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类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

厂商

操作温度

包装

系列

尺寸/尺寸

容差

JESD-609代码

零件状态

终止次数

温度系数

连接器类型

电阻

定位的数量

端子表面处理

最高工作温度

最小工作温度

组成

应用

行数

功率(瓦特)

HTS代码

电容量

子类别

额定功率

螺距

技术

端子位置

终端形式

峰值回流焊温度（摄氏度）

端子间距

Reach合规守则

频率

基本部件号

触点表面处理

JESD-30代码

输出的数量

资历状况

工作电源电压

失败率

引线间距

电源

温度等级

界面

内存大小

速度

内存大小

引线样式

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

产品类别

核心架构

主要属性

逻辑块数量

逻辑单元数

核数量

闪光大小

特征

产品类别

座位高度(最大)

长度

宽度

厚度（最大）

触点表面处理厚度

板上高度

评级结果
XCZU19EG-3FFVB1517E XCZU19EG-3FFVB1517E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

SEAM8-30

10mm

活跃

644

表面贴装

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Samtec Inc.

Strip

0°C ~ 100°C (TJ)

SEARAY™ SEAM

High Density Array, Male

300

10

0.031 (0.80mm)

Gold

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

电路板指南

30.0µin (0.76µm)

0.297 (7.54mm)

XC7Z010-2CLG400E XC7Z010-2CLG400E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XC7Z010

活跃

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

130

0°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 28K Logic Cells

-

AGFB027R24C3E4X AGFB027R24C3E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

744

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFB014R24C2E3E AGFB014R24C2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

744

Tray

活跃

-

-

Intel

Non-Compliant

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

5ASXFB5G4F35C6N 5ASXFB5G4F35C6N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

DL64R

活跃

MCU - 208, FPGA - 385

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

1.1 V

未说明

1.07 V

85 °C

有

5ASXFB5G4F35C6N

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

1.13 V

5.28

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

TE Connectivity Deutsch 连接器

Bag

0°C ~ 85°C (TJ)

Tray

*

e1

Obsolete

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

BOTTOM

BALL

未说明

1 mm

compliant

5ASXFB5

S-PBGA-B1152

540

不合格

1.1,1.2/3.3,2.5 V

商业扩展

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

35 mm

35 mm

10AS022E4F29E3LG 10AS022E4F29E3LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

RN732A

Obsolete

288

Non-Compliant

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

220000 LE

1

SMD/SMT

27500 LAB

965042

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

未说明

0.87 V

100 °C

有

10AS022E4F29E3LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

SoC FPGA

0805 (2012 Metric)

YES

0805

780

KOA Speer Electronics, Inc.

Tape & Reel (TR)

-55°C ~ 155°C

Tray

RN73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.05%

活跃

2

±10ppm/°C

2.84 kOhms

Thin Film

0.1W, 1/10W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

288

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

3.35 mm

现场可编程门阵列

FPGA - 220K Logic Elements

220000

2 Core

--

Moisture Resistant

SoC FPGA

0.024 (0.60mm)

29 mm

29 mm

10AS027H2F35E1SG 10AS027H2F35E1SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

3Z4S-LE

活跃

384

Non-Compliant

1152-BBGA, FCBGA

1152-FBGA (35x35)

欧姆龙自动化与安全

Bulk

0°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 270K Logic Elements

--

5CSEBA2U23C7SN 5CSEBA2U23C7SN

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

Compliant

64KB

672-FBGA

672

672-UBGA (23x23)

MCU - 181, FPGA - 145

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

85 °C

0 °C

800 MHz

1.1 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

800MHz

1.5 MB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

25000

ARM

FPGA - 25K Logic Elements

--

AGFB023R25A1I1V AGFB023R25A1I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

480

Tray

活跃

-

-

Intel

Non-Compliant

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGID019R18A2E2V AGID019R18A2E2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

480

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

10AS066H2F34I1HG 10AS066H2F34I1HG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

RN55

活跃

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

- 40 C

24

SMD/SMT

82500 LAB

965020

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

SoC FPGA

Axial

Axial

Vishay Dale

Bulk

-65°C ~ 175°C

Tray

Military, MIL-R-10509/7, RN55

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±1%

活跃

2

±50ppm/°C

69.8 Ohms

Metal Film

0.125W, 1/8W

SOC - Systems on a Chip

950 mV

-

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 660K Logic Elements

2 Core

--

Flame Retardant Coating, Military, Moisture Resistant, Safety

SoC FPGA

-

AGFB022R25A2E4F AGFB022R25A2E4F

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

CDR32

活跃

50V

624

Surface Mount, MLCC

1206 (3216 Metric)

-

Vishay Vitramon

Tape & Reel (TR)

-55°C ~ 125°C

Military, MIL-PRF-55681, CDR32

0.126 L x 0.063 W (3.20mm x 1.60mm)

±10%

BX

高可靠性

0.022 µF

R (0.01%)

-

1.4GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

-

-

0.051 (1.30mm)

-

AGFA027R31C2E2VAA AGFA027R31C2E2VAA

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

VJ0402

Tape & Reel (TR)

720

Surface Mount, MLCC

0402 (1005 Metric)

-

Vishay Vitramon

50V

-55°C ~ 125°C

VJ HIFREQ

0.040 L x 0.020 W (1.02mm x 0.51mm)

±0.25pF

C0G, NP0

RF, Microwave, High Frequency

8.2 pF

-

1.4GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

High Q, Low Loss

-

0.024 (0.61mm)

-

XCVC1802-2LSEVSVD1760 XCVC1802-2LSEVSVD1760

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

100026

最后一次购买

692

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

Molex

Bulk

0°C ~ 100°C (TJ)

*

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCZU48DR-1FSVG1517E XCZU48DR-1FSVG1517E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

561

0°C ~ 100°C (TJ)

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVC1802-1LLIVSVD1760 XCVC1802-1LLIVSVD1760

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

RAM, SRAM

692

Tray

活跃

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

Non-Compliant

-40°C ~ 100°C (TJ)

Versal™ AI Core

85 °C

-40 °C

Parallel

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCZU3EG-1SFVC784I XCZU3EG-1SFVC784I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU3

活跃

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XC7Z045-2FFG900E XC7Z045-2FFG900E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XC7Z045

活跃

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

130

0°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

AGFA012R24B2E4X AGFA012R24B2E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

768

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

AGFB027R31C2E2VAA AGFB027R31C2E2VAA

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

720

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

BCM47622LA1KFEBG BCM47622LA1KFEBG

AVAGO 数据表

N/A

-

最小起订量: 1

倍率: 1

200 V

500 mW

XCZU47DR-2FSVG1517E XCZU47DR-2FSVG1517E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

561

Tray

活跃

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

Non-Compliant

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU7EV-2FBVB900E XCZU7EV-2FBVB900E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XCZU7

活跃

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

AGFB019R25A2E3V AGFB019R25A2E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

480

-

-

Intel

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFB022R31C3E3V AGFB022R31C3E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

720

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-