类别是'嵌入式 - 微控制器,微处理器,FPGA 模块'
嵌入式 - 微控制器,微处理器,FPGA 模块 (3348)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 材料 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 连接器类型 | 子类别 | 速度 | 内存大小 | 配件类型 | 核心处理器 | 产品类别 | 模块/板式 | 闪光大小 | 协处理器 | 产品类别 | ||||||
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![]() | TE0712-02-72C03-M | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | Trenz Electronic GmbH | Bulk | 0°C ~ 85°C | TE0712 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | 萨姆泰克 LSHM | 200MHz | 1GB | - | FPGA核心 | 32MB | - | ||||||||||
![]() | TE0820-05-S002C1 | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Trenz Electronic GmbH | Bulk | - | |||||||||||||||||||
![]() | M100PFS-250BAAB | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 嵌入式ARIES | Box | 0°C ~ 70°C | PolarFire™ | 2.910 L x 1.650 W (74.00mm x 42.00mm) | Board-to-Board (BTB) Socket | - | 2.5GB | MPFS250T | FPGA | 4GB | - | ||||||||||
![]() | MCV-X2DB | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 嵌入式ARIES | Box | 0°C ~ 70°C | - | 2.910 L x 1.650 W (74.00mm x 42.00mm) | 360 Pin | 800MHz | 1GB | ARM Cortex-A9 (Dual Core) | FPGA | 4GB | - | ||||||||||
![]() | MX10-S16 | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 嵌入式ARIES | Box | 0°C ~ 70°C | - | 2.760 L x 1.380 W (70.00mm x 35.00mm) | 100 Pin | 25MHz | 128MB | - | FPGA | - | - | ||||||||||
![]() | MCV-2DB | Aries Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 嵌入式ARIES | Box | 0°C ~ 70°C | - | 2.910 L x 1.650 W (74.00mm x 42.00mm) | 360 Pin | 600MHz | 1GB | ARM Cortex-A9 (Dual Core) | FPGA | 4GB | - | ||||||||||
![]() | TE0820-05-4AE21MA | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Trenz Electronic GmbH | Bulk | 0°C ~ 85°C | TE0820 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | Pin(s) | - | 2GB | ARM® Cortex®-A53, ARM® Cortex®-R5 | MPU核心 | 128MB | Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E | ||||||||||
![]() | TE0820-05-3AE21MA | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Trenz Electronic GmbH | Bulk | 0°C ~ 85°C | TE0820 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | Pin(s) | - | 2GB | ARM® Cortex®-A53, ARM® Cortex®-R5 | MPU核心 | 128MB | Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E | ||||||||||
![]() | CYCLONE 10 GX | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Intel | Bulk | - | |||||||||||||||||||
![]() | TE0820-05-4AI21MI | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Trenz Electronic GmbH | Bulk | - | TE0820 | - | - | - | 2GB | - | MPU核心 | 128MB | - | ||||||||||
![]() | TE0823-01-3PIU1FA | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Trenz Electronic | Trenz Electronic | Bulk | Obsolete | System-On-Modules - SOM | Trenz Electronic GmbH | 1 | -40°C ~ 85°C | TE0823 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | USB | Computing | - | 1GB | ARM Cortex-A53, ARM® Cortex®-R5 | MCU, FPGA | 128MB | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | System-On-Modules - SOM | ||||
![]() | TE0808-05-BBE21-AZ | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Trenz Electronic GmbH | Box | 0°C ~ 85°C | - | 2.050 L x 2.990 W (52.00mm x 76.00mm) | Board-to-Board (BTB) Socket | - | 2GB | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E | FPGA核心 | 128MB | - | ||||||||||
![]() | 201-010562 | Acme Electric | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ALLOY STEEL | ||||||||||||||||||||||
![]() | 201-010520 | Acme Electric | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ALLOY STEEL | ||||||||||||||||||||||
![]() | 201-010488 | Acme Electric | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ALLOY STEEL | ||||||||||||||||||||||
![]() | MAX 10 FPGA | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Intel | Bulk | - | |||||||||||||||||||
![]() | 1011055 | Samsung | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||
![]() | 1011051 | Samsung | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||
![]() | TE0820-05-2AI21MA | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Trenz Electronic GmbH | Bulk | -40°C ~ 85°C | TE0820 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | Pin(s) | - | 2GB | ARM® Cortex®-A53, ARM® Cortex®-R5 | MPU核心 | 128MB | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I | ||||||||||
![]() | TE0820-05-3BE21MA | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | Trenz Electronic GmbH | Bulk | 0°C ~ 85°C | TE0820 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | Pin(s) | - | 2GB | ARM® Cortex®-A53, ARM® Cortex®-R5 | MPU核心 | 128MB | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | ||||||||||
![]() | 20-109-0199 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | Digi | Bulk | -20°C ~ 85°C | - | 5.750 L x 3.780 W (146.00mm x 96.00mm) | RJ-45 | 58.98MHz | 512KB | Rabbit 4000 | MPU核心 | 1MB | - | ||||||||||
![]() | 20-101-1142 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | Digi | Bulk | -20°C ~ 85°C | - | 1.850 L x 2.840 W (47.00mm x 72.00mm) | Header | 58.98MHz | 512KB | Rabbit 4000 | MPU核心 | 4MB | - | ||||||||||
![]() | TE0745-02-92I11-F | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | Trenz Electronic GmbH | Bulk | -40°C ~ 85°C | TE0745 | 2.050 L x 2.990 W (52.00mm x 76.00mm) | Board-to-Board (BTB) Socket - 480 | - | 1GB | ARM Cortex-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7045) | ||||||||||
![]() | TE0823-01-3PIU1F | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | Trenz Electronic GmbH | Bulk | -40°C ~ 85°C | TE0823 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | USB | - | 1GB | ARM Cortex-A53, ARM® Cortex®-R5 | MCU, FPGA | 128MB | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | ||||||||||
![]() | 1010-518 | Megger | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MVC1010 | Current Clamp |