类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 越来越多的功能 | 引脚数 | 外壳材料 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 终端 | 温度系数 | 连接器类型 | 类型 | 颜色 | 应用 | 性别 | 紧固类型 | 子类别 | 技术 | 电压 - 供电 | 方向 | 频率 | 频率稳定性 | 输出量 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | 终端样式 | 功能 | 基本谐振器 | 最大电流源 | 工作电压 | 极性 | 电流 - 电源(禁用)(最大值) | 通道数量 | 界面 | 内存大小 | 工作电源电流 | 导线/电缆种类 | 电缆长度 | 电阻数 | 程序内存大小 | 扩频带宽 | 箝位电压 | 数据总线宽度 | 触点形式 | 电路型态 | 每个元件的功率 | 产品类别 | 议定书 | 线圈电压 | 切换电压 | 必须运行电压 | 触点额定值(电流) | 线圈功率 | 必须释放电压 | 功率 - 输出 | 无线电频率系列/标准 | 绝对牵引范围 (APR) | 敏感度 | 数据率(最大) | 电阻比漂移 | 串行接口 | 接收电流 | 传输电流 | 调制 | 电阻(欧姆) | 电阻匹配比 | [医]GPIO | 特征 | 电源类型 | 产品类别 | 设备核心 | 座位高度(最大) | 辐射硬化 | 评级结果 | |||||||||||||||||||||||||||
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![]() | CYRF69103A-40LFXC | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Panel Mount, Through Hole | Copper Alloy | Gold | 零售包装 | Metal | 40-VFQFN Exposed Pad | Flange | Aluminum | 40-QFN (6x6) | Glenair | 活跃 | -65°C ~ 175°C | 806 | Solder | Receptacle, Female Sockets | TxRx + MCU | Silver | Threaded | 1.8V ~ 3.6V | A | 2.4GHz | Nickel/PTFE | 17-4 | 8kB Flash, 256B SRAM | - | 4dBm | General ISM > 1GHz | -97dBm | 1Mbps | SPI | 18.9mA ~ 21.9mA | 21.2mA ~ 39.9mA | DSSS, GFSK | 15 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYWUSB6953-48LFXC | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 底座安装 | 银合金 | - | Bulk | 48-VFQFN Exposed Pad | 48-QFN (7x7) | Siemens | 活跃 | -25°C ~ 40°C | Class LC | TxRx + MCU | 2.7V ~ 3.6V | 2.4GHz | 螺旋端子 | 8kB Flash, 512B SRAM | 12PST-6NO/6NC (6 Form A, 6 Form B) | - | 277VAC | 600VAC - Max | 235.45 VAC | 30 A | 248VA | - | 0dBm | General ISM > 1GHz | -95dBm | 62.5kbps | I²C, SPI | 61.3mA | 74.7mA | DSSS | 18 | 辅助触点 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STA5635STR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA7200XT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5.0000 V | 4.5 V | 100 Kbps | Superheterodyne Receiver | Wireless | 5.5 V | 表面贴装 | Compliant | 2 | TSSOP | -20 to 70 °C | Bulk | Crimp | 分立线 | Superheterodyne Receiver | Female | 28 | 7.7(Max) mA | Discrete | 101 mm | Analog | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20820A1KFBG | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4900 | Infineon | Infineon Technologies | Details | Tray | RF System on a Chip - SoC | 62-WFBGA | 62-FBGA (4.5x4.5) | Infineon Technologies | 活跃 | -30°C ~ 85°C | Tray | AIROC™ Bluetooth® | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.71V ~ 3.3V | 2.4GHz | 256kB Flash, 176kB RAM, 1MB ROM | Bluetooth v5.2 + EDR | 11.5dBm | Bluetooth | -94.5dBm | 3Mbps | ADC, GPIO, I²C, I²S, PCM, SPI, UART | 6.28mA ~ 6.87mA | 18.58mA ~ 22.48mA | - | 22 | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYWUSB6935-48LFXC | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Bulk | 4-SMD, No Lead | 48-QFN (7x7) | Abracon LLC | Obsolete | -40°C ~ 85°C | EMK32 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | XO (Standard) | 2.5V | 74.25 MHz | ±50ppm | LVCMOS | Enable/Disable | MEMS | 20mA | - | - | - | - | 0dBm | General ISM > 1GHz | - | -95dBm | 62.5kbps | SPI | 57.7mA | 69.1mA | DSSS, GFSK | 0.039 (1.00mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBL10563-68FLXIT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 68-XFBGA, WLCSP | 68-WLCSP (3.52x3.91) | Infineon Technologies | Obsolete | -40°C ~ 105°C | - | TxRx + MCU | 1.9V ~ 5.5V | 2.4GHz | 128kB Flash, 16kB SRAM | Bluetooth v4.1 | 3dBm | Bluetooth | -89dBm | 1Mbps | I²C, I²S, SPI, UART | 16.4mA | 15.6mA | GFSK | 36 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STM32WL55UCY7TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | STM32 | 活跃 | 59-BGA, WLCSP | 59-WLCSP | STMicroelectronics | Tape & Reel (TR) | -40°C ~ 105°C (TA) | Automotive, AEC-Q100 | TxRx + MCU | 1.8V ~ 3.6V | 150MHz ~ 960MHz | LPUART/Serial I2C/Se | 256kB Flash, 64kB SRAM | 256 KB | 32 Bit | LoRaWAN 1.0, Sigfox, Wireless M-Bus | 22dBm | General ISM < 1GHz | -148dBm | 300kbps | ADC, GPIO, I²C, I²S, IrDA, JTAG, PWM, SPI, UART, USART | 4.47mA ~ 10.22mA | 21mA ~ 120mA | BPSK, FSK, GFSK, GMSK, MSK | 29 | ARM Cortex-M4/ARM Cortex-M0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20835PB1KML1GT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tape & Reel (TR) | Discontinued at Digi-Key | 2500 | Infineon | Infineon Technologies | RF System on a Chip - SoC | 60-VFQFN Exposed Pad | 60-QFN (7x7) | Infineon Technologies | 有 | 0°C ~ 70°C | Reel | AIROC™ Bluetooth | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.62V ~ 3.63V | 2.4GHz | 384kB RAM, 2MB ROM | Bluetooth v5.2 | 12dBm | Bluetooth | -94.5dBm | 2Mbps | ADC, I²C, PWM, SPI, UART | 8mA | 18mA | GFSK | 24 | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBL11473-56LQXIT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tape & Reel (TR) | 511BCA | 6-SMD, No Lead | 56-QFN (7x7) | Skyworks Solutions Inc. | 活跃 | -40°C ~ 85°C | Si511 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 3.3V | 160 MHz | ±20ppm | LVDS | Enable/Disable | Crystal | 23mA | 18mA | 256kB Flash, 32kB SRAM | - | Bluetooth v4.2 | 3dBm | Bluetooth | - | -91dBm | 1Mbps | I²C, SPI, UART | 16.4mA | 15.6mA | GFSK | 36 | 0.071 (1.80mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20738A2KML3GT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | CYW20738 | 活跃 | 2500 | Infineon | Infineon Technologies | Details | RF Microcontrollers - MCU | 40-VFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Tape & Reel (TR) | 0°C ~ 70°C | Reel | - | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 3.8V | 2.4GHz | 320kB ROM, 60kB RAM | Bluetooth v4.0 | 4dBm | Bluetooth | -93dBm | 1Mbps | I²C, SPI, UART | 27mA | 27mA | DPSK, DQPSK, GFSK, GMSK | 22 | RF Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBL10163-56LQXIT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Obsolete | 56-UFQFN Exposed Pad | 56-QFN (7x7) | Infineon Technologies | Tape & Reel (TR) | -40°C ~ 105°C | - | TxRx + MCU | 1.8V ~ 5.5V | 2.4GHz | 128kB Flash, 8kB ROM, 16kB SRAM | Bluetooth v4.1 | 3dBm | Bluetooth | -91dBm | 1Mbps | I²C, I²S, SPI, UART | 16.4mA ~ 21.5mA | 12.5mA ~ 20mA | GFSK | 36 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBL11573-56LQXIT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Panjit | Details | 30 kV | 6.4 V | + 175 C | 30 kV | 0.071959 oz | - 55 C | 500 | 543 A | 5 kW | Tape & Reel (TR) | Obsolete | ESD Suppressors / TVS Diodes | P600-2 | 56-QFN (7x7) | Infineon Technologies | Panjit | -40°C ~ 85°C | Bulk | PRoC™ BLE | 仅TxRx | TVS Diodes / ESD Suppression Diodes | 1.8V ~ 5.5V | 2.4GHz | Axial | 5 V | 单向 | 1 Channel | 256kB Flash, 32kB SRAM | 9.2 V | Bluetooth v4.2 | 3dBm | Bluetooth | -92dBm | 1Mbps | I²C, I²S, SPI, UART | 16.4mA | 15.6mA | GFSK | 36 | TVS 二极管 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYWUSB6934-48LFC | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 活跃 | 10-SIP, 6 Leads | 6 | - | Caddock Electronics Inc. | Bulk | -40°C ~ 85°C | 1776 | 1.000 L x 0.110 W (25.40mm x 2.79mm) | ±0.1% | ±30ppm/°C | 仅TxRx | Voltage Divider (TCR Matched) | 2.7V ~ 3.6V | 2.4GHz | - | 5 | 十进制电阻器 | 62.5mW | - | 0dBm | General ISM > 1GHz | -90dBm | 62.5kbps | ±10ppm/°C | SPI | 57.7mA | 69.1mA | DSSS, GFSK | 1k, 9k, 90k, 900k, 9M | ±0.1% | 0.550 (13.97mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4128LQI-BL473 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tray | 56-UFQFN Exposed Pad | 56-QFN (7x7) | Infineon Technologies | Obsolete | -40°C ~ 85°C (TA) | PSOC® 4 CY8C41xx BLE | TxRx + MCU | 1.8V ~ 5.5V | 2.4GHz | 256kB Flash, 8kB ROM, 32kB SRAM | Bluetooth v4.2 | 3dB | Bluetooth, General ISM > 1GHz | -92dBm | 8Mbps | I²C, SPI, UART | 16.4mA ~ 18.7mA | 16.5mA ~ 20mA | GFSK | 36 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20702A1KWFBG | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | CYW20702 | Tray | 50-WFBGA | 50-WFBGA (4.5x4) | Infineon Technologies | Discontinued at Digi-Key | -30°C ~ 85°C | - | TxRx + MCU | 2.3V ~ 5.5V | 2.4GHz | - | Bluetooth v4.0 +EDR | 10dBm | Bluetooth | -92dBm | 3Mbps | I²C, I²S, SPI, UART, USB | 32mA | 65mA | 4DQPSK, 8DPSK, GFSK | 7 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYRF69313-40LFXC | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tray | 40-VFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Obsolete | 0°C ~ 70°C | PRoC® | TxRx + MCU | 4V ~ 5.25V | 2.4GHz | 8kB Flash, 256B SRAM | - | 0dBm | General ISM > 1GHz | -90dBm | 1.5Mbps | SPI, USB | 20.2mA ~ 23.4mA | 22.4mA ~ 27.7mA | DSSS, GFSK | 14 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW43570KFFBG | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tray | CYW43570 | 254-TFBGA, FCBGA | 254-FCBGA (10x10) | Infineon Technologies | Discontinued at Digi-Key | 0°C ~ 60°C | - | TxRx + MCU | 3.3V | 2.4GHz, 5GHz | 668kB ROM, 200KB RAM | 802.11ac, Bluetooth v4.1 +EDR | 20dBm | Bluetooth, WiFi | -99dBm | I²S, JTAG, SPI, UART, USB | 79mA ~ 220mA | 250mA ~ 620mA | 4DQPSK, 8DPSK, GFSK | 16 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MAX7032ATJ+TWC6L | Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MAX703 | Obsolete | Analog Devices Inc./Maxim Integrated | Tape & Reel (TR) | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW4356XKWBGT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | CYW4356 | Tape & Reel (TR) | 5000 | Infineon | Infineon Technologies | Details | RF Microcontrollers - MCU | 395-XFBGA, WLCSP | 395-WLCSP (4.87x7.67) | Infineon Technologies | 不用于新设计 | -30°C ~ 85°C | Reel | - | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.2V ~ 3.3V | 2.4GHz | 802.11a/b/g/n, Bluetooth v4.1 | 19.5dBm | Bluetooth, WiFi | -95dBm | I²S, SPI, UART | 8DPSK, DQPSK, GFSK | 16 | RF Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW43364KUBGT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | CYW43364 | 不用于新设计 | Infineon | Infineon Technologies | Details | 5000 | RF Microcontrollers - MCU | 74-UFBGA, WLBGA | 74-WLBGA (4.87x2.87) | Infineon Technologies | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | -30°C ~ 70°C | Reel | - | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 3.3V | 2.4GHz | 640kB ROM, 512kB SRAM | 802.11b/g/n | 21dBm | WiFi | -99dBm | 54Mbps | I²S, SPI, UART | 37mA ~ 41mA | 260mA ~ 320mA | 16QAM, 64QAM, BPSK, CCK, DSSS, OFDM, QPSK | 5 | RF Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW89820BWMLGT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Surface Mount, Wettable Flank | CYW89820BW | 活跃 | Details | Infineon Technologies | Infineon | 2500 | Infineon | 48-VFQFN Exposed Pad | 48-WQFN (7x7) | Infineon Technologies | Tape & Reel (TR) | -40°C ~ 105°C | Reel | Automotive, AEC-Q100, CYW89820 | TxRx + MCU | Wireless & RF Modules | 1.045V ~ 1.26V | 2.4GHz | 256kB Flash, 176kB RAM, 1MB ROM | Bluetooth v5.0 + EDR | - | Bluetooth | -94.5dBm | 3Mbps | I²C, I²S, PCM, PWM, SPI, UART | - | - | GFSK | 17 | 蓝牙模块 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW89820BWMLG | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Surface Mount, Wettable Flank | CYW89820BW | 活跃 | Details | Infineon Technologies | Infineon | 2600 | Infineon | 48-VFQFN Exposed Pad | 48-WQFN (7x7) | Infineon Technologies | Tray | -40°C ~ 105°C | Tray | Automotive, AEC-Q100, CYW89820 | TxRx + MCU | Wireless & RF Modules | 1.045V ~ 1.26V | 2.4GHz | 256kB Flash, 176kB RAM, 1MB ROM | Bluetooth v5.0 + EDR | - | Bluetooth | -94.5dBm | 3Mbps | I²C, I²S, PCM, PWM, SPI, UART | - | - | GFSK | 17 | 蓝牙模块 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20819A1KFBGT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | CYW20819 | 活跃 | 5000 | Infineon | Infineon Technologies | Details | 62-WFBGA | 62-FBGA (4.5x4.5) | Infineon Technologies | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | -30°C ~ 85°C (TA) | Reel | - | TxRx + MCU | 1.045V ~ 1.26V | 2.4GHz | 256kB Flash, 160kB RAM | Bluetooth v5.2, Class 2 | 5dBm | Bluetooth, General ISM > 1GHz | -95dBm | 3Mbps | GPIO, HCI, I²C, I²S, PWM, SPI, UART | 6.1mA ~ 6.69mA | 6.16mA ~ 11.28mA | GFSK | 22 | Infineon | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20819A1KFBG | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | CYW20819 | 活跃 | 2450 | Infineon | Infineon Technologies | Details | 62-WFBGA | 62-FBGA (4.5x4.5) | Infineon Technologies | Tray | -30°C ~ 85°C (TA) | Tray | AIROC™ Bluetooth® | TxRx + MCU | 1.045V ~ 1.26V | 2.4GHz | 256kB Flash, 176kB RAM | Bluetooth v5.2 | 4.5dBm | Bluetooth | -95dBm | 3Mbps | GPIO, HCI, I²C, I²S, JTAG, PCM, PWM, SPI, UART | 6.1mA ~ 6.69mA | 6.16mA ~ 11.28mA | GFSK | 22 | Infineon |