类别是'嵌入式 - 片上系统(SoC)'
嵌入式 - 片上系统(SoC) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 连接方式 | 建筑学 | 输入数量 | 可编程逻辑类型 | 主要属性 | 逻辑单元数 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||
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![]() | 5ASXBB5D4F40C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 1517-BBGA, FCBGA | YES | MCU - 208, FPGA - 540 | 0°C~85°C TJ | Tray | Arria V SX | e1 | 活跃 | 3 (168 Hours) | 锡银铜 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASXBB5 | S-PBGA-B1517 | 1.13V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 462K Logic Elements | 2.7mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||
![]() | 10AS022E3F29I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 780-BBGA, FCBGA | 288 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 220K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | 10AS027H2F35I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 270K Logic Elements | 3.5mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||||
![]() | XC7Z035-2FFV676E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 676-BBGA, FCBGA | 676-FCBGA (27x27) | 130 | 0°C~100°C TJ | Bulk | 2010 | Zynq®-7000 | 活跃 | 4 (72 Hours) | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | 1SX280LU2F50E1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | 1SX280LU3F50I2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | 5ASXMB3G4F40C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | MCU - 208, FPGA - 540 | 0°C~85°C TJ | Tray | Arria V SX | e1 | 活跃 | 3 (168 Hours) | 锡银铜 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASXMB3 | S-PBGA-B1517 | 1.13V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 350K Logic Elements | 2.7mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||
![]() | 5ASXMB3G4F40C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | MCU - 208, FPGA - 540 | 0°C~85°C TJ | Tray | 2015 | Arria V SX | e1 | 活跃 | 3 (168 Hours) | 锡银铜 | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5ASXMB3 | S-PBGA-B1517 | 1.13V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 350K Logic Elements | 2.7mm | 40mm | 40mm | 符合RoHS标准 | ||||||||||||||
![]() | 5ASXFB3H6F40C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1517-BBGA, FCBGA | MCU - 208, FPGA - 540 | 0°C~85°C TJ | Tray | Arria V SX | 活跃 | 3 (168 Hours) | 5ASXFB3 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 350K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||
![]() | 10AS022E4F27E3LG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 672-BBGA, FCBGA | YES | 240 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B672 | 240 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 现场可编程门阵列 | FPGA - 220K Logic Elements | 220000 | 3.25mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||
![]() | BCM85622IFSBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066N3F40I2SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA, FCBGA | YES | 588 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1517 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 660K Logic Elements | 3.5mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||||
![]() | 10AS066N2F40I2SGES | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1517-BBGA, FCBGA | YES | 588 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1517 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 660K Logic Elements | 3.5mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||||
![]() | 10AS048E1F29E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 780-BBGA, FCBGA | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | 10AS066H2F34I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | e1 | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 0.92-0.98 V SUPPLY | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 660K Logic Elements | 3.5mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||
![]() | 1SX280LN2F43E2VGS1 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1760-BBGA, FCBGA | 688 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | 5ASXBB5D6F40C6N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 1517-BBGA, FCBGA | MCU - 208, FPGA - 540 | 0°C~85°C TJ | Tray | Arria V SX | 活跃 | 3 (168 Hours) | 5ASXBB5 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 462K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||
![]() | 10AS048K1F35E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 396 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||
![]() | 10AS048K2F35E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 396 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.5mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||
![]() | 10AS048H2F34E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 492 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.65mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||
![]() | 10AS048E2F29E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | YES | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B780 | 360 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.35mm | 29mm | 29mm | 符合RoHS标准 | |||||||||||||
![]() | XAZU5EV-L1SFVC784I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | -40°C | YES | 100°C | 活跃 | 3 (168 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 0.8mm | 未说明 | S-PBGA-B784 | INDUSTRIAL | 微处理器电路 | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | 10AS048H1F34I1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1152 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 480K Logic Elements | 3.65mm | 35mm | 35mm | 符合RoHS标准 | |||||||||||||||||||||
![]() | 10AS048E1F29E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 780-BBGA, FCBGA | YES | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B780 | 360 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.35mm | 29mm | 29mm | 符合RoHS标准 | |||||||||||||
![]() | 10AS048H1F34E1SG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | YES | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 0.9V | 1mm | 未说明 | S-PBGA-B1152 | 492 | 不合格 | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | 3.65mm | 35mm | 35mm | 符合RoHS标准 |