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类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

生命周期状态

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

厂商

操作温度

包装

系列

尺寸/尺寸

容差

JESD-609代码

无铅代码

温度系数

类型

电阻

端子表面处理

最高工作温度

最小工作温度

应用

附加功能

HTS代码

电容量

子类别

技术

端子位置

终端形式

峰值回流焊温度（摄氏度）

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

频率稳定性

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

ESR（等效串联电阻）

引线间距

电源

界面

最大电源电压

负载电容

速度

内存大小

操作模式

引线样式

核心处理器

频率容差

周边设备

程序内存大小

连接方式

建筑学

数据总线宽度

输入数量

座位高度-最大

可编程逻辑类型

筛选水平

速度等级

主要属性

逻辑单元数

核数量

闪光大小

特征

产品类别

设备核心

座位高度(最大)

长度

宽度

厚度（最大）

达到SVHC

评级结果
XCZU46DR-1FSVH1760E XCZU46DR-1FSVH1760E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

RISC

有

574

Tray

活跃

通孔

1760-BBGA, FCBGA

2

1760-FCBGA (42.5x42.5)

AMD

Compliant

0 to 100 °C

Zynq® UltraScale+™ RFSoC

120 Ω

165 °C

-40 °C

1760

30 V

JTAG

30 V

500MHz, 1.2GHz

38 Mb

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Extended

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Arm Cortex A53/Arm Cortex R5

Unknown

XCZU43DR-L2FFVG1517I XCZU43DR-L2FFVG1517I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

M2S060T-1FCSG325I M2S060T-1FCSG325I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Non-Compliant

200

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

通孔

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

13 kV

-40°C ~ 100°C (TJ)

Bulk

SmartFusion®2

5 %

100 °C

-55 °C

5 nF

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

45.0088 mm

M2S150T-1FCVG484 M2S150T-1FCVG484

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

484-BFBGA

484-FBGA (19x19)

微芯片技术

273

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S050TS-1FGG896I M2S050TS-1FGG896I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

377

M2S050

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

表面贴装

4-SMD, No Lead

896-FBGA (31x31)

Suntsu Electronics, Inc.

Bulk

-40°C ~ 85°C

SXT224

0.098 L x 0.079 W (2.50mm x 2.00mm)

兆赫晶体

12 MHz

±15ppm

120 Ohms

10pF

166MHz

64KB

Fundamental

ARM® Cortex®-M3

±15ppm

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

0.026 (0.65mm)

M2S150T-1FCV484 M2S150T-1FCV484

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

1500V (1.5kV)

273

M2S150

-

166 MHz

146124 LE

-

64 kB

Surface Mount, MLCC

1808 (4520 Metric)

484-FBGA (19x19)

Vishay Vitramon

Tape & Reel (TR)

-55°C ~ 125°C

VJ OMD

0.186 L x 0.080 W (4.72mm x 2.03mm)

±5%

C0G, NP0

敏感型

12 pF

-

166MHz

64KB

-

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

Soft Termination, High Voltage

-

0.086 (2.18mm)

-

M2S060-1FCSG325I M2S060-1FCSG325I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

活跃

Compliant

200

M2S060

-

166 MHz

56520 LE

-

64 kB

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

1.14 V

有

M2S060-1FCSG325I

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.8

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

KYOCERA AVX

Bulk

-40°C ~ 100°C (TJ)

*

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

40

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

M2S060-FG676I M2S060-FG676I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

活跃

Non-Compliant

387

M2S060

-

166 MHz

56520 LE

-

64 kB

676-BGA

676-FBGA (27x27)

PEI-Genesis

Bulk

-40°C ~ 100°C (TJ)

*

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

XCZU43DR-2FFVG1517E XCZU43DR-2FFVG1517E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

AGFB014R24B1I1V AGFB014R24B1I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

3

Intel

Intel

Details

-

-

Intel

768

-40°C ~ 100°C (TJ)

Tray

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

Intel

1SX065HH3F35I3VG 1SX065HH3F35I3VG

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

24

Intel

Intel

1152-BBGA, FCBGA

1152-FBGA (35x35)

Intel

392

-40°C ~ 100°C (TJ)

Tray

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 650K Logic Elements

-

Intel

AGFA012R24B2E2V AGFA012R24B2E2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

3

Intel

Intel

Details

-

-

Intel

768

0°C ~ 100°C (TJ)

Tray

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

Intel

M2S090TS-1FGG676I M2S090TS-1FGG676I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

1.14 V

1.26 V

425

Tray

M2S090

活跃

-

166 MHz

86316 LE

-

64 kB

FBGA-676

网格排列

3

PLASTIC/EPOXY

1.2 V

40

1.14 V

有

M2S090TS-1FGG676I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.3

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

1.2000 V

-40 to 100 °C

SmartFusion®2

e1

有

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

1

FPGA - 90K Logic Modules

1 Core

512KB

27 mm

27 mm

XCZU47DR-1FSVE1156E XCZU47DR-1FSVE1156E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64, 32 Bit

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

M2S025T-VFG400 M2S025T-VFG400

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

M2S025

活跃

-

166 MHz

27696 LE

-

64 kB

400-LFBGA

400-VFBGA (17x17)

微芯片技术

207

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

MPFS250T-FCVG784EES MPFS250T-FCVG784EES

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

微芯片技术

MCU - 136, FPGA - 372

0°C ~ 100°C

PolarFire™

-

2.2MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128kB

XCZU43DR-L2FSVG1517I XCZU43DR-L2FSVG1517I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU47DR-L2FSVE1156I XCZU47DR-L2FSVE1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-1FSVE1156E XCZU43DR-1FSVE1156E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU47DR-1FSVG1517I XCZU47DR-1FSVG1517I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVM1302-2MSIVFVC1596 XCVM1302-2MSIVFVC1596

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

532

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1302-1LLINBVB1024 XCVM1302-1LLINBVB1024

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1024-BFBGA

1024-BGA (31x31)

AMD

316

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCZU1EG-2UBVA494I XCZU1EG-2UBVA494I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

494-WFBGA, FCBGA

494-FCBGA (14x14)

AMD

180

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

Zynq®UltraScale+™ FPGA, 81K+ Logic Cells

-

XCZU1EG-2SFVC784E XCZU1EG-2SFVC784E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

-

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

-

XCZU1CG-L1SFVC784I XCZU1CG-L1SFVC784I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

-

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-