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类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

安装类型

包装/外壳

供应商器件包装

厂商

操作温度

包装

系列

零件状态

类型

子类别

电压 - 供电

频率

工作电源电压

界面

内存大小

振荡器类型

速度

内存大小

电压 - 供电 (Vcc/Vdd)

核心处理器

周边设备

程序存储器类型

芯尺寸

程序内存大小

连接方式

建筑学

数据总线宽度

产品类别

议定书

EEPROM 大小

功率 - 输出

无线电频率系列/标准

敏感度

数据率（最大）

主要属性

串行接口

接收电流

传输电流

调制

核数量

[医]GPIO

闪光大小

产品类别

设备核心
AMA3B1KK-KCR-TB AMA3B1KK-KCR-TB

Ambiq Micro, Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

AMA3B1KK

66-UFBGA, CSPBGA

66-CSP (3.38x3.25)

37

-40°C ~ 85°C (TA)

Tape & Reel (TR)

Apollo3 Blue

活跃

96MHz

384KB

ARM® Cortex®-M4F

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

I2C, SPI, UART/USART

MCU

1MB

TDA4VE88TGAALZRQ1 TDA4VE88TGAALZRQ1

NA 数据表

N/A

-

最小起订量: 1

倍率: 1

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

155

48 kB

12.5 MHz

+ 125 C

- 40 C

SMD/SMT

32 kB

770-BFBGA, FCBGA

770-FCBGA (23x23)

德州仪器

活跃

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100

1.71 V to 1.89 V

2GHz, 1GHz, 1GHz

2MB

ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

DMA, PWM, WDT

MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB

DSP, MCU, MPU

64 bit

-

3 Core

-

XC7Z030-2FFG676I XC7Z030-2FFG676I

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

XC7Z030

活跃

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

130

-40°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

MAX32680GLR+ MAX32680GLR+

Analog Devices 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

Tray

36

100 MHz

+ 85 C

3.6 V

- 40 C

2 V

SMD/SMT

I2C, SPI, UART

128 kB

88-VFLGA Exposed Pad

88-LGA (10x10)

Analog Devices Inc./Maxim Integrated

MSL 3 - 168 hours

-40°C ~ 85°C (TA)

-

I2C, I2S, SPI, UART

100MHz

128kB

ARM® Cortex®-M4F

DMA, I²S, PWM, WDT

512KB

Bluetooth, I²C, SPI, UART

MCU

32bit

-

512kB

ARM Cortex-M4F

CY8C4146LQS-S273 CY8C4146LQS-S273

Infineon 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, Wettable Flank

A/D 16x10b, 12x12b SAR; D/A 2x7b

活跃

34

有

4900

Infineon

Infineon Technologies

Details

SoC FPGA

40-UFQFN Exposed Pad

40-QFN (6x6)

Infineon Technologies

Tray

-40°C ~ 105°C (TA)

Tray

Automotive, AEC-Q100, PSOC® 4 CY8C4100

SOC - Systems on a Chip

External, Internal

48MHz

8K x 8

1.71V ~ 5.5V

ARM® Cortex®-M0+

Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT

FLASH

32-Bit

64KB (64K x 8)

FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

-

ARM Microcontrollers - MCU

CY8C4147LQE-S273T CY8C4147LQE-S273T

Infineon 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, Wettable Flank

Tape & Reel (TR)

CY8C4147

A/D 16x10b, 20x12b SAR

活跃

有

2500

Infineon

Infineon Technologies

Details

SoC FPGA

40-UFQFN Exposed Pad

40-QFN (6x6)

Infineon Technologies

34

-40°C ~ 125°C (TA)

Reel

Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus

SOC - Systems on a Chip

External, Internal

24MHz

16K x 8

1.71V ~ 5.5V

ARM® Cortex®-M0+

Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT

FLASH

32-Bit

128KB (128K x 8)

FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

-

ARM Microcontrollers - MCU

CY8C4147AZE-S275T CY8C4147AZE-S275T

Infineon 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

Tape & Reel (TR)

CY8C4147

A/D 16x10b, 20x12b SAR

活跃

有

1500

Infineon

Infineon Technologies

Details

SoC FPGA

64-LQFP

64-TQFP (10x10)

Infineon Technologies

54

-40°C ~ 125°C (TA)

Reel

Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus

SOC - Systems on a Chip

Internal

24MHz

16K x 8

1.71V ~ 5.5V

ARM® Cortex®-M0+

Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT

FLASH

32-Bit

128KB (128K x 8)

I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

-

ARM Microcontrollers - MCU

CY8C4126LQA-S453T CY8C4126LQA-S453T

Infineon 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, Wettable Flank

Tape & Reel (TR)

CY8C4126

A/D 16x10b, 20x12b SAR

活跃

Details

Infineon Technologies

Infineon

2500

有

SoC FPGA

40-UFQFN Exposed Pad

40-QFN (6x6)

Infineon Technologies

34

-40°C ~ 85°C (TA)

Reel

PSOC® 4 CY8C4100S Plus

SOC - Systems on a Chip

Internal

24MHz

8K x 8

1.71V ~ 5.5V

ARM® Cortex®-M0+

Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT

FLASH

32-Bit

64KB (64K x 8)

I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

-

ARM Microcontrollers - MCU

CY8C4126LQE-S453 CY8C4126LQE-S453

Infineon 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, Wettable Flank

Tray

A/D 16x10b, 20x12b SAR

活跃

有

4900

Infineon

Infineon Technologies

Details

SoC FPGA

40-UFQFN Exposed Pad

40-QFN (6x6)

Infineon Technologies

34

-40°C ~ 125°C (TA)

Tray

Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus

SOC - Systems on a Chip

Internal

24MHz

8K x 8

1.71V ~ 5.5V

ARM® Cortex®-M0+

Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT

FLASH

32-Bit

64KB (64K x 8)

I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

-

ARM Microcontrollers - MCU

CY8C4126LQA-S453 CY8C4126LQA-S453

Infineon 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, Wettable Flank

Tray

A/D 16x10b, 20x12b SAR

活跃

有

4900

Infineon

Infineon Technologies

Details

SoC FPGA

40-UFQFN Exposed Pad

40-QFN (6x6)

Infineon Technologies

34

-40°C ~ 85°C (TA)

Tray

Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus

SOC - Systems on a Chip

Internal

24MHz

8K x 8

1.71V ~ 5.5V

ARM® Cortex®-M0+

Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT

FLASH

32-Bit

64KB (64K x 8)

I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

-

ARM Microcontrollers - MCU

CY8C4147LQS-S273 CY8C4147LQS-S273

Infineon 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, Wettable Flank

Tray

CY8C4147

A/D 16x10b, 20x12b SAR

活跃

有

4900

Infineon

Infineon Technologies

Details

SoC FPGA

40-UFQFN Exposed Pad

40-QFN (6x6)

Infineon Technologies

34

-40°C ~ 105°C (TA)

Tray

Automotive, AEC-Q100, PSOC® 4 CY8C4100

SOC - Systems on a Chip

External, Internal

24MHz

16K x 8

1.71V ~ 5.5V

ARM® Cortex®-M0+

Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT

FLASH

32-Bit

128KB (128K x 8)

FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

-

ARM Microcontrollers - MCU

CYW20835PB1KML1GGF CYW20835PB1KML1GGF

Infineon 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

活跃

Tray

60-VFQFN Exposed Pad

PG-VQFN-60-800

Infineon Technologies

CYW20835

-30°C ~ 85°C

AIROC™ Bluetooth

TxRx + MCU

1.625V ~ 1.775V

2.4GHz

2MB ROM, 384kB RAM

Bluetooth v5.2, CDMA, EDGE, GSM, WCDMA

12dBm

Bluetooth

-94.5dBm

2Mbps

ADC, GPIO, HCI, I²C, I²S, JTAG, PCM, PWM, SPI, UART

8mA

18mA

GFSK

24

STI7108-EWB STI7108-EWB

STMicroelectronics 数据表

N/A

-

最小起订量: 1

倍率: 1

无

无

Compliant

Obsolete

AGIC040R39A2I3V AGIC040R39A2I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 4.047M Logic Elements

AGIA035R39A1E2VB AGIA035R39A1E2VB

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

0°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 3.54M Logic Elements

AGFD023R31C2E4X AGFD023R31C2E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGIA040R39A2E2VB AGIA040R39A2E2VB

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

0°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 4.047M Logic Elements

AGFB014R24D1E3V AGFB014R24D1E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

2340-BFBGA Exposed Pad

2340-BGA (45x42)

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

AGID019R31B2I3V AGID019R31B2I3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGIA035R39A2I1VB AGIA035R39A2I1VB

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 3.54M Logic Elements

AGFB023R31C2I3E AGFB023R31C2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGFC023R31C2E3V AGFC023R31C2E3V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGIC040R39A2I3E AGIC040R39A2I3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 4.047M Logic Elements

AGFB023R31C2E3E AGFB023R31C2E3E

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGIA040R39A1I2VB AGIA040R39A1I2VB

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 4.047M Logic Elements