类别是'嵌入式 - 微控制器 - 应用特定'
嵌入式 - 微控制器 - 应用特定 (5239)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 端口的数量 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 座位高度-最大 | 地址总线宽度 | 主时钟/晶体频率-名 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 输出时钟频率-最大值 | 串行I/O数 | 总线兼容性 | 最大数据传输率 | 通信协议 | 数据编码/解码方式 | 显示配置 | 长度 | 宽度 | ||||||||||||||||||
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ICS9169CM-22 | Integrated Circuit Systems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | INTEGRATED CIRCUIT SYSTEMS INC | SOIC-32 | 70 °C | PLASTIC/EPOXY | SOP | SOP32,.4 | RECTANGULAR | 小概要 | 3.7 V | 3 V | 3.3 V | 32 | 无 | e0 | 锡铅 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G32 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 110 mA | 2.8194 mm | 14.31818 MHz | 100 MHz | 20.4216 mm | 7.5184 mm | |||||||||||||||||||||||||
ICS9169CM-22 | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | SOIC-32 | 70 °C | PLASTIC/EPOXY | SOP | SOP32,.4 | RECTANGULAR | 小概要 | 3.7 V | 3 V | 3.3 V | 32 | 无 | e0 | 无 | EAR99 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | compliant | 32 | R-PDSO-G32 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 110 mA | 2.8194 mm | 14.31818 MHz | 100 MHz | 20.4216 mm | 7.5184 mm | ||||||||||||||||||||
XCZU4CG-2LFBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-900 | 4 | 110 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.85 V | 900 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||||||||
COM2661-3 | SMSC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | STANDARD MICROSYSTEMS CORP | DIP, DIP28,.6 | 70 °C | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | 28 | 无 | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 235 | 2.54 mm | unknown | R-XDIP-T28 | 不合格 | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | NO | 8 | 1 | ASYNC, BIT; SYNC, BYTE; BISYNC | |||||||||||||||||||||||||
PSD303-15J | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | STMICROELECTRONICS | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 5 V | 44 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | S-PQCC-J44 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||||||||||
AD9549XCPZ | Analog Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | ANALOG DEVICES INC | QFN | HVQCCN, | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.89 V | 1.71 V | 1.8 V | 64 | Obsolete | e3 | EAR99 | TIN | 8542.39.00.01 | QUAD | 无铅 | 0.5 mm | unknown | 64 | S-XQCC-N64 | 不合格 | INDUSTRIAL | JITTER ATTENUATOR | 1 mm | 750 MHz | 750 MHz | 9 mm | 9 mm | |||||||||||||||||||||||
SAS3008(500020657) | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
ZPSD211RV-B-20L | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | STMICROELECTRONICS | QFN | CERAMIC, LDCC-44 | 19 | 70 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | 5.5 V | 2.7 V | 3 V | 44 | 无 | e0 | EAR99 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 44 | S-CQCC-J44 | 不合格 | COMMERCIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 4.57 mm | 16 | 16.485 mm | 16.485 mm | |||||||||||||||||||||
XCZU6CG-1SFVA625E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | BGA-625 | 4 | 100 °C | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 625 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | OTHER | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | |||||||||||||||||||||||||
X68C75LISLIC | Xicor Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | XICOR INC | TQFP-44 | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | TQFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | 5.5 V | 4.5 V | 5 V | 44 | 无 | e0 | 锡铅 | QUAD | 鸥翼 | 0.8 mm | unknown | S-PQFP-G44 | 不合格 | INDUSTRIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 60 mA | 1.6 mm | 8 | 10 mm | 10 mm | |||||||||||||||||||||||
SCB68154C2N40 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | 飞利浦半导体 | DIP-40 | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5 V | 40 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | 不合格 | COMMERCIAL | 微处理器电路 | ||||||||||||||||||||||||||||||||
RT9727AGU6 | Richtek Technology Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RICHTEK TECHNOLOGY CORP | , | 接触制造商 | EAR99 | 8542.39.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
LSISAS1068E | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | BROADCOM INC | EBGA-636 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.2 V | 636 | 活跃 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B636 | BUS CONTROLLER, SCSI | 2.5 mm | 32 | 32 | I2C; PCI; UART | 4000 MBps | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||
KM68LC302PU20VCT | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MOTOROLA INC | QFP | LFQFP, | 20 MHz | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 100 | Transferred | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | 100 | S-PQFP-G100 | 不合格 | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 1.7 mm | 24 | YES | NO | 16 | 4 | 68000 | 1.25 MBps | 14 mm | 14 mm | ||||||||||||||||||||||||||
SYC16C450-QC | Syvantek Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 接触制造商 | SYVANTEK MICROELECTRONICS CORP | QCCJ, LDCC44,.7SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 5.25 V | 4.75 V | 5 V | 44 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J44 | 不合格 | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | NO | ASYNC, BIT | ||||||||||||||||||||||||||||
SPC8106F0C | Epson Electronics America Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | S-MOS SYSTEMS | QFP | , | 70 °C | PLASTIC/EPOXY | SQUARE | FLATPACK | 5.5 V | 3 V | 5 V | 144 | Obsolete | 8542.31.00.01 | QUAD | 鸥翼 | unknown | 144 | S-PQFP-G144 | 不合格 | COMMERCIAL | DISPLAY CONTROLLER, CRT OR FLAT PANEL GRAPHICS DISPLAY | 24 | 16 | ISA | 640 X 480 PIXELS | ||||||||||||||||||||||||||||||
CY2412SC-3 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | CYPRESS SEMICONDUCTOR CORP | SOIC | 0.150 INCH, MS-012, SOIC-8 | 70 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3.47 V | 3.14 V | 3.3 V | 8 | 无 | e0 | EAR99 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | not_compliant | 8 | R-PDSO-G8 | 不合格 | COMMERCIAL | CLOCK GENERATOR, VIDEO | 35 mA | 1.727 mm | 13.5 MHz | 54 MHz | 4.889 mm | 3.8985 mm | |||||||||||||||||||||
DDP3315C | TDK Micronas GmbH | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MICRONAS SEMICONDUCTOR HOLDING AG | , | Obsolete | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU6CG-2SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | BGA-784 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 784 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||||||||||||||||||||||||
SAB82284IP | Siemens | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9CG-2SFVA625I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | XILINX INC | FBGA, BGA625,25X25,32 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 625 | 有 | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | ||||||||||||||||||||||||||||
W183GT | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | CYPRESS SEMICONDUCTOR CORP | SOIC | SOP, | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3.465 V | 3.135 V | 3.3 V | 14 | Obsolete | EAR99 | CAN ALSO OPERATE AT 5V SUPPLY | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | unknown | 14 | R-PDSO-G14 | 不合格 | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.75 mm | 75 MHz | 75 MHz | 8.65 mm | 3.9 mm | |||||||||||||||||||||||||
NHI-1561RTGW/T | National Hybrid Incorporated | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | NATIONAL HYBRID INC | QFP | QFP, | 125 °C | -55 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 5.5 V | 4.5 V | 5 V | 68 | Transferred | 8542.31.00.01 | QUAD | 鸥翼 | 1.27 mm | unknown | 68 | S-PQFP-G68 | 不合格 | MILITARY | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 | 12 | 16 | 2 | MIL-STD-1553 | BIPH-LEVEL(MANCHESTER) | 27.94 mm | 27.94 mm | ||||||||||||||||||||||||
XCZU9CG-L1FBVB900I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | XILINX INC | BGA, BGA900,30X30,40 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.742 V | 0.698 V | 0.72 V | 900 | 有 | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | |||||||||||||||||||||||||||
PSD312-A-90JI | Waferscale Integration Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | WAFERSCALE INTEGRATION INC | 19 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | 44 | Obsolete | QUAD | J BEND | unknown | S-PQCC-J44 | 不合格 | INDUSTRIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 4.57 mm | 16 | 16.56 mm | 16.56 mm |