制造商是'ALTERA'
ALTERA 嵌入式 - 片上系统(SoC)
(736)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 包装/外壳 | 表面安装 | 端子形状 | 越来越多的功能 | 供应商器件包装 | 介电材料 | 终端数量 | 操作温度 | 包装 | 系列 | JESD-609代码 | 零件状态 | 温度系数 | 电阻 | 端子表面处理 | HTS代码 | 电容量 | 子类别 | 包装方式 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电容式 | 工作电源电压 | 极性 | 温度特性代码 | 多层 | 电源 | 温度等级 | 尺寸代码 | 速度 | 二极管类型 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 正容差 | 负公差 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | Rep Pk反向电压-最大值 | 收发器数量 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 核数量 | 最大箝位电压 | 闪光大小 | 产品类别 | 高度 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||||
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![]() | 10AS066N2F40I2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA, FCBGA | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 21 | SMD/SMT | 82500 LAB | 965031 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066N2F40I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | SoC FPGA | YES | 1517-FCBGA (40x40) | 1517 | 588 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 588 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | 现场可编程门阵列 | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||
![]() | 10AS048E2F29I1HG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | 有 | 2 x 32 kB | 1.2 GHz | 480000 LE | + 100 C | - 40 C | 1 | SMD/SMT | 60000 LAB | 965033 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 10AS048E2F29I1HG | 活跃 | INTEL CORP | 5.68 | SoC FPGA | 780-FBGA (29x29) | 360 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 12 Transceiver | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K4F35I3LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 24 | SMD/SMT | 82500 LAB | 965078 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | SoC FPGA | 1152-FBGA (35x35) | 396 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXBB5D4F31C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-BBGA, FCBGA | FBGA-896 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXBB5D4F31C6N | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.13 V | 5.28 | YES | 896-FBGA (31x31) | 896 | MCU - 208, FPGA - 250 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXBB5 | S-PBGA-B896 | 250 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXFB5G4F35I3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 1.15 V | 未说明 | 1.12 V | 100 °C | 有 | 5ASXFB5G4F35I3N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.18 V | 5.28 | YES | 1152-FBGA (35x35) | 1152 | MCU - 208, FPGA - 385 | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXFB5 | S-PBGA-B1152 | 540 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXMB5G4F40C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA, FCBGA | FBGA-1517 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXMB5G4F40C6N | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.13 V | 5.28 | YES | 1517-FBGA (40x40) | 1517 | MCU - 208, FPGA - 540 | 0°C ~ 85°C (TJ) | Tray | SWT | e1 | Obsolete | 5000 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXMB5 | S-PBGA-B1517 | 540 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXFB5G4F35I5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | MCU - 208, FPGA - 385 | FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 1.1 V | 未说明 | 1.07 V | 100 °C | 有 | 5ASXFB5G4F35I5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | YES | 1152-FBGA (35x35) | 1152 | 67.8 | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXFB5 | S-PBGA-B1152 | 385 | 不合格 | BIDIRECTIONAL | 1.1,1.2/3.3,2.5 V | INDUSTRIAL | 800MHz | 跨压抑制二极管 | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | 58 | FPGA - 462K Logic Elements | 17434 | 462000 | 93.6 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXBB3D4F35C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXBB3D4F35C6N | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.13 V | 5.28 | YES | 1152-FBGA (35x35) | 1152 | MCU - 208, FPGA - 385 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1152 | 385 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXBB3D4F40C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA, FCBGA | FBGA-1517 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXBB3D4F40C6N | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 1.13 V | 5.27 | YES | 1517-FBGA (40x40) | 1517 | MCU - 208, FPGA - 540 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1517 | 540 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXFB3H4F40C5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA, FCBGA | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXFB3H4F40C5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | YES | 1517-FBGA (40x40) | 1517 | MCU - 208, FPGA - 540 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXFB3 | S-PBGA-B1517 | 540 | 商业扩展 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXBB5D6F31C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-BBGA, FCBGA | FBGA-896 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 1.07 V | 85 °C | 5ASXBB5D6F31C6N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | YES | 896-FBGA (31x31) | 896 | MCU - 208, FPGA - 250 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | 活跃 | BOTTOM | BALL | 1 mm | compliant | 5ASXBB5 | S-PBGA-B896 | 250 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXFB3G4F35I3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 1.15 V | 未说明 | 1.12 V | 100 °C | 有 | 5ASXFB3G4F35I3N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.18 V | 5.28 | YES | 1152-FBGA (35x35) | 1152 | MCU - 208, FPGA - 385 | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXFB3 | S-PBGA-B1152 | 540 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXFB5H4F40I3NES | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | MCU - 208, FPGA - 540 | -40°C ~ 100°C (TJ) | Tray | Arria V SX | Obsolete | 5ASXFB5 | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXBB5D4F40C4N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA | INTEL CORP | MCU - 208, FPGA - 540 | FBGA-1517 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXBB5D4F40C4N | BGA | SQUARE | 生命周期结束 | 1.13 V | 5.28 | YES | 1517-FBGA (40x40) | 1517 | Intel Corporation | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXBB5 | S-PBGA-B1517 | 540 | 商业扩展 | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXMB5E6F31C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-BBGA, FCBGA | BGA, BGA896,30X30,40 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 1.07 V | 85 °C | 5ASXMB5E6F31C6N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | YES | 896-FBGA (31x31) | 896 | MCU - 208, FPGA - 250 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | 活跃 | BOTTOM | BALL | 1 mm | compliant | 5ASXMB5 | S-PBGA-B896 | 540 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXMB3E4F31I5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-BBGA, FCBGA | FBGA-896 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | -40 °C | 1.1 V | 未说明 | 1.07 V | 100 °C | 有 | 5ASXMB3E4F31I5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | YES | 896-FBGA (31x31) | 896 | MCU - 208, FPGA - 250 | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXMB3 | S-PBGA-B896 | 250 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA6U23A7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 672-FBGA | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | -40 °C | 1.1 V | 未说明 | 1.07 V | 125 °C | 有 | 5CSEBA6U23A7N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.57 | YES | 672-UBGA (23x23) | 672 | MCU - 181, FPGA - 145 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSEBA6 | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | AUTOMOTIVE | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXMB3E4F31C4N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-BBGA, FCBGA | BGA, BGA896,30X30,40 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXMB3E4F31C4N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | YES | 896-FBGA (31x31) | 896 | MCU - 208, FPGA - 250 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXMB3 | S-PBGA-B896 | 540 | 商业扩展 | 925MHz | 跨压抑制二极管 | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXMB3G4F40C5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA, FCBGA | FBGA-1517 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXMB3G4F40C5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | YES | 1517-FBGA (40x40) | 1517 | MCU - 208, FPGA - 540 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXMB3 | S-PBGA-B1517 | 540 | 商业扩展 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXBB3D6F31C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-BBGA, FCBGA | FBGA-896 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 1.07 V | 85 °C | 5ASXBB3D6F31C6N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | YES | 896-FBGA (31x31) | 896 | MCU - 208, FPGA - 250 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | 活跃 | BOTTOM | BALL | 1 mm | compliant | 5ASXBB3 | S-PBGA-B896 | 250 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA5F31A7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-BGA | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | -40 °C | 1.1 V | 未说明 | 1.07 V | 125 °C | 有 | 5CSEMA5F31A7N | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.55 | YES | 896-FBGA (31x31) | 896 | MCU - 181, FPGA - 288 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | e1 | 活跃 | 锡银铜 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5CSEMA5 | S-PBGA-B896 | 288 | 不合格 | 1.1,1.2/3.3,2.5 V | AUTOMOTIVE | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA5U23I7LN | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -55 | 125 | 矩形包装 | 5CSEBA5U23I7LN | Intel Corporation | 活跃 | INTEL CORP | 5.81 | WRAPAROUND | SURFACE MOUNT | CERAMIC | 2 | SMT | Tray | * | e3 | 活跃 | 15% | 镍镀锡 | 0.056uF | TR, PAPER, 7 INCH | compliant | 陶瓷电容器 | X7R | 有 | 0603 | 10 | 10 | 现场可编程门阵列 | 0.8 | 1.6 | 0.8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA6F31C7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 896-BGA | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSEMA6F31C7N | BGA | SQUARE | Intel Corporation | 活跃 | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | INTEL CORP | 1.13 V | 2.03 | YES | 896-FBGA (31x31) | 896 | MCU - 181, FPGA - 288 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5CSEMA6 | S-PBGA-B896 | 288 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA6U19C7SN | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 484-FBGA | FBGA, BGA484,22X22,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA484,22X22,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSEBA6U19C7SN | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.57 | YES | 484-UBGA (19x19) | 484 | MCU - 151, FPGA - 66 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSEBA6 | S-PBGA-B484 | 66 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | 现场可编程门阵列 | FPGA - 110K Logic Elements | 110000 | -- | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA4U23A7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 40K Logic Elements | -- |