你好！请登入 免费注册

我的订单 我的询价 0755-82520436 3307104213

购物车
所有分类 首页 品牌专区 询价 关于我们
首页 / 全部商品 / category.null / category.null /

类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

生命周期状态

包装/外壳

表面安装

供应商器件包装

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

附加功能

HTS代码

技术

端子位置

终端形式

峰值回流焊温度（摄氏度）

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

输入数量

座位高度-最大

可编程逻辑类型

速度等级

主要属性

逻辑单元数

核数量

闪光大小

长度

宽度
M2S060-VF400I M2S060-VF400I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

90

SmartFusion2

207

Tray

M2S060

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

无

M2S060-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S005-TQG144I M2S005-TQG144I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

84 I/O

- 40 C

+ 100 C

191 kbit

有

505 LAB

60

0.046530 oz

1.2000 V

1.14 V

1.26 V

Tray

M2S005

活跃

TQFP-144

144-TQFP (20x20)

微芯片技术

Details

-40 to 100 °C

Tray

SmartFusion2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

FPGA - 5K Logic Modules

1 Core

128KB

M2S025TS-VFG256I M2S025TS-VFG256I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

138

Tray

M2S025

活跃

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S010T-1VFG400 M2S010T-1VFG400

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

90

2.5, 3.3 V

1.14 V

1.26 V

195

Tray

M2S010

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

1.14 V

85 °C

有

M2S010T-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

VFPBGA-400

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

40

S-PBGA-B400

195

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

M2S060T-FGG484I M2S060T-FGG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

1.2000 V

1.14 V

1.26 V

267

Tray

M2S060

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

有

M2S060T-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.8

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 60K Logic Modules

56520

1 Core

256KB

23 mm

23 mm

M2S005S-VF400 M2S005S-VF400

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

90

169

Tray

M2S005

活跃

400-LFBGA

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S090TS-FGG676 M2S090TS-FGG676

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

40

425

Tray

M2S090

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

40

1.14 V

85 °C

有

M2S090TS-FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

M2S025TS-1VFG256I M2S025TS-1VFG256I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

138

Tray

M2S025

活跃

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S060TS-FGG484I M2S060TS-FGG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

60

SmartFusion2

267

Tray

M2S060

活跃

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

M2S010-1FGG484I M2S010-1FGG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

60

1.2000 V

233

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

有

M2S010-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

1

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

M2S150-1FCV484I M2S150-1FCV484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

84

1.2000 V

273

Tray

M2S150

活跃

484-BFBGA

484-FBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 150K Logic Modules

1 Core

512KB

M2S150-1FCV484 M2S150-1FCV484

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

166 MHz

-

-

64 kB

146124 LE

有

12177 LAB

84

273

Tray

M2S150

活跃

484-BFBGA

484-FBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S005-1VF256I M2S005-1VF256I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

119

161

Tray

M2S005

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

无

M2S005-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

161

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

161

1.56 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

1 Core

128KB

14 mm

14 mm

M2S005-1FG484 M2S005-1FG484

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

60

1.2000 V

1.14 V

1.26 V

209

活跃

M2S005

Tray

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 5K Logic Modules

1 Core

128KB

M2S025-1VFG256I M2S025-1VFG256I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

119

138

Tray

M2S025

活跃

256-LBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S005S-1VF256 M2S005S-1VF256

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

166 MHz

-

-

64 kB

6060 LE

有

505 LAB

119

161

Tray

M2S005

活跃

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

1 Core

128KB

M2S025TS-FCSG325 M2S025TS-FCSG325

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Details

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

176

180

Tray

M2S025

活跃

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S010T-FG484 M2S010T-FG484

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

60

1.2000 V

233

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

85 °C

无

M2S010T-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.84

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

M2S060T-1VF400I M2S060T-1VF400I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

N

166 MHz

-

-

64 kB

56520 LE

有

4710 LAB

90

SmartFusion2

207

Tray

M2S060

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

无

M2S060T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

207

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

17 mm

17 mm

M2S090T-1FGG484M M2S090T-1FGG484M

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

有

7193 LAB

60

267

Tray

M2S090

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

40

1.14 V

125 °C

有

M2S090T-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

FPBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e1

3A001.A.2.C

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S010TS-VF256I M2S010TS-VF256I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 1 month ago)

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

有

1007 LAB

119

138

Tray

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

无

M2S010TS-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.87

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S025TS-FCSG325I M2S025TS-FCSG325I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

176

180

Tray

M2S025

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

有

M2S025TS-FCSG325I

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

180

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm

M2S050-1FCS325 M2S050-1FCS325

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

N

SMD/SMT

166 MHz

-

-

64 kB

56340 LE

有

4695 LAB

176

200

Tray

M2S050

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

无

M2S050-1FCS325

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

M2S025T-VFG256 M2S025T-VFG256

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Production (Last Updated: 2 months ago)

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

138 I/O

0 C

+ 85 C

有

2308 LAB

119

Tray

M2S025

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

85 °C

有

M2S025T-VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

14 mm

14 mm

M2S025-1FGG484I M2S025-1FGG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

有

2308 LAB

60

267

Tray

M2S025

活跃

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB