类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 电路数量 | 最小电源电压 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 电源电流-最大值 | 电流源 | 逻辑功能 | 数据率 | 增益带宽积 | 差分输出 | 输入特性 | 最高频率 | 接口IC类型 | 驱动程序位数 | 通信IC类型 | 消费者集成电路类型 | 负供电电压 | 最大电源电压（DC） | 电源电压1-额定值 | 最小电源电压(DC) | 过滤器 | 压缩法 | 线性编码 | 混合动力车 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||
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 | MT88E39AS1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | 665.986997mg | -40°C~85°C | Tube | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 16 | 哑光锡 | 2.7V~5.5V | DUAL | 鸥翼 | 260 | 3V | 3.58MHz | 30 | Telecom Circuit | 3-Wire | 1 | 1.9mA | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL38004QCG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | -40°C~85°C | Tray | 2001 | e3 | 活跃 | 3 (168 Hours) | 100 | 哑光锡 | QUAD | 鸥翼 | 1.2V | 0.5mm | 语音处理器 | I2S, SPI, UART | 2 | ADPCM 编解码器 | YES | 1.6mm | 14mm | 14mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3018-F-FSR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | 16 | 0°C~70°C | Tape & Reel (TR) | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 16 | 3V~3.6V | DUAL | 鸥翼 | SI3018 | Direct Access Arrangement (DAA) | 3.3V | 3.6V | 3V | 15 | Parallel, SPI, UART | 1 | 8.5mA | 8.5mA | 8.192MHz | 消费电路 | 9.9mm | 3.9mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL38003GMG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 81-LBGA | 81 | -40°C~85°C | Tray | e1 | yes | 活跃 | 3 (168 Hours) | 81 | 锡银铜 | BOTTOM | BALL | 回声消除 | Serial | 1 | 电信电路 | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT9076BB1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 80-LQFP | 80 | 639.990485mg | -40°C~85°C | Tray | e3 | 活跃 | 3 (168 Hours) | 80 | 哑光锡 | 3V~3.6V | QUAD | 鸥翼 | 260 | 3.3V | 0.65mm | 30 | 收发器 | 3.3V | 1 | 85mA | 98mA | 8.192 Mbps | FRAMER | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE58QL021FJCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 2.386605g | Industrial grade | -40°C~85°C | Tape & Reel (TR) | e3 | 活跃 | 3 (168 Hours) | 44 | 哑光锡 | IT ALSO OPERATES WITH 3.3V ANALOG SUPPLY VOLTAGE | QUAD | J BEND | 3.3V | 1.27mm | Subscriber Line Interface Concept (SLIC) | 不合格 | 3.3V | PCM | 4 | SYNCHRONOUS | YES | A/MU-LAW | 16-BIT | 16.5862mm | 16.5862mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE9530CETC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | -40°C | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | YES | 48-eTQFP | 85°C | Tray | 2011 | 活跃 | 3 (168 Hours) | 48 | 3.3V | QUAD | 鸥翼 | 3.3V | 0.5mm | S-PQFP-G48 | Subscriber Line Interface Concept (SLIC) | INDUSTRIAL | Parallel | 2 | 40mA | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8514XMK-03 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | QFN | 138-QFN (12x12) | -40°C~110°C | Tray | 2017 | 活跃 | 4 (72 Hours) | 125°C | -40°C | 2.5V | 信号调节器 | 2 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LMC567CM | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | -25°C~100°C | Tube | LMCMOS™ | e0 | no | Obsolete | 1 (Unlimited) | 8 | Tin/Lead (Sn/Pb) | 500mW | 2V~9V | DUAL | 鸥翼 | 235 | 5V | LMC567 | 音频解码器 | 1 | 800μA | Decoder | 4.9mm | 3.9mm | 无 | 无SVHC | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI3019-F-FS | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | YES | 16 | 189.318115mg | 0°C~70°C | Tube | 1999 | yes | 活跃 | 3 (168 Hours) | 16 | Integrated Circuit (IC) | 3V~3.6V | DUAL | 鸥翼 | SI3019 | Direct Access Arrangement (DAA) | 3.3V | 3.6V | 3V | GCI, PCM, SPI | 1 | 8.5mA | 8.5mA | 8.192MHz | 9.9mm | 3.9mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL50012QCG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 160-LQFP | 160 | -40°C~85°C | Tray | e3 | 活跃 | 3 (168 Hours) | 160 | 哑光锡 | 3V~3.6V | QUAD | 鸥翼 | 3.3V | 0.5mm | ZL50012 | Switch | 3.3V | 1 | 250mA | 16 | 24mm | 24mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3050-E1-FT | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | 0°C~70°C | Tube | 1999 | 活跃 | 3 (168 Hours) | 20 | Integrated Circuit (IC) | 3V~3.6V | DUAL | 鸥翼 | 0.65mm | SI3050 | Direct Access Arrangement (DAA) | 3.3V | 3.6V | 3V | GCI, PCM, SPI | 1 | 8.5mA | 8.5mA | 8.192MHz | 6.5mm | 4.4mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC7111XJW | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | -40°C | 表面贴装 | 32-TFQFN Exposed Pad | YES | 32 | 85°C | Tray | 2012 | 活跃 | 3 (168 Hours) | 32 | QUAD | 无铅 | 2.5V | 0.5mm | 信号调节器 | 不合格 | 2.5V | INDUSTRIAL | 2 | 11.5 Gbps | 电信电路 | 0.9mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8572XKS-04 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | 256-PBGA (17x17) | Tray | Obsolete | 1 (Unlimited) | 1V 2.5V | Ethernet | RMII | 2 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8662XIC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-BGA | YES | 90°C | Tray | 2011 | 活跃 | 3 (168 Hours) | 256 | BOTTOM | BALL | 1.2V | S-PBGA-B256 | Ethernet | OTHER | 1 | 2mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE57D121BTC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 44-TQFP Exposed Pad | Industrial grade | -40°C~85°C | Tray | e3 | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | 4.75V~5.25V | QUAD | 鸥翼 | 5V | 0.8mm | S-PQFP-G44 | Subscriber Line Interface Concept (SLIC) | 不合格 | 5V | 2-Wire | 2 | 9.3mA | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | THS6212IRHFR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 35 Weeks | ACTIVE (Last Updated: 5 days ago) | 表面贴装 | 24-VFQFN Exposed Pad | YES | 24 | GENERAL PURPOSE | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 2 (1 Year) | 24 | Nickel/Palladium/Gold (Ni/Pd/Au) | 10V~28V | QUAD | 无铅 | 260 | 6V | 未说明 | THS6212 | Amplifier | 1 | 21mA | 150MHz | NO | DIFFERENTIAL | LINE DRIVER | 2 | -6V | 6V | 1mm | 5mm | 4mm | 900μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL50012GDG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 144-LBGA | 144 | -40°C~85°C | Tray | 2006 | e1 | 活跃 | 3 (168 Hours) | 144 | 锡银铜 | 3V~3.6V | BOTTOM | BALL | 3.3V | ZL50012 | Switch | 3.3V | 1 | 250mA | 16 | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC7440XMT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-BGA | 324-BGA (19x19) | Tray | SparX™-IV-34 | 活跃 | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ZL88601LDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 64 | 3.135V~3.465V | QUAD | 3.3V | 0.5mm | S-XQCC-N64 | Telecom Circuit | 3.3V | PCM | 1 | 3.465V | 3.135V | 2-4 CONVERSION | 9mm | 9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE58QL061BVC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 44-TQFP | 44 | 44-TQFP (10x10) | -40°C~85°C | Tray | 2007 | 活跃 | 3 (168 Hours) | 85°C | -40°C | 3.3V | Subscriber Line Interface Concept (SLIC) | 3.3V | PCM | 4 | 3.135V | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8502XML | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | QFN | 135-QFN (12x12) | Commercial grade | Tray | 活跃 | 4 (72 Hours) | 125°C | 0°C | 3.3V | Ethernet | Ethernet | 1 | 1 Gbps | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MT8870DN1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | 453.59237mg | -40°C~85°C | Tube | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 500mW | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 3.58MHz | 30 | DTMF接收器 | 5V | 5V | 1 | 3mA | 9mA | Receiver | DTMF信号电路 | 2mm | 7.2mm | 5.3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | LE89810BSCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | SOIC | 16-SOIC | 665.986997mg | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 2 | PCM | 1 | 电信电路 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE9642PQC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 48-VFQFN Exposed Pad | YES | Industrial grade | -40°C~85°C | Tray | miSLIC™ | 活跃 | 3 (168 Hours) | 48 | 3.135V~3.465V | QUAD | 无铅 | 3.3V | 0.5mm | unknown | S-XQCC-N48 | Subscriber Line Interface Concept (SLIC) | 4-Wire | 2 | 25mA | 1mm | 7mm | 7mm | ROHS3 Compliant |