类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 电路数量 | 最小电源电压 | 工作电源电流 | 电源电流 | 电流源 | 逻辑功能 | 压摆率 | 数据率 | 输入失调电压(Vos) | 增益带宽积 | 最高频率 | 通信IC类型 | 收发器数量 | 输入行数 | 消费者集成电路类型 | 最大I/O电压 | 电池供电 | PSRR-Min | 混合动力车 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MT8870DNR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | -40°C~85°C | Tape & Reel (TR) | 2006 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 3.58MHz | 30 | DTMF接收器 | 5V | 5V | 1 | 3mA | 3mA | Receiver | DTMF信号电路 | 2mm | 7.2mm | 5.3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | SI3210M-FTR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 38-TFSOP (0.173, 4.40mm Width) | 38 | 0°C~70°C | Tape & Reel (TR) | 1998 | ProSLIC® | yes | 不用于新设计 | 3 (168 Hours) | 38 | 700mW | 3.3V 5V | DUAL | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SI3210 | Subscriber Line Interface Concept (SLIC), CODEC | 3.3/5V | PCM, SPI | 1 | 88mA | CONSTANT CURRENT | 40 dB | 9.7mm | 4.4mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
 | SI32261-C-FM2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 60-WFQFN Exposed Pad | 0°C~70°C | Tape & Reel (TR) | 2000 | ProSLIC® | yes | 活跃 | 3 (168 Hours) | 3.13V~3.47V | Subscriber Line Interface Concept (SLIC), CODEC | GCI, PCM, SPI | 1 | 数码单反 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE792388TVC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | LQFP | 176-LQFP | Tray | 2011 | yes | 活跃 | 3 (168 Hours) | 2-Wire | 1 | PCM 编解码器 | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE57D122BTC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 44-TQFP Exposed Pad | Industrial grade | -40°C~85°C | Tray | e3 | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | 4.75V~5.25V | QUAD | 鸥翼 | 5V | 0.8mm | S-PQFP-G44 | Subscriber Line Interface Concept (SLIC) | 不合格 | 5V | 2-Wire | 2 | 9.3mA | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8564XKS-11 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 256-BGA | 256-PBGA (17x17) | Tray | 活跃 | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3208-B-FMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 40-VFQFN Exposed Pad | 70°C | Tape & Reel (TR) | 1998 | ProSLIC® | Obsolete | 3 (168 Hours) | 40 | QUAD | 260 | 3.3V | 0.5mm | 40 | SI3208 | S-XQCC-N40 | Subscriber Line Interface Concept (SLIC), CODEC | 3.3V | COMMERCIAL | GCI, PCM, SPI | 2 | 1mm | 6mm | 6mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | VSC8522XJQ-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 302-TQFP | 302-TQFP (24x24) | 0°C~125°C | Tray | 活跃 | 4 (72 Hours) | 125°C | 0°C | Ethernet | Ethernet | 1 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LE9652PQCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 48-VFQFN Exposed Pad | YES | Industrial grade | -40°C~85°C | Tape & Reel (TR) | 2014 | miSLIC™ | 活跃 | 3 (168 Hours) | 48 | 3.135V~3.465V | QUAD | 无铅 | 3.3V | 0.5mm | unknown | S-XQCC-N48 | Subscriber Line Interface Concept (SLIC) | 4-Wire | 2 | 25mA | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | THS6226IRHBT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 32-VFQFN Exposed Pad | YES | 32 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 32 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | CLASS AB MODE SUPPLY 10 TO 15V | 10.2mW | 10V~12.5V | QUAD | 260 | THS6226 | VDSL2 Line Driver Amplifier | 12V | 10V | Serial | 2 | 23.5mA | 23mA | 1500 V/μs | 6mV | 125MHz | 消费电路 | 6mV | 1mm | 5mm | 5mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
 | VSC7464YIH-02 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tray | LynX™-2 | 活跃 | 4 (72 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3201-FS | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) Exposed Pad | 16 | 189.233067mg | 0°C~70°C | Tube | 1998 | ProSLIC® | Obsolete | 1 (Unlimited) | 16 | 800mW | 3.13V~5.25V | DUAL | 鸥翼 | 3.3V | SI3201 | Subscriber Line Interface Concept (SLIC), CODEC | 5V | PCM, Serial, SPI | 1 | 88mA | 1 | CONSTANT CURRENT | 40 dB | 1.5mm | 10mm | 4mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
.png) | LE88111BLC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-LQFP | 44 | 356.09836mg | Tray | Obsolete | 3 (168 Hours) | 3V 5V | Telecom Circuit | 5V | PCM | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI32176-C-FM1R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 42-WFQFN Exposed Pad | 0°C~70°C | Tape & Reel (TR) | 2000 | ProSLIC® | 活跃 | 3 (168 Hours) | Subscriber Line Interface Concept (SLIC), CODEC | 3.3V | GCI, PCM, SPI | 1 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3210-E-FM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 38-VFQFN Exposed Pad | 38 | 100.952652mg | 0°C~70°C | Tray | 1997 | ProSLIC® | yes | 不用于新设计 | 1 (Unlimited) | 38 | 700mW | 3.3V 5V | QUAD | 260 | 3.3V | 0.5mm | 40 | SI3210 | Subscriber Line Interface Concept (SLIC), CODEC | 5V | PCM, SPI | 1 | 88mA | 0.95mm | 7mm | 5mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||
 | LE88231DLC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 80-LQFP | Tray | 2005 | 活跃 | 3 (168 Hours) | Telecom Circuit | PCM | 2 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYP15G0403DXB-BGXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 256-LBGA Exposed Pad | 256 | 0°C~70°C | Tray | 2003 | HOTlink II™ | e1 | yes | 活跃 | 3 (168 Hours) | 256 | 5A991.B.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 3.135V~3.465V | BOTTOM | BALL | 260 | 3.3V | 1.27mm | 30 | CY*15G04 | 收发器 | 3.3V | LVTTL | 4 | 1.27A | 900mA | 1500000 Mbps | 4 | 27mm | 27mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
| SI3210-GT | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 38-TFSOP (0.173, 4.40mm Width) | 38 | 140.160042mg | -40°C~85°C | Tube | 1998 | ProSLIC® | yes | 不用于新设计 | 3 (168 Hours) | 38 | 700mW | 3.3V 5V | DUAL | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SI3210 | Subscriber Line Interface Concept (SLIC), CODEC | 5V | PCM, SPI | 1 | 88mA | CONSTANT CURRENT | 40 dB | 9.7mm | 4.4mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | LE79R79-3DJC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | 32-PLCC (11.43x13.97) | Industrial grade | 0°C~70°C | Tube | 1993 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 4.75V~5.25V | Subscriber Line Interface Concept (SLIC) | 5V | 2-Wire | 1 | 4.75V | 6.5mA | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI3201-FSR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) Exposed Pad | 16 | 0°C~70°C | Tape & Reel (TR) | 1998 | ProSLIC® | Obsolete | 3 (168 Hours) | 16 | 800mW | 3.13V~5.25V | DUAL | 鸥翼 | 3.3V | SI3201 | Subscriber Line Interface Concept (SLIC), CODEC | 3.3/5V | PCM, Serial, SPI | 1 | 88mA | CONSTANT CURRENT | 40 dB | 9.9mm | 3.9mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
 | LE79R70-1DJCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 32-LCC (J-Lead) | 32 | Commercial grade | 0°C~70°C | Tape & Reel (TR) | e3 | 活跃 | 3 (168 Hours) | 32 | 哑光锡 | 4.75V~5.25V | QUAD | J BEND | 5V | Subscriber Line Interface Concept (SLIC) | 不合格 | 5V | 5V | 2-Wire | 1 | 6.5mA | CONSTANT CURRENT | 30 dB | 2-4 CONVERSION | 3.556mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| VSC8504XKS-04 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | LIMITED TIME BUY (Last Updated: 1 month ago) | 表面贴装 | 256-BGA | YES | 256 | -40°C | Tray | 2011 | Obsolete | 4 (72 Hours) | 256 | 1V | BOTTOM | BALL | 1V | Ethernet | AUTOMOTIVE | 1 | 4 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| VSC8564XKS-14 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 256-BGA | 256-PBGA (17x17) | Tray | 活跃 | 4 (72 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI3210M-FT | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 38-TFSOP (0.173, 4.40mm Width) | 38 | 140.160042mg | 0°C~70°C | Tube | 1998 | ProSLIC® | e3 | yes | 不用于新设计 | 3 (168 Hours) | 38 | TIN | 700mW | 3.3V 5V | DUAL | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SI3210 | Subscriber Line Interface Concept (SLIC), CODEC | 5V | PCM, SPI | 1 | 88mA | 88mA | 8.192MHz | CONSTANT CURRENT | 40 dB | 9.7mm | 4.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
| LE88241DLCT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 80-LQFP | 80 | Tape & Reel (TR) | 1993 | 活跃 | 3 (168 Hours) | Telecom Circuit | PCM | 2 | ROHS3 Compliant |