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类别是'嵌入式 - 片上系统（SoC）'

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产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

工厂交货时间

包装/外壳

供应商器件包装

厂商

操作温度

包装

系列

零件状态

湿度敏感性等级(MSL)

引脚数量

工作电源电压

速度

内存大小

核心处理器

周边设备

程序内存大小

连接方式

建筑学

数据总线宽度

筛选水平

速度等级

主要属性

寄存器数量

核数量

闪光大小

设备核心

RoHS状态
AGIA035R39A2I2VB AGIA035R39A2I2VB

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 3.54M Logic Elements

XC7Z045-1FFG900I XC7Z045-1FFG900I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1.2, 3.3 V

FCBGA

2

表面贴装

130

Tray

XC7Z045

活跃

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Thumb-2

-40 to 100 °C

Zynq®-7000

900

1 V

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 350K Logic Cells

-

ARM Cortex A9

XC7Z030-2FB484I XC7Z030-2FB484I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

1.2, 3.3 V

FCBGA

1

表面贴装

130

Tray

XC7Z030

活跃

484-BBGA, FCBGA

484-FCBGA (23x23)

AMD

RISC

-40 to 100 °C

Zynq®-7000

484

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 125K Logic Cells

-

ARM Cortex A9

XC7Z035-2FFG676E XC7Z035-2FFG676E

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

FCBGA

1.0000 V

0.95 V

250

1.05 V

表面贴装

130

Tray

XC7Z035

活跃

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

275,000

0 to 100 °C

Zynq®-7000

676

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2

Kintex™-7 FPGA, 275K Logic Cells

343,800

-

AGFB019R31C3I3E AGFB019R31C3I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGFA023R31C2E4X AGFA023R31C2E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGFB008R24D1E2V AGFB008R24D1E2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

2340-BFBGA Exposed Pad

2340-BGA (45x42)

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

AGIC035R39A2E3E AGIC035R39A2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

0°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 3.54M Logic Elements

AGFA023R31C3E3V AGFA023R31C3E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

R8A77970LA01BA#GB R8A77970LA01BA#GB

Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

10AS048H2F34I1HG 10AS048H2F34I1HG

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

11 Weeks

1152-BBGA, FCBGA

492

-40°C~100°C TJ

Tray

Arria 10 SX

活跃

3 (168 Hours)

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 480K Logic Elements

符合RoHS标准

MPFS160T-FCSG536E MPFS160T-FCSG536E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

活跃

Tray

FCSG-536

536-LFBGA

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160TL-FCVG484E MPFS160TL-FCVG484E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095TS-1FCSG325I MPFS095TS-1FCSG325I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Bulk

活跃

BGA-325

325-LFBGA (11x14.5)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS160T-1FCVG484E MPFS160T-1FCVG484E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

FCVG-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire®

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160T-FCVG484E MPFS160T-FCVG484E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

FCVG-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS095TLS-FCSG325I MPFS095TLS-FCSG325I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Bulk

活跃

BGA-325

325-LFBGA (11x14.5)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS250T-FCVG484I MPFS250T-FCVG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

FCVG-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS095T-1FCSG325I MPFS095T-1FCSG325I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Bulk

活跃

BGA-325

325-LFBGA (11x14.5)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS095T-1FCSG325E MPFS095T-1FCSG325E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Bulk

活跃

BGA-325

325-LFBGA (11x14.5)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS095TL-FCSG325I MPFS095TL-FCSG325I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Bulk

活跃

BGA-325

325-LFBGA (11x14.5)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS160TL-FCVG484I MPFS160TL-FCVG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160T-FCVG484I MPFS160T-FCVG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

FCVG-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS160TLS-FCVG484I MPFS160TLS-FCVG484I

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

161000 LE

312 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-484

484-FCBGA (19x19)

微芯片技术

This product may require additional documentation to export from the United States.

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

1.4125MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 161K Logic Modules

5 Core

128kB

MPFS250TL-FCG1152E MPFS250TL-FCG1152E

Microchip Technology 数据表

N/A

-

最小起订量: 1

倍率: 1

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

BGA-1152

1152-FCBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB