LSFVC784I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	784		有		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		INDUSTRIAL		PROGRAMMABLE SoC	3.32 mm		CAN, I2C, SPI, UART		23 mm	23 mm
XCZU6CG-2SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	BGA-625	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.876 V	0.825 V	0.85 V	625		有		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B625		INDUSTRIAL		PROGRAMMABLE SoC	3.43 mm		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)		21 mm	21 mm
XCZU5EV-3FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	900		有		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B900		INDUSTRIAL		PROGRAMMABLE SoC	2.88 mm				31 mm	31 mm
XCZU9CG-1LFFVC900I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-900	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	900		有		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B900		INDUSTRIAL		PROGRAMMABLE SoC	3.42 mm		CAN, I2C, SPI, UART		31 mm	31 mm
XCZU19EG-2LFFVE1924E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1924	4	110 °C	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	1924		有		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1924		OTHER		PROGRAMMABLE SoC	3.71 mm		CAN, I2C, SPI, UART		45 mm	45 mm
XCZU2EG-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	4	110 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	784		有		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		OTHER		PROGRAMMABLE SoC	3.32 mm		CAN, I2C, SPI, UART		23 mm	23 mm
XCZU11EG-3FFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1517	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	0.9 V	1517		有		e1		锡银铜			BOTTOM	BALL	245	1 mm	compliant	30		S-PBGA-B1517		INDUSTRIAL		PROGRAMMABLE SoC	3.51 mm				40 mm	40 mm
XCZU7EG-1LFFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-1156	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	1156		有		e1		锡银铜			BOTTOM	BALL		1 mm	compliant			S-PBGA-B1156		INDUSTRIAL		PROGRAMMABLE SoC	3.51 mm		CAN, I2C, SPI, UART		35 mm	35 mm
XCZU5EG-2LSFVC784E	AMD	数据表	N/A	-	最小起订量: 1 倍率: 1	YES	活跃	ADVANCED MICRO DEVICES INC	FCBGA-784	4	110 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	784		有		e1		锡银铜			BOTTOM	BALL	250	0.8 mm	compliant	30		S-PBGA-B784		OTHER		PROGRAMMABLE SoC	3.32 mm		CAN, I2C, SPI, UART		23 mm	23 mm

AMD 嵌入式 - 微控制器 - 应用特定