类别是'存储器 - 模块'
存储器 - 模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 反向引脚排列 | 长度 | 宽度 | ||||||||||||||||||
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MX25U3232FZNI02/TRAY | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
W25X16VDAIZ | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | WINBOND ELECTRONICS CORP | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | 50 MHz | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | 3 V | NO | 8 | 有 | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | unknown | 未说明 | 8 | R-PDIP-T8 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.018 mA | 2MX8 | 3-STATE | 5.33 mm | 8 | 0.00001 A | 16777216 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 9.27 mm | 7.62 mm | |||||||||||||||||||||
S29PL064J60BFI12 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | SPANSION INC | BGA | 8.15 X 6.15 MM, FBGA-48 | 60 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 V | YES | 48 | 有 | e1 | 有 | EAR99 | NOR型号 | 锡银铜 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 4MX16 | 1 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,126 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | |||||||||||||
S29PL064J60BFI12 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | CYPRESS SEMICONDUCTOR CORP | 8.15 X 6.15 MM, FBGA-48 | 60 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 V | YES | 48 | 有 | e1 | EAR99 | NOR型号 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 40 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 4MX16 | 1 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,126 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | ||||||||||||||||
MX52LM04A11XUI | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | MACRONIX INTERNATIONAL CO LTD | TFBGA, BGA153,14X14,20 | 200 MHz | 4294967296 words | 4000000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA153,14X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3.3 V | YES | 153 | 有 | EAR99 | MLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.5 mm | unknown | R-PBGA-B153 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.045 mA | 4GX8 | OPEN-DRAIN | 0.8 mm | 8 | 34359738368 bit | PARALLEL | 闪存卡 | 3.3 V | NO | NO | YES | 11 mm | 10 mm | ||||||||||||||||||||||||||||
W25X64BVZEIG | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | WINBOND ELECTRONICS CORP | SON | 8 X 6 MM, GREEN, WSON-8 | 80 MHz | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | YES | 8 | 有 | EAR99 | 8542.32.00.51 | DUAL | 无铅 | 1 | 1.27 mm | unknown | 8 | R-PDSO-N8 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 8MX8 | 3-STATE | 0.8 mm | 8 | 67108864 bit | SERIAL | FLASH | 3 V | 8 mm | 6 mm | |||||||||||||||||||||||||||||||
AM28F020-120FI | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | ADVANCED MICRO DEVICES INC | TSOP | SOP, TSSOP32,.8,20 | 120 ns | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | TSSOP32,.8,20 | RECTANGULAR | 小概要 | 5 V | YES | 32 | 无 | e0 | EAR99 | NOR型号 | 锡铅 | 10K WRITE/ERASE CYCLES MIN | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3-STATE | 8 | 0.0001 A | 2097152 bit | PARALLEL | FLASH | 12 V | 10000 Write/Erase Cycles | NO | NO | YES | YES | ||||||||||||||||||||||
S29GL064A90TFIR1 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SST39LF080-55-4C-EI | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | SILICON STORAGE TECHNOLOGY INC | TSOP1 | 10 X 20 MM, MO-142CD, TSOP1-40 | 55 ns | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | YES | 40 | 无 | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 40 | R-PDSO-G40 | 不合格 | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 1MX8 | 1.2 mm | 8 | 0.00002 A | 8388608 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 256 | 4K | YES | 18.4 mm | 10 mm | |||||||||||||||||||||
NAND128W3A2BV6F | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NUMONYX | SOIC | VSSOP, | 35 ns | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSSOP | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | 3 V | YES | 48 | Obsolete | EAR99 | SLC NAND类型 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | unknown | 40 | 48 | R-PDSO-G48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 16MX8 | 0.65 mm | 8 | 134217728 bit | PARALLEL | FLASH | 3 V | 15.4 mm | 12 mm | ||||||||||||||||||||||||||||||
S29GL256N10FFIV10 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | ADVANCED MICRO DEVICES INC | 100 ns | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | 网格排列 | YES | 64 | 有 | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | unknown | S-PBGA-B64 | 不合格 | INDUSTRIAL | ASYNCHRONOUS | 0.07 mA | 16MX16 | 3-STATE | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||||||||
K9F5616Q0C-HCB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | SAMSUNG SEMICONDUCTOR INC | FBGA, BGA63,10X12,32 | 40 ns | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | FBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | YES | 63 | 有 | EAR99 | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B63 | 不合格 | COMMERCIAL | 0.015 mA | 16MX16 | 16 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | NO | NO | YES | 2K | 8K | 256 words | YES | |||||||||||||||||||||||||||||||||
X76F100Y | Xicor Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | XICOR INC | , | 1 MHz | 128 words | 128 | 70 °C | UNSPECIFIED | RECTANGULAR | 微电子组件 | 5 V | NO | 8 | Obsolete | NOR型号 | 100000 ENDURANCE WRITE CYCLES; DATA RETENTION = 100 YEARS | UNSPECIFIED | UNSPECIFIED | 1 | unknown | R-XXMA-X8 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | SYNCHRONOUS | 128X8 | OPEN-DRAIN | 8 | 1024 bit | SERIAL | 闪存卡 | 5 V | 100000 Write/Erase Cycles | 10 ms | 100 | |||||||||||||||||||||||||||||||||||||
S29AL004D70BFI023 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | ADVANCED MICRO DEVICES INC | 70 ns | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | 48 | 有 | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B48 | 不合格 | INDUSTRIAL | 0.035 mA | 256KX16 | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | |||||||||||||||||||||||||||||||
S29AL004D70BFI023 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | SPANSION INC | BGA | 8.15 X 6.15 MM, LEAD FREE, FBGA-48 | 70 ns | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 V | YES | 48 | 有 | e1 | 有 | EAR99 | NOR型号 | 锡银铜 | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 256KX16 | 1 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | 8.15 mm | 6.15 mm | ||||||||||||
SEDC600M/3840G | Kingston Technology Company | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks, 2 Days | KINGSTON TECHNOLOGY COMPANY INC | MODULE | 4123168604160 words | 3840000000000 | 70 °C | UNSPECIFIED | XMA | RECTANGULAR | 微电子组件 | NO | 活跃 | EAR99 | TLC NAND TYPE | 8542.32.00.51 | UNSPECIFIED | 无铅 | 1 | unknown | R-XXMA-N | ASYNCHRONOUS | 3840GX8 | 8 | 32985348833280 bit | SERIAL | FLASH MODULE | ||||||||||||||||||||||||||||||||||||||||||||||
SST39VF040-90-4I-NH | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | SILICON STORAGE TECHNOLOGY INC | QFJ | PLASTIC, MS-016AE, LCC-32 | 90 ns | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 3 V | YES | 32 | 无 | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 512KX8 | 3.556 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 128 | 4K | 13.97 mm | 11.43 mm | |||||||||||||||||||||
MX29LA641DLXCI-90G | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | MACRONIX INTERNATIONAL CO LTD | BGA | TBGA, BGA64,8X8,40 | 90 ns | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | YES | 64 | 有 | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 未说明 | 1 | 1 mm | unknown | 未说明 | 64 | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 4MX16 | 1.2 mm | 16 | 0.000015 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | YES | YES | 13 mm | 10 mm | ||||||||||||||||||
AM29LV002B-150EC | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SPANSION INC | TSOP | TSOP-40 | 150 ns | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3 V | YES | 40 | Obsolete | EAR99 | NOR型号 | 底部启动区块 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 40 | R-PDSO-G40 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 256KX8 | 1.2 mm | 8 | 2097152 bit | PARALLEL | FLASH | 3 V | BOTTOM | 18.4 mm | 10 mm | |||||||||||||||||||||||||||||||
M59DR032EA12ZB6 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | NUMONYX | BGA | LFBGA, | 120 ns | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.8 V | YES | 48 | 无 | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.75 mm | not_compliant | 48 | R-PBGA-B48 | 不合格 | 2.2 V | INDUSTRIAL | 1.65 V | ASYNCHRONOUS | 2MX16 | 1.35 mm | 16 | 33554432 bit | PARALLEL | FLASH | 1.8 V | TOP | 12 mm | 7 mm | ||||||||||||||||||||||||||||
M59DR032EA12ZB6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | STMICROELECTRONICS | BGA | 7 X 12 MM, 0.75 MM PITCH, TFBGA-48 | 120 ns | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.8 V | YES | 48 | 无 | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.75 mm | not_compliant | 48 | R-PBGA-B48 | 不合格 | 2.2 V | INDUSTRIAL | 1.65 V | ASYNCHRONOUS | 0.026 mA | 2MX16 | 1.35 mm | 16 | 0.00001 A | 33554432 bit | PARALLEL | FLASH | 1.8 V | YES | YES | YES | 8,63 | 4K,32K | 4 words | TOP | YES | 12 mm | 7 mm | ||||||||||||||||||
S99-50224 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
M27C401AZB | OKI Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S29AL004D90BAI020 | Spansion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | SPANSION INC | BGA | 8.15 X 6.15 MM, FBGA-48 | 90 ns | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 V | YES | 48 | 无 | e0 | 无 | EAR99 | NOR型号 | 锡铅 | ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 256KX16 | 1 mm | 16 | 0.000005 A | 4194304 bit | PARALLEL | FLASH | 3 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | 8.15 mm | 6.15 mm | |||||||||||||
SDSDQ-1024 | Western Digital Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | WESTERN DIGITAL CORP | CARD-8 | 50 MHz | 1073741824 words | 1000000000 | 85 °C | -25 °C | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | YES | 8 | 活跃 | EAR99 | NAND类型 | 8542.32.00.51 | UPPER | 无铅 | 1 | 1.1 mm | unknown | R-XUUC-N8 | 3.6 V | OTHER | 2.7 V | SYNCHRONOUS | 1GX8 | 0.95 mm | 8 | 8589934592 bit | SERIAL | 闪存卡 | 2.7 V | SOFTWARE | NO | YES | NO | NO | 15 mm | 11 mm |