类别是'嵌入式 - 片上系统(SoC)'
嵌入式 - 片上系统(SoC) (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 包装/外壳 | 引脚数 | 供应商器件包装 | 厂商 | 操作温度 | 系列 | 最高工作温度 | 最小工作温度 | HTS代码 | Reach合规守则 | 频率 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 核心架构 | 主要属性 | 闪光大小 | |||||||||||
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![]() | AGFA022R31C2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 720 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||
![]() | A2F500M3G-1FG256M | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256-LBGA | MCU - 25, FPGA - 66 | Tray | A2F500 | 活跃 | 无 | A2F500M3G-1FG256M | Microsemi Corporation | 活跃 | MICROSEMI CORP | 2.54 | 256 | 256-FPBGA (17x17) | 微芯片技术 | Non-Compliant | -55°C ~ 125°C (TJ) | SmartFusion® | 125 °C | -55 °C | 8542.39.00.01 | unknown | 100 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |
![]() | AGFB019R25A2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 480 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||
![]() | AGFC019R25A3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 480 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||
![]() | AGFB008R24C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 576 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||
![]() | XCVC1902-1LSEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1596-BFBGA, FCBGA | Tray | 活跃 | 1596-FCBGA (40x40) | AMD | 500 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||
![]() | AGFB027R25A1E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 624 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||
![]() | AGFA014R24C2I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 744 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||
![]() | XCZU9EG-2FFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 900-BBGA, FCBGA | Tray | XCZU9 | 活跃 | 900-FCBGA (31x31) | AMD | 204 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||
![]() | AGIB022R31B2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 720 | -40°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||
![]() | XCZU15EG-2FFVC900E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 900-BBGA, FCBGA | Tray | XCZU15 | 活跃 | 900-FCBGA (31x31) | AMD | 204 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||
![]() | XCZU5CG-1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 784-BFBGA, FCBGA | Tray | XCZU5 | 活跃 | 784-FCBGA (23x23) | AMD | 252 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||
![]() | AGFB023R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 480 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||
![]() | XCZU2CG-1SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 625-BFBGA, FCBGA | Tray | XCZU2 | 活跃 | 625-FCBGA (21x21) | AMD | 180 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||
![]() | 1SX065HH3F35E1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1152-BBGA, FCBGA | Tray | 活跃 | 1152-FBGA (35x35) | Intel | 392 | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | |||||||||||||||||
![]() | AGFB014R24B2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 768 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||
![]() | XCZU7EG-2FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 900-BBGA, FCBGA | Tray | XCZU7 | 活跃 | 900-FCBGA (31x31) | AMD | 204 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||
![]() | AGFA006R16A3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 384 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||
![]() | PCIMX6QP6AVT1AA | NXP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Non-Compliant | ||||||||||||||||||||||||||||||||
![]() | AGFA022R24C2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 744 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||
![]() | XCZU19EG-3FFVE1924E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1924-BBGA, FCBGA | Tray | XCZU19 | 活跃 | 1924-FCBGA (45x45) | AMD | 668 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | ||||||||||||||||
![]() | XC7Z020-1CLG484I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 484-LFBGA, CSPBGA | Tray | XC7Z020 | 活跃 | 484-CSPBGA (19x19) | AMD | 130 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | ||||||||||||||||
![]() | AGFB019R25A2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 480 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||
![]() | AGFA014R24B2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 768 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||
![]() | AGFB022R31C3I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - | Tray | 活跃 | - | Intel | 720 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - |