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类别是'嵌入式 - 片上系统（SoC）'

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产品类别
AGFB012R24C2E4X AGFB012R24C2E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

744

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

AGFA012R24C3I3E AGFA012R24C3I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

744

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

AGFA012R24C2E1V AGFA012R24C2E1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

744

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

XCVC1902-2LLIVSVA2197 XCVC1902-2LLIVSVA2197

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

AMD

770

-40°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

AGFA027R25A2E4X AGFA027R25A2E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

624

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

XCZU7EV-2FBVB900I XCZU7EV-2FBVB900I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

900-BBGA, FCBGA

Tray

XCZU7

活跃

900-FCBGA (31x31)

AMD

204

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

TDA4VM88TGBALFR TDA4VM88TGBALFR

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

827-BFBGA, FCBGA

德州仪器

德州仪器

226

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

ARM Microcontrollers - MCU

827-FCBGA (24x24)

德州仪器

250

-40°C ~ 105°C (TJ)

Automotive, AEC-Q100

Microcontrollers - MCU

2GHz, 1GHz, 1.35GHz, 1GHz

1.5MB

ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

DMA, PWM, WDT

MCAN, MMC/SDSD/IOI²C, SPI, UART, USB

DSP, MCU, MPU

-

-

ARM Microcontrollers - MCU

TDA4VM88TGBALFRQ1 TDA4VM88TGBALFRQ1

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

827-BFBGA, FCBGA

250

德州仪器

德州仪器

226

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

2 GHz

+ 125 C

- 40 C

SMD/SMT

ARM Microcontrollers - MCU

827-FCBGA (24x24)

德州仪器

有

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100

Microcontrollers - MCU

760 mV to 840 mV

2GHz, 1GHz, 1.35GHz, 1GHz

1.5MB

ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

DMA, PWM, WDT

MCAN, MMC/SDSD/IOI²C, SPI, UART, USB

DSP, MCU, MPU

64 bit

-

-

ARM Microcontrollers - MCU

XCZU6EG-1FFVC900I XCZU6EG-1FFVC900I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

900-BBGA, FCBGA

Tray

XCZU6

活跃

900-FCBGA (31x31)

AMD

204

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCZU15EG-1FFVB1156E XCZU15EG-1FFVB1156E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1156-BBGA, FCBGA

Tray

XCZU15

活跃

1156-FCBGA (35x35)

AMD

328

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

AGFA027R25A2E4F AGFA027R25A2E4F

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

624

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

XCVC1902-1LSIVSVD1760 XCVC1902-1LSIVSVD1760

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1760-BFBGA, FCBGA

Tray

活跃

1760-FCBGA (40x40)

AMD

692

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU5EV-L1SFVC784I XCZU5EV-L1SFVC784I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

784-BFBGA, FCBGA

Tray

XCZU5

活跃

784-FCBGA (23x23)

AMD

252

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCVM1802-1MLIVSVD1760 XCVM1802-1MLIVSVD1760

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1760-BFBGA, FCBGA

Tray

活跃

1760-FCBGA (40x40)

AMD 赛灵思

726

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

MPFS250TS-1FCSG536I MPFS250TS-1FCSG536I

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

536-LFBGA, CSPBGA

Tray

活跃

536-LFBGA

微芯片技术

MCU - 136, FPGA - 372

-40°C ~ 100°C

PolarFire™

-

2.2MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128kB

BCM53575B0KFSBG BCM53575B0KFSBG

Broadcom 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Broadcom Limited

Broadcom / Avago

Details

-

Tray

活跃

RF System on a Chip - SoC

-

Broadcom Limited

189

-

-

Wireless & RF Integrated Circuits

Si

1.25GHz

-

ARM® Cortex®-A9, ARM® Cortex®-R5

SERDES

ACL, MAC, QSGMII

MPU

-

-

RF System on a Chip - SoC

XCZU49DR-2FFVF1760I XCZU49DR-2FFVF1760I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1760-BBGA, FCBGA

Tray

活跃

1760-FCBGA (42.5x42.5)

AMD 赛灵思

622

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVC1902-2LLEVIVA1596 XCVC1902-2LLEVIVA1596

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

1596-BFBGA, FCBGA

活跃

1596-FCBGA (40x40)

AMD 赛灵思

500

0°C ~ 100°C (TJ)

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

AGFA006R16A2I3E AGFA006R16A2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

384

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

XCVC1502-1MSENSVG1369 XCVC1502-1MSENSVG1369

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

AMD

478

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

AGFA008R24C2I1V AGFA008R24C2I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

576

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

XCVC1902-2LLEVIVA1596 XCVC1902-2LLEVIVA1596

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1596-BFBGA, FCBGA

Tray

活跃

1596-FCBGA (40x40)

AMD

500

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

AGFA012R24B1E1V AGFA012R24B1E1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

768

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

XCZU5EV-1SFVC784I XCZU5EV-1SFVC784I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

784-BFBGA, FCBGA

Tray

XCZU5

活跃

784-FCBGA (23x23)

AMD

252

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XCVM1502-1MSENFVB1369 XCVM1502-1MSENFVB1369

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

AMD

478

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-