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类别是'嵌入式 - 片上系统（SoC）'

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数据表

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厂商

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JESD-609代码

零件状态

端子表面处理

最高工作温度

最小工作温度

HTS代码

子类别

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端子位置

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峰值回流焊温度（摄氏度）

端子间距

Reach合规守则

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基本部件号

JESD-30代码

输出的数量

资历状况

工作电源电压

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界面

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建筑学

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可编程逻辑类型

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产品类别

核心架构

最高频率

逻辑块数(LABs)

速度等级

收发器数量

主要属性

逻辑块数量

逻辑单元数

核数量

闪光大小

产品类别

长度

宽度

无铅
10AS027E1F27E1HG 10AS027E1F27E1HG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

672-BBGA, FCBGA

有

2 x 32 kB

1.2 GHz

270000 LE

+ 100 C

0 C

40

SMD/SMT

33750 LAB

964937

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

SoC FPGA

672-FBGA (27x27)

240

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

12 Transceiver

FPGA - 270K Logic Elements

2 Core

--

SoC FPGA

10AS027E2F27I2SG 10AS027E2F27I2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

FBGA-672

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

964922

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS027E2F27I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

SoC FPGA

YES

672

240

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

27 mm

27 mm

10AS048E3F29I2SG 10AS048E3F29I2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

FBGA-780

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

60000 LAB

965351

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

SoC FPGA

360

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 480K Logic Elements

2 Core

--

SoC FPGA

1SX250LH3F55E2LG 1SX250LH3F55E2LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

FBGA-2912

有

This product may require additional documentation to export from the United States.

4 x 32 kB

1 GHz

2500000 LE

+ 100 C

0 C

10

SMD/SMT

312500 LAB

956199

Intel

Intel / Altera

Stratix

Details

4 x 32 kB

-

SoC FPGA

1160

0°C ~ 100°C (TJ)

Tray

Stratix® 10 SX

活跃

SOC - Systems on a Chip

0.85 V

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

24 Transceiver

FPGA - 2500K Logic Elements

4 Core

--

SoC FPGA

AGFB012R24B3I3E AGFB012R24B3I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

768

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

XCVE1752-2MSENSVG1369 XCVE1752-2MSENSVG1369

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

AMD

500

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

AGFA022R31C2E2V AGFA022R31C2E2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

AGFD019R25A2E3E AGFD019R25A2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFD019R25A2I3E AGFD019R25A2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

480

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFB006R24C2E3E AGFB006R24C2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

576

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

XC7Z035-3FBG676E XC7Z035-3FBG676E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

676-BBGA, FCBGA

Tray

XC7Z035

活跃

676-FCBGA (27x27)

AMD

130

0°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

-

10AS027E1F29I1SG 10AS027E1F29I1SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

780-BBGA, FCBGA

Non-Compliant

780-FBGA (29x29)

360

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

Discontinued at Digi-Key

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 270K Logic Elements

--

XCVC1702-1LLIVSVA2197 XCVC1702-1LLIVSVA2197

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

2197-BFBGA, FCBGA

Tray

活跃

2197-FCBGA (45x45)

AMD

608

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XC7Z015-1CLG485I XC7Z015-1CLG485I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

485-LFBGA, CSPBGA

Tray

XC7Z015

活跃

485-CSPBGA (19x19)

AMD

130

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 74K Logic Cells

-

5CSXFC6D6F31C6N 5CSXFC6D6F31C6N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

896-BGA

Compliant

64KB

896

896-FBGA (31x31)

MCU - 181, FPGA - 288

0°C ~ 85°C (TJ)

Tray

Cyclone® V SX

活跃

85 °C

0 °C

925 MHz

5CSXFC6

1.13 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

925MHz

773.9 kB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

3.125 Gbps

MCU, FPGA

110000

ARM

800 MHz

41509

6

9

FPGA - 110K Logic Elements

--

无铅

5ASXMB3E4F31C6N 5ASXMB3E4F31C6N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

896-BBGA, FCBGA

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXMB3E4F31C6N

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

1.13 V

5.28

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

Obsolete

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB3

S-PBGA-B896

540

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

31 mm

31 mm

5ASXFB5G4F35C4N 5ASXFB5G4F35C4N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

1152-BBGA, FCBGA

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXFB5G4F35C4N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

5.28

YES

1152-FBGA (35x35)

1152

MCU - 208, FPGA - 385

0°C ~ 85°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

BOTTOM

BALL

未说明

1 mm

compliant

5ASXFB5

S-PBGA-B1152

540

不合格

1.1,1.2/3.3,2.5 V

商业扩展

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

35 mm

35 mm

5ASXMB5E4F31I3N 5ASXMB5E4F31I3N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

896-BBGA, FCBGA

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.15 V

未说明

1.12 V

100 °C

有

5ASXMB5E4F31I3N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.18 V

5.28

YES

896-FBGA (31x31)

896

MCU - 208, FPGA - 250

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB5

S-PBGA-B896

540

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

31 mm

31 mm

5ASTFD3G3F35I3N 5ASTFD3G3F35I3N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

1152-BBGA, FCBGA

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.15 V

未说明

1.12 V

100 °C

有

5ASTFD3G3F35I3N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.18 V

5.29

YES

1152-FBGA (35x35)

1152

MCU - 208, FPGA - 385

-40°C ~ 100°C (TJ)

Tray

Arria V ST

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASTFD3

S-PBGA-B1152

385

INDUSTRIAL

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

385

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

35 mm

35 mm

5CSXFC6C6U23C7N 5CSXFC6C6U23C7N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

672-FBGA

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

1.1 V

未说明

1.07 V

85 °C

有

5CSXFC6C6U23C7N

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.56

YES

672-UBGA (23x23)

672

MCU - 181, FPGA - 145

0°C ~ 85°C (TJ)

Tray

Cyclone® V SX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSXFC6

S-PBGA-B672

145

不合格

1.1,1.2/3.3,2.5 V

OTHER

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

FPGA - 110K Logic Elements

110000

--

23 mm

23 mm

XCVM1802-2LLIVSVD1760 XCVM1802-2LLIVSVD1760

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

AMD

500

-40°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVE1752-2MSEVSVA1596 XCVE1752-2MSEVSVA1596

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1596-BFBGA, FCBGA

Tray

活跃

AMD

500

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

AGFB022R31C2E1V AGFB022R31C2E1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

720

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

10AS032 10AS032

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

Intel

Bulk

-

AGFA014R24C2E1V AGFA014R24C2E1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

-

Tray

活跃

-

Intel

744

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-