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产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

安装类型

包装/外壳

表面安装

越来越多的功能

触点形状

外壳材料

供应商器件包装

介电材料

插入材料

终端数量

后壳材料,电镀

厂商

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终止次数

终端

温度系数

连接器类型

类型

电阻

定位的数量

组成

颜色

应用

功率(瓦特)

HTS代码

电容量

紧固类型

子类别

触点类型

额定电流

技术

电压 - 供电

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

入口保护

端子间距

Reach合规守则

频率

频率稳定性

输出量

外壳完成

外壳尺寸-插入

JESD-30代码

功能

基本谐振器

最大电流源

输出的数量

资历状况

工作频率

房屋颜色

工作电源电压

ESR(等效串联电阻)

失败率

引线间距

电源

温度等级

电流 - 电源(禁用)(最大值)

注意

内存大小

负载电容

速度

内存大小

反向泄漏电流@ Vr

操作模式

外壳尺寸,MIL

不同 If 时电压 - 正向 (Vf)

配件类型

核心处理器

频率容差

周边设备

程序存储器类型

程序内存大小

扩频带宽

连接方式

输出功率

功率 - 最大

电缆开口

数据率

建筑学

数据总线宽度

输入数量

座位高度-最大

使用的 IC/零件

可编程逻辑类型

电压 - 齐纳(标准值)(Vz)

产品类别

议定书

包括

功率 - 输出

速度等级

无线电频率系列/标准

收发器数量

天线类型

绝对牵引范围 (APR)

敏感度

数据率(最大)

ADC通道数量

主要属性

串行接口

接收电流

传输电流

逻辑单元数

定时器数量

调制

核数量

[医]GPIO

闪光大小

特征

产品类别

高度

座位高度(最大)

长度

宽度

触点表面处理厚度 - 配套

材料可燃性等级

评级结果

ATWINC1500B-MU-Y042 ATWINC1500B-MU-Y042

Atmel (Microchip Technology) 数据表

N/A

-

最小起订量: 1

倍率: 1

2.7 V

4.2 V

61 mA

268 mA

- 40 C

+ 85 C

64 kB, 128 kB

RAM

I2C, SPI, UART

48 MHz

SMD/SMT

490

QFN-40

72.2 Mbps

Tray

Wi-Fi

2.4 GHz

Flash

4 MB

18.5 dBm

32 bit

- 74 dBm

0.85 mm

5 mm

5 mm

ESP8684H2 ESP8684H2

Espressif Systems 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

3 V

62 mA

370 mA

- 40 C

+ 105 C

272 kB

SRAM

GPIO, I2C, SPI, UART

120 MHz

SMD/SMT

5000

Tape & Reel (TR)

ESP8684

活跃

3.6 V

QFN-24

24-QFN (4x4)

Espressif Systems

72.2 Mbps

-40°C ~ 105°C

ESP8684

Bluetooth, Wi-Fi

3V ~ 3.6V

2.402GHz ~ 2.48GHz, 2.412GHz ~ 2.484GHz

2.4 GHz

576KB ROM, 272KB SRAM

Flash

2 MB

20 dBm

802.11b/g/n, Bluetooth v5.0

21.5dBm

Bluetooth, WiFi

- 106.5 dBm

72.2Mbps

5 Channel

ADC, GPIO, I²C, I²S, PWM, SPI, UART

65mA

300mA ~ 370mA

3

-

14

0.85 mm

4 mm

4 mm

ESP32-S3FH4R2 ESP32-S3FH4R2

Espressif Systems 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

150 Mbps

1.8 V

91 mA

340 mA

- 40 C

+ 105 C

2 MB

PSRAM

SPI

240 MHz

SMD/SMT

45 I/O

LX7

2000

Tape & Reel (TR)

ESP32-S3

活跃

3.6 V

QFN-56

Espressif Systems

This product may require additional documentation to export from the United States.

-40°C ~ 85°C (TA)

ESP32

Bluetooth, Wi-Fi

3V ~ 3.6V

2.4GHz

2.4 GHz

2MB Flash, 2MB SRAM

Flash

4 MB

21 dBm

150Mbps

32 bit

ESP32-S3R8

802.11b/g/n, Bluetooth v5.0

21dBm

Bluetooth, WiFi

不包括天线

- 76.5 dBm

20 Channel

ADC, GPIO, I²C, I²S, IrDA, JTAG, PCM, PWM, SDIO, SPI, UART, USB

88mA ~ 91mA

283mA ~ 340mA

8

-

0.85 mm

7 mm

7 mm

XC7Z007S-1CLG400C XC7Z007S-1CLG400C

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Free Hanging (In-Line)

Bulk

Plastic

活跃

Copper Alloy

Gold

100

XC7Z007

400-LFBGA, CSPBGA

-

Thermoplastic

400-CSPBGA (17x17)

Thermoplastic

Thermoplastic

Conxall/Switchcraft

600VAC/DC

-40°C ~ 85°C

Multi-Con-X®, Insta-Click™

焊杯

Plug, Male Pins

4

Black

-

卡口锁

因线规而异

Keyed

Unshielded

IP67 - Dust Tight, Waterproof

-

-

667MHz

256KB

-

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

0.280 ~ 0.290 (7.11mm ~ 7.37mm)

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

Backshell, UV Resistant

-

UL94 HB

XCZU15EG-2FFVB1156I XCZU15EG-2FFVB1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

活跃

328

XCZU15

4-SMD, No Lead

1156-FCBGA (35x35)

SiTime

Tape & Reel (TR)

-40°C ~ 85°C

SiT8208

0.197 L x 0.126 W (5.00mm x 3.20mm)

XO (Standard)

2.5V

66.666 MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

0.031 (0.80mm)

-

XCZU19EG-L2FFVC1760E XCZU19EG-L2FFVC1760E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

512

XCZU19

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

PEI-Genesis

Bulk

0°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XCZU46DR-2FSVH1760E XCZU46DR-2FSVH1760E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

574

Tray

活跃

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

--

0°C ~ 100°C (TJ)

--

活跃

533MHz, 1.333GHz

256KB

--

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU5EG-3FBVB900E XCZU5EG-3FBVB900E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU5

活跃

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

0°C ~ 100°C (TJ)

*

活跃

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XAZU3EG-1SBVA484Q XAZU3EG-1SBVA484Q

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XAZU3

活跃

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

128

-40°C ~ 125°C (TJ)

*

活跃

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

LS1046AMN3T1A LS1046AMN3T1A

Teledyne LeCroy 数据表

N/A

-

最小起订量: 1

倍率: 1

AGFB027R24C2E3E AGFB027R24C2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

744

-

-

Glenair

零售包装

0°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFA006R16A2E4X AGFA006R16A2E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Panel Mount, Through Hole

Metal

活跃

Copper Alloy

Gold

384

-

Flange

Aluminum

-

Glenair

零售包装

-65°C ~ 175°C

806

Solder

Receptacle, Female Sockets

橄榄色

Threaded

B

橄榄色镉

24-20A

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

AGFC023R25A1I1V AGFC023R25A1I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

通孔

活跃

-

480

Radial

-

Polypropylene (PP), Metallized

Nichicon

Bulk

-25°C ~ 85°C

EEC

2.283 L x 1.024 W (58.00mm x 26.00mm)

-5%, +10%

PC引脚

通用型

22 µF

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

-

1.614 (41.00mm)

-

XA7Z030-1FBG484I XA7Z030-1FBG484I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Free Hanging (In-Line)

MB1JJN

1.0mm (5), 2.0mm (4)

活跃

130

484-BBGA, FCBGA

-

Circular

锌压铸件

484-FCBGA (23x23)

Polyamide (PA66), Nylon 6/6

Amphenol Sine Systems Corp

Bulk

-20°C ~ 130°C

MotionGrade™ M23 Power Standard Series, Threaded

插座外壳

用于公引脚

9 (5 + 3 Power + PE)

Threaded

Crimp

Keyed

Shielded

IP67 - Dust Tight, Waterproof

Nickel

M23-9

Silver

不包括触点

667MHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Kintex™-7 FPGA, 125K Logic Cells

-

-

UL94 V-0

XC7Z012S-2CLG485I XC7Z012S-2CLG485I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

150

XC7Z012

1206 (3216 Metric)

1206

Stackpole Electronics Inc

Bulk

-55°C ~ 155°C

RMEF

0.120 L x 0.063 W (3.05mm x 1.60mm)

±1%

2

±100ppm/°C

22.1 Ohms

厚膜

0.25W, 1/4W

-

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Artix™-7 FPGA, 55K Logic Cells

-

Automotive AEC-Q200

0.028 (0.70mm)

AEC-Q200

XCZU7CG-1FFVC1156I XCZU7CG-1FFVC1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

360

XCZU7

1156-BBGA, FCBGA

1156-FCBGA (35x35)

PEI-Genesis

Bulk

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

AGFB027R24C2I2V AGFB027R24C2I2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

744

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

XCZU7CG-L2FFVF1517E XCZU7CG-L2FFVF1517E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU7

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

464

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2L

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

XCZU4CG-1SFVC784I XCZU4CG-1SFVC784I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU4

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

10AS066H1F34I1HG 10AS066H1F34I1HG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

492

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

- 40 C

24

SMD/SMT

82500 LAB

973529

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

10AS066H1F34I1HG

活跃

INTEL CORP

5.66

SoC FPGA

1152-BBGA, FCBGA

1152-FBGA (35x35)

KYOCERA AVX

Bulk

-40°C ~ 100°C (TJ)

Tray

*

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 660K Logic Elements

2 Core

--

SoC FPGA

10AS066K2F40E1HG 10AS066K2F40E1HG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

KJB0T

活跃

696

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

0 C

21

SMD/SMT

82500 LAB

965026

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

10AS066K2F40E1HG

活跃

INTEL CORP

5.66

SoC FPGA

1517-BBGA, FCBGA

1517-FBGA (40x40)

ITT Cannon, LLC

Bulk

0°C ~ 100°C (TJ)

Tray

*

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 660K Logic Elements

2 Core

--

SoC FPGA

10AS066H2F34I2SG 10AS066H2F34I2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

LZ52C

55 Ohms

最后一次购买

492

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

1

SMD/SMT

82500 LAB

973532

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS066H2F34I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

SoC FPGA

1206 (3216 Metric)

YES

1206

1152

Diodes Incorporated

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-65°C ~ 175°C (TJ)

Tray

-

±2%

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

100 nA @ 15 V

1.5 V @ 200 mA

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

500 mW

MCU, FPGA

492

3.65 mm

现场可编程门阵列

20 V

FPGA - 660K Logic Elements

660000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS048H4F34I3LG 10AS048H4F34I3LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

活跃

492

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS048H4F34I3LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

HC-49/US

YES

1152

Suntsu Electronics, Inc.

Bulk

-20°C ~ 70°C

Tray

SXTHM2

0.524 L x 0.197 W (13.30mm x 5.00mm)

活跃

兆赫晶体

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

30 MHz

±50ppm

S-PBGA-B1152

492

不合格

30 Ohms

0.9 V

INDUSTRIAL

18pF

1.5GHz

256KB

Fundamental

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

±20ppm

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

0.177 (4.50mm)

35 mm

35 mm

1SX250LU2F50E2VG 1SX250LU2F50E2VG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

704

PEI-Genesis

Bulk

0°C ~ 100°C (TJ)

Tray

*

活跃

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 2500K Logic Elements

--

10AS032E1F27I1HG 10AS032E1F27I1HG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

240

2 x 32 kB

1.2 GHz

320000 LE

+ 100 C

- 40 C

40

SMD/SMT

40000 LAB

965053

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

10AS032E1F27I1HG

活跃

INTEL CORP

5.66

SoC FPGA

672-BBGA, FCBGA

672-FBGA (27x27)

KYOCERA AVX

Bulk

-40°C ~ 100°C (TJ)

Tray

*

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

12 Transceiver

FPGA - 320K Logic Elements

2 Core

--

SoC FPGA