你好！请登入 免费注册

我的订单 我的询价 0755-82520436 3307104213

购物车
所有分类 首页 品牌专区 询价 关于我们
首页 / 全部商品 / category.null / category.null /

类别是'嵌入式 - 片上系统（SoC）'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

安装类型

包装/外壳

表面安装

越来越多的功能

触点形状

外壳材料

供应商器件包装

介电材料

插入材料

终端数量

第一种连接器安装类型

第二个连接器安装类型

厂商

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

终止次数

终端

温度系数

连接器类型

类型

电阻

定位的数量

组成

颜色

应用

功率(瓦特)

HTS代码

电容量

紧固类型

子类别

触点类型

额定电流

技术

电压 - 供电

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度（摄氏度）

入口保护

端子间距

样式

Reach合规守则

频率

频率稳定性

输出量

外壳完成

外壳尺寸-插入

JESD-30代码

功能

基本谐振器

最大电流源

输出的数量

资历状况

房屋颜色

失败率

引线间距

电源

温度等级

电流 - 电源（禁用）（最大值）

注意

电感,电感

直流电阻（DCR）

速度

内存大小

外壳尺寸，MIL

引线样式

核心处理器

周边设备

程序内存大小

扩频带宽

连接方式

谐振@频率

重置

建筑学

电压 - 阈值

监测的电压数量

重置超时

输入数量

座位高度-最大

可编程逻辑类型

产品类别

包括

第一个连接器

第二个连接器

增益

频率范围

无线电频率系列/标准

天线类型

绝对牵引范围 (APR)

电压驻波比

主要属性

频带数量

频率组

频率(中心/波段)

逻辑单元数

核数量

回报损失

闪光大小

特征

产品类别

座位高度(最大)

长度

宽度

厚度（最大）

高度(最大)

材料可燃性等级

评级结果
AGFB006R24C2E4X AGFB006R24C2E4X

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

576

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

AGFD023R25A2E2V AGFD023R25A2E2V

Intel 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

-

-

Intel

480

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCVE1752-1MSIVSVA1596 XCVE1752-1MSIVSVA1596

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1596-BFBGA, FCBGA

AMD

500

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

10AS027H3F35E2SG 10AS027H3F35E2SG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

D38999/26FF

活跃

384

有

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

965285

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

SoC FPGA

FBGA-1152

Corsair

Bag

0°C ~ 100°C (TJ)

Tray

*

活跃

SOC - Systems on a Chip

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 270K Logic Elements

2 Core

--

SoC FPGA

10AS016E3F29I2LG 10AS016E3F29I2LG

ALTERA 数据表

N/A

-

最小起订量: 1

倍率: 1

Non-Compliant

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS016E3F29I2LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

780-BBGA, FCBGA

YES

780-FBGA (29x29)

780

288

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B780

288

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

3.35 mm

现场可编程门阵列

FPGA - 160K Logic Elements

160000

--

29 mm

29 mm

XCZU47DR-L1FSVG1517I XCZU47DR-L1FSVG1517I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

连接器安装

EXS148

Obsolete

561

1517-BBGA, FCBGA

1517-FCBGA (40x40)

TE Connectivity Laird

Bulk

-40°C ~ 100°C (TJ)

EXS

MX

-

-

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

148MHz ~ 155MHz

-

Whip, Straight

-

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

1

VHF (f < 300MHz)

151MHz

-

-

-

4.390 (111.51mm)

XCZU46DR-2FSVH1760I XCZU46DR-2FSVH1760I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

Tape & Reel (TR)

25 MHz

Obsolete

Ferrite

-

574

1206 (3216 Metric)

1206

Taiyo Yuden

100MHz

-40°C ~ 85°C

LK

0.126 L x 0.063 W (3.20mm x 1.60mm)

±20%

Multilayer

150 mA

Shielded

820 nH

900mOhm Max

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

25 @ 25MHz

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

0.055 (1.40mm)

-

XCZU46DR-1FFVH1760I XCZU46DR-1FFVH1760I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

D38999/24WD

活跃

574

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

Souriau-Sunbank by Eaton

Bag

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU47DR-1FFVE1156E XCZU47DR-1FFVE1156E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

Bag

50 Ohms

Q-1T04E0

Bulkhead - Front Side Nut

活跃

Female

11 GHz

Bulkhead - Front Side Nut

RG-174

366

1156-BBGA, FCBGA

1156-FCBGA (35x35)

面板安装

面板安装

Amphenol Custom Cable

Female

-

-

Black

-

N-Type to TNC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

N-Type Jack

TNC 插孔

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Shielded

18.00 (457.20mm)

XCZU46DR-2FFVH1760E XCZU46DR-2FFVH1760E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

120086

活跃

574

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

Molex

Bulk

0°C ~ 100°C (TJ)

*

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-L2FFVF1760I XCZU49DR-L2FFVF1760I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

531AA

活跃

622

6-SMD, No Lead

1760-FCBGA (42.5x42.5)

Skyworks Solutions Inc.

Strip

-40°C ~ 85°C

Si531

0.276 L x 0.197 W (7.00mm x 5.00mm)

XO (Standard)

3.3V

250 MHz

±50ppm

LVPECL

Enable/Disable

Crystal

121mA

75mA

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

-

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

0.071 (1.80mm)

-

XCZU49DR-L2FSVF1760I XCZU49DR-L2FSVF1760I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, MLCC

Obsolete

50V

622

1206 (3216 Metric)

1760-FCBGA (42.5x42.5)

Vishay Vitramon

Tape & Reel (TR)

-55°C ~ 150°C

GA

0.126 L x 0.063 W (3.20mm x 1.60mm)

±0.5pF

C0G, NP0

汽车

1.2 pF

-

-

533MHz, 1.333GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Epoxy Mountable, High Temperature

-

0.067 (1.70mm)

AEC-Q200

XCZU48DR-2FSVE1156I XCZU48DR-2FSVE1156I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

RN732A

Obsolete

366

0805 (2012 Metric)

0805

KOA Speer Electronics, Inc.

Tape & Reel (TR)

-55°C ~ 155°C

RN73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.1%

2

±5ppm/°C

76.8 kOhms

Thin Film

0.1W, 1/10W

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Moisture Resistant

0.024 (0.60mm)

XCZU48DR-2FSVG1517E XCZU48DR-2FSVG1517E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

MAX16055

活跃

561

10-TFSOP, 10-MSOP (0.118, 3.00mm Width)

10-uMAX/uSOP

Analog Devices Inc./Maxim Integrated

Tape & Reel (TR)

-40°C ~ 125°C (TA)

-

Multi-Voltage Supervisor

开路漏极或开路集电极

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

低电平有效

MCU, FPGA

6 Selectable Threshold Combinations

6

140ms Minimum

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-2FFVF1760E XCZU49DR-2FFVF1760E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

D55342

活跃

622

1206 (3216 Metric)

1206

Vishay Dale 薄膜

Tray

-55°C ~ 150°C

Military, MIL-PRF-55342, RM1206

0.126 L x 0.063 W (3.20mm x 1.60mm)

±1%

2

±100ppm/°C

178 Ohms

Thin Film

0.25W, 1/4W

P (0.1%)

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Military, Non-Inductive

0.033 (0.84mm)

XCZU48DR-L1FFVG1517I XCZU48DR-L1FFVG1517I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

090635

活跃

561

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Molex

Bulk

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-1FSVF1760I XCZU49DR-1FSVF1760I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

MAX198

Obsolete

622

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

Analog Devices Inc./Maxim Integrated

Tape & Reel (TR)

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FFVE1156E XCZU43DR-2FFVE1156E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

Obsolete

366

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Panduit Corp

Bulk

0°C ~ 100°C (TJ)

-

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FSVE1156I XCZU43DR-2FSVE1156I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

活跃

366

Radial

-

Vishay Foil Resistors (Division of Vishay Precision Group)

Bulk

-55°C ~ 125°C

S

0.300 L x 0.105 W (7.62mm x 2.67mm)

±0.01%

2

±2ppm/°C

1.09244 kOhms

金属箔

0.6W

-

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Moisture Resistant, Non-Inductive

0.336 (8.53mm)

XCZU43DR-L1FSVG1517I XCZU43DR-L1FSVG1517I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

表面贴装

MAX16034

Obsolete

561

10-WFDFN

10-uDFN (2x2)

Analog Devices Inc./Maxim Integrated

Tape & Reel (TR)

-40°C ~ 85°C

-

备用电池电路

Push-Pull, Totem Pole

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

低电平有效

MCU, FPGA

2.63V

1

140ms Minimum

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-2FSVG1517E XCZU43DR-2FSVG1517E

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

通孔

Obsolete

63V

561

Radial

1517-FCBGA (40x40)

Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked

EPCOS - TDK Electronics

Bulk

-55°C ~ 125°C

SilverCap™ B32561

0.453 L x 0.177 W (11.50mm x 4.50mm)

±20%

PC引脚

通用型

1 µF

0.394 (10.00mm)

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

0.272 (6.90mm)

XCZU43DR-L2FSVE1156I XCZU43DR-L2FSVE1156I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

面板安装

D38999/24MA

20

活跃

366

1156-BBGA, FCBGA

Bulkhead - Front Side Nut

Circular

Composite

1156-FCBGA (35x35)

Plastic

TE Connectivity Deutsch 连接器

Bulk

-65°C ~ 200°C

Military, MIL-DTL-38999 Series III, ACT

插座外壳

用于内螺纹插座

3

Threaded

Crimp

B

Shielded

抗环境干扰

化学镍

9-98

Silver

不包括触点

533MHz, 1.333GHz

256KB

A

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

-

XCZU43DR-1FFVG1517I XCZU43DR-1FFVG1517I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

Surface Mount, MLCC

Obsolete

100V

561

0402 (1005 Metric)

1517-FCBGA (40x40)

Vishay Vitramon

Bulk

-55°C ~ 150°C

VJ

0.039 L x 0.020 W (1.00mm x 0.50mm)

±10%

C0G, NP0

汽车

18 pF

-

-

500MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

-

0.024 (0.60mm)

AEC-Q200

XCZU48DR-1FSVG1517I XCZU48DR-1FSVG1517I

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

093090

活跃

561

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Molex

Bulk

-40°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCVC1902-1LSEVSVD1760 XCVC1902-1LSEVSVD1760

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

Tray

活跃

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

692

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-