类别是'嵌入式 - 片上系统(SoC)'
嵌入式 - 片上系统(SoC) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 包装/外壳 | 供应商器件包装 | 端子材料 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 类型 | 子类别 | Reach合规守则 | 工作电源电压 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 端子类型 | 产品类别 | 剥线长度 | 线缆规格(AWG) | 主要属性 | 核数量 | 闪光大小 | 产品类别 | 绝缘的 | ||||||||||||||||||||||||||||
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![]() | XCZU2EG-2UBVA530E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 530-WFBGA, FCBGA | Tray | 活跃 | 530-FCBGA (16x9.5) | AMD | 82 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2HSINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1369-BFBGA | Tray | 活跃 | 1369-BGA (35x35) | AMD | 316 | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU55DR-L2FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1156-BBGA, FCBGA | Tray | 活跃 | 1156-FCBGA (35x35) | AMD | - | -40°C ~ 100°C (TJ) | Bag | Zynq® UltraScale+™ RFSoC DR | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2HSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | Tray | 活跃 | 1760-FCBGA (40x40) | AMD | 402 | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1CG-1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 784-BFBGA, FCBGA | Tray | 活跃 | 784-FCBGA (23x23) | AMD | - | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||
![]() | XCZU67DR-2FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU67DR-1FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QLS1046MN1T144AFN1 | Teledyne LeCroy | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2HSIVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | Tray | 活跃 | 1760-FCBGA (40x40) | AMD | 500 | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2LLEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | Tray | 活跃 | 1760-FCBGA (40x40) | AMD | 726 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-1FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1156-BBGA, FCBGA | Tray | 活跃 | 1156-FCBGA (35x35) | AMD | 366 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MLEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | Tray | 活跃 | 1760-FCBGA (40x40) | AMD | 726 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2MLEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | Tray | 活跃 | 1760-FCBGA (40x40) | AMD | 402 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-L1UBVA494I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 494-WFBGA, FCBGA | Tray | 活跃 | 494-FCBGA (14x14) | AMD | 82 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-1LSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2197-BFBGA, FCBGA | Tray | 活跃 | 2197-FCBGA (45x45) | AMD | 608 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1MLIVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1596-BFBGA, FCBGA | Tray | 活跃 | 1596-FCBGA (40x40) | AMD | 500 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MSINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1369-BFBGA | Tray | 活跃 | 1369-BGA (35x35) | AMD | 424 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1MSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2197-BFBGA, FCBGA | Tray | 活跃 | 2197-FCBGA (45x45) | AMD | 770 | 0°C ~ 100°C (TJ) | Versal™ AI Core | Adaptive Compute Acc | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MSEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1596-BFBGA, FCBGA | Tray | 活跃 | 1596-FCBGA (40x40) | AMD | 500 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2MLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | Tray | 活跃 | 1760-FCBGA (40x40) | AMD | 402 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU65DR-1FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LLIVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BFBGA, FCBGA | Tray | 活跃 | 1760-FCBGA (40x40) | AMD | 500 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | BCM33843MVFSBGB0T | Broadcom | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Cutler Hammer, Div of Eaton Co | - | Tray | BCM33843 | Obsolete | - | Broadcom Limited | E22VB51 | - | - | 2.4GHz, 5GHz | - | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H1F34E1HG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | 96000 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | + 100 C | 0 C | 24 | SMD/SMT | 82500 LAB | 966266 | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 活跃 | INTEL CORP | 5.66 | SoC FPGA | 1152-FBGA (35x35) | Cully-Minerallac | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||
![]() | BCM47622A1KFEBG | Broadcom | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Side A 4 AWG, Side B 8 AWG | Burndy | Nylon | - | Tray | 活跃 | - | Aluminum | Broadcom Limited | ES4W8W | - | - | 1.5GHz | - | ARM® Cortex®-A7 | DDR3, DDR4, LED | Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi | MPU | Splice Reducer | 0.88 | 4 AWG, 8 AWG | - | - | Insulated |