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JESD-609代码

无铅代码

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端子表面处理

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产品类别

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知识产权评级

座位高度(最大)

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宽度

XCVM1802-2LSEVSVD1760 XCVM1802-2LSEVSVD1760

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

ABB

Panel, Wall

726

Tray

活跃

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

ACH550-BCR-032A-6+B058

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

60 Hz

Versal™ Prime FPGA, 1.9M Logic Cells

-

断路器

575 VAC

IP58

XC7Z020-2CLG400E XC7Z020-2CLG400E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XC7Z020

活跃

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

130

0°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

AGFA027R24C2E4X AGFA027R24C2E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

744

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFA022R25A2I2V AGFA022R25A2I2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

624

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XC7Z030-1FBG676I XC7Z030-1FBG676I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XC7Z030

活跃

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

130

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

M2S010-1VF256 M2S010-1VF256

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

LFBGA, BGA256,16X16,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

85 °C

M2S010-1VF256

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

2.49

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

138

0°C ~ 85°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

400Kbit

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

XCZU47DR-1FFVE1156E XCZU47DR-1FFVE1156E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FFVG1517I XCZU43DR-2FFVG1517I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1.8/2.5/3.3 V

FCBGA

6

表面贴装

561

Tray

活跃

Industrial grade

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

RISC

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

1517

3.3 V

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-R5

XCZU47DR-2FFVE1156E XCZU47DR-2FFVE1156E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

LS1046AMN3Q1AEM LS1046AMN3Q1AEM

Teledyne LeCroy 数据表

N/A

-

最小起订量: 1

倍率: 1

M2S060TS-1FGG676 M2S060TS-1FGG676

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Tray

M2S060

活跃

Compliant

676-BGA

676-FBGA (27x27)

微芯片技术

387

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

256KB

M2S150TS-FCV484 M2S150TS-FCV484

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

VFBGA-484

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

85 °C

M2S150TS-FCV484

FBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.87

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

273

0°C ~ 85°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B484

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

1 Core

512KB

19 mm

19 mm

XCZU47DR-1FFVE1156I XCZU47DR-1FFVE1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

MPFS250T-FCG1152EES MPFS250T-FCG1152EES

Microchip 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

MCU - 136, FPGA - 372

0°C ~ 100°C

PolarFire™

-

2.2MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128kB

XCZU49DR-L2FFVF1760I XCZU49DR-L2FFVF1760I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

622

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-L2FSVE1156I XCZU48DR-L2FSVE1156I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVM1402-2MLINSVF1369 XCVM1402-2MLINSVF1369

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1369-BFBGA

1369-BGA (35x35)

AMD

424

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVE1752-2LSEVSVA2197 XCVE1752-2LSEVSVA2197

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

608

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

XCZU1EG-L2UBVA494E XCZU1EG-L2UBVA494E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

494-WFBGA, FCBGA

494-FCBGA (14x14)

AMD

82

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

Zynq®UltraScale+™ FPGA, 81K+ Logic Cells

-

XCVM1802-2MLIVSVA2197 XCVM1802-2MLIVSVA2197

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVC1802-2MLIVSVA2197 XCVC1802-2MLIVSVA2197

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVC1902-2MLIVSVA2197 XCVC1902-2MLIVSVA2197

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

5CSEMA6F31C8N 5CSEMA6F31C8N

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

Cyclone V SE

1.8 V

FBGA

+85 °C

0 °C

224 (18 x 18)

3.3 V

Compliant

64KB

表面贴装

1206 (3216 Metric), Concave, Long Side Terminals

8

--

MCU - 181, FPGA - 288

-55°C ~ 155°C

Tape & Reel (TR)

RACF

0.126 L x 0.063 W (3.20mm x 1.60mm)

±5%

活跃

±200ppm/°C

85 °C

0 °C

Automotive AEC-Q200

5CSEMA6

896

1.13 V

3.3 V

1.8 V

600MHz

773.9 kB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

4

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Isolated

62.5mW

110000

110000

800 MHz

41509

8

FPGA - 110K Logic Elements

--

166036

110000

5.1k

--

--

0.030 (0.75mm)

31mm

31mm

10AS016C3U19E2SG 10AS016C3U19E2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

Non-Compliant

2 x 32 kB

1.2 GHz

160000 LE

0.423288 oz

1

SMD/SMT

20000 LAB

964674

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

SoC FPGA

Axial

Axial

192

-65°C ~ 175°C

Tape & Reel (TR)

Military, MIL-PRF-55182/07, RNC50

0.070 Dia x 0.150 L (1.78mm x 3.81mm)

±1%

活跃

2

±25ppm/°C

6.81 kOhms

Metal Film

0.1W, 1/10W

SOC - Systems on a Chip

S (0.001%)

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 160K Logic Elements

2 Core

--

Military, Moisture Resistant, Weldable

SoC FPGA

--

AGFB027R31C2I1V AGFB027R31C2I1V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

720

-

-

PEI-Genesis

Bulk

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-