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我的订单 我的询价 0755-82520436 3307104213

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

表面安装

终端数量

JESD-609代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

筛选水平

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

产品条款数量

长度

宽度

PZ3128-S15A84 PZ3128-S15A84

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

NXP SEMICONDUCTORS

LCC

PEDESTAL, PLASTIC, SOT-189-3, LCC-84

59 MHz

64

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.6 V

3 V

3.3 V

84

Obsolete

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

84

S-PQCC-J84

不合格

COMMERCIAL

17.5 ns

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

2

29.3116 mm

29.3116 mm

PZ3128-S15A84 PZ3128-S15A84

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

QCCJ, LDCC84,1.2SQ

70 °C

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

3.3 V

84

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J84

不合格

COMMERCIAL

17.5 ns

EE PLD

128

YES

YES

PALC22V10D-25DMB PALC22V10D-25DMB

Teledyne e2v 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

TELEDYNE E2V (UK) LTD

CERAMIC, DIP-24

30.3 MHz

10

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

24

活跃

3A001.A.2.C

IT ALSO AVAILABLE IN GDIP-24 PACKAGE

8542.39.00.01

DUAL

THROUGH-HOLE

compliant

R-CDIP-T24

MILITARY

25 ns

11 DEDICATED INPUTS, 10 I/O

EE PLD

MACROCELL

11

PALC22V10D-25DMB PALC22V10D-25DMB

Cypress Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

CYPRESS SEMICONDUCTOR CORP

DIP

0.300 INCH, CERDIP-24

30.3 MHz

10

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

24

e0

3A001.A.2.C

锡铅

10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

24

R-GDIP-T24

10

不合格

MILITARY

25 ns

PAL-TYPE

22

11 DEDICATED INPUTS, 10 I/O

闪存 PLD

38535Q/M;38534H;883B

MACROCELL

11

132

PZ3128IS15A84 PZ3128IS15A84

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

3.3 V

84

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J84

不合格

INDUSTRIAL

17.5 ns

EE PLD

128

YES

YES

PLS153AA-T PLS153AA-T

YAGEO Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

飞利浦组件

10

75 °C

PLASTIC/EPOXY

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

20

Obsolete

8542.39.00.01

QUAD

J BEND

unknown

S-PQCC-J20

不合格

商业扩展

30 ns

8 DEDICATED INPUTS, 10 I/O

OT PLD

COMBINATORIAL

8

PZ3064-10A44-T PZ3064-10A44-T

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

XILINX INC

LPCC

QCCJ,

80 MHz

32

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.63 V

2.97 V

3.3 V

44

Obsolete

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

PZ3128IS12BP PZ3128IS12BP

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

QFP, TQFP100,.63SQ

3

85 °C

-40 °C

PLASTIC/EPOXY

QFP

TQFP100,.63SQ

SQUARE

FLATPACK

3.3 V

100

YES

8542.39.00.01

QUAD

鸥翼

240

0.5 mm

unknown

30

S-PQFP-G100

不合格

INDUSTRIAL

14.5 ns

EE PLD

128

YES

YES

PZ3128IS12BP PZ3128IS12BP

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

NXP SEMICONDUCTORS

QFP

14 X 14 X 1 MM, PLASTIC, SOT-386-1, TQFP-100

66 MHz

80

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

100

Obsolete

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

100

S-PQFP-G100

不合格

INDUSTRIAL

14.5 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm

PZ5064NS12A44 PZ5064NS12A44

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5 V

44

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

INDUSTRIAL

14 ns

EE PLD

64

YES

YES

PZ5064NS12A44 PZ5064NS12A44

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5 V

44

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

INDUSTRIAL

14 ns

EE PLD

64

YES

YES

PZ3032NS12A44 PZ3032NS12A44

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

44

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

INDUSTRIAL

15 ns

EE PLD

32

YES

YES

PZ3032NS12A44 PZ3032NS12A44

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

NXP SEMICONDUCTORS

LCC

PLASTIC, LCC-44

47 MHz

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.63 V

3 V

3.3 V

44

Obsolete

32 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

INDUSTRIAL

15 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

PZ3032NS12A44 PZ3032NS12A44

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

44

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

INDUSTRIAL

15 ns

EE PLD

32

YES

YES

PZ3032NS12BC PZ3032NS12BC

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

QFP, TQFP44,.47SQ,32

3

85 °C

-40 °C

PLASTIC/EPOXY

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

3.3 V

44

YES

8542.39.00.01

QUAD

鸥翼

240

0.8 mm

unknown

30

S-PQFP-G44

不合格

INDUSTRIAL

15 ns

EE PLD

32

YES

YES

PZ3032NS12BC PZ3032NS12BC

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

QFP, TQFP44,.47SQ,32

85 °C

-40 °C

PLASTIC/EPOXY

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

3.3 V

44

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

鸥翼

0.8 mm

unknown

S-PQFP-G44

不合格

INDUSTRIAL

15 ns

EE PLD

32

YES

YES

LC4064V-10TN48C LC4064V-10TN48C

Lattice Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

XH95288-10HQG304C XH95288-10HQG304C

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

ADVANCED MICRO DEVICES INC

HEAT SINK, QFP-304

192

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

304

Obsolete

e3

哑光锡

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G304

不合格

0 DEDICATED INPUTS, 192 I/O

4.5 mm

MASK PLD

MACROCELL

40 mm

40 mm

EPM5128AJC-15 EPM5128AJC-15

Altera Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

ALTERA CORP

LCC

WQCCJ, LDCC68,1.0SQ

83.3 MHz

52

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER, WINDOW

5.25 V

4.75 V

5 V

68

e0

锡铅

LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

QUAD

J BEND

220

1.27 mm

unknown

68

S-CQCC-J68

不合格

COMMERCIAL

25 ns

7 DEDICATED INPUTS, 52 I/O

5.08 mm

UV PLD

MACROCELL

128

NO

7

NO

24.13 mm

24.13 mm

PZ3128IS15BB2 PZ3128IS15BB2

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

QFP, QFP160,1.2SQ

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

3.3 V

160

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

鸥翼

0.635 mm

unknown

S-PQFP-G160

不合格

INDUSTRIAL

17.5 ns

EE PLD

128

YES

YES

PZ3128-S10BB2-T PZ3128-S10BB2-T

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

XILINX INC

QFP

QFP,

77 MHz

96

70 °C

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

3.63 V

2.97 V

3.3 V

160

Obsolete

128 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.65 mm

unknown

160

S-PQFP-G160

不合格

COMMERCIAL

12.5 ns

2 DEDICATED INPUTS, 96 I/O

4.07 mm

EE PLD

MACROCELL

2

28 mm

28 mm

PZ3128-S10BB2-T PZ3128-S10BB2-T

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

NXP SEMICONDUCTORS

QFP,

74 MHz

96

70 °C

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

3.6 V

3 V

3.3 V

160

Transferred

8542.39.00.01

QUAD

鸥翼

0.65 mm

unknown

S-PQFP-G160

不合格

COMMERCIAL

13 ns

2 DEDICATED INPUTS, 96 I/O

4.07 mm

EE PLD

MACROCELL

2

28 mm

28 mm

XC2C64A-4CP56C XC2C64A-4CP56C

AMD Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

XILINX INC

BGA

LFBGA,

454 MHz

45

70 °C

PLASTIC/EPOXY

LFBGA

BGA56,10X10,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.9 V

1.7 V

1.8 V

56

e0

锡铅

8542.39.00.01

BOTTOM

BALL

0.5 mm

unknown

56

S-PBGA-B56

不合格

COMMERCIAL

4 ns

0 DEDICATED INPUTS, 45 I/O

1.35 mm

闪存 PLD

MACROCELL

6 mm

6 mm

P85C224-80 P85C224-80

Intel Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

INTEL CORP

DIP

DIP, DIP24,.3

80 MHz

8

70 °C

PLASTIC/EPOXY

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

24

e0

锡铅

PAL WITH MACROCELLS; 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

24

R-PDIP-T24

8

不合格

COMMERCIAL

12 ns

PAL-TYPE

22

13 DEDICATED INPUTS, 8 I/O

4.32 mm

OT PLD

MACROCELL

13

72

31.61 mm

7.62 mm

PALCE16V8H-7JC/4 PALCE16V8H-7JC/4

Vantis Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

VANTIS CORP

,

125 MHz

8

70 °C

PLASTIC/EPOXY

SQUARE

CHIP CARRIER

5 V

20

Obsolete

QUAD

J BEND

unknown

S-PQCC-J20

不合格

COMMERCIAL

7.5 ns

10 DEDICATED INPUTS, 8 I/O

EE PLD

MACROCELL

10