类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 操作温度 | 包装 | 已出版 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | 电压 - 供电 | 频率 | 内存大小 | 数据率 | 使用的 IC/零件 | 议定书 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 敏感度 | 串行接口 | 接收电流 | 传输电流 | 调制 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 453-00039R | Laird - Wireless & Thermal Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | Module | -40°C~105°C | BL653 | 活跃 | 1.7V~5.5V | 2.402GHz~2.48GHz | 512kB Flash 128kB RAM | 2Mbps | nRF52833 | Bluetooth v5.1, Thread, Zigbee® | 8dBm | 802.15.4, Bluetooth | Integrated, Chip | -103dBm | ADC, GPIO, I2C, I2S, PDM, PWM, SPI, UART, USB | 4.9mA~14.1mA | ||||||||
| RM024-S10-M-01 | Laird - Wireless & Thermal Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | -40°C~85°C | Bulk | 2013 | Obsolete | 3 (168 Hours) | 2.3V~3.6V | 2.4GHz | 500kbps | RAMP | 18dBm | General ISM > 1GHZ | Integrated, Chip | -95dBm | UART | 36mA | 166mA | FHSS | |||||||
| ZM3102AZ-CME1 | Sigma Designs Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | Tray | Z-Wave® | Obsolete | 3 (168 Hours) | 32kB Flash 2kB SRAM | Z-Wave® | 802.15.4, General ISM < 1GHz | |||||||||||||||||
| DC-WME-01TE-C-10 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Module | -40°C~85°C | Digi Connect® Wi-ME | Obsolete | 1 (Unlimited) | 3.3V | 2.4GHz | 65Mbps | 802.11b/g/n | 17dBm | WiFi | Antenna Not Included, RP-SMA | -69dBm | I2C, SPI | 346mA | 346mA | CCK, DBPSK, DQPSK | ||||||||
| XBP24BZ7SIT-I097 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Module | Bulk | Obsolete | 1 (Unlimited) | |||||||||||||||||||||
| ZW0301A-CNE1 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | Obsolete | 3 (168 Hours) | Z-Wave® | ||||||||||||||||||||||
| ZM3102AY-CME1 | Sigma Designs Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 18-SMD Module | Tray | Z-Wave® | Obsolete | 3 (168 Hours) | 2.1V~3.6V | 868.4MHz~921.42MHz | 32kB Flash 2kB SRAM | 40kbps | 8051 | Z-Wave® | General ISM < 1GHz | PWM, SPI, UART | ||||||||||||
| HL7650_1104146 | Sierra Wireless | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | HL | 活跃 | 3 (168 Hours) | 10Mbps | 4G LTE CAT-1, HSPA+ | Cellular | ADC, UART, USB | 符合RoHS标准 | |||||||||||||
| ST60-2230C-UU | Laird - Wireless & Thermal Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | 卡边缘 | Module | -30°C~85°C TA | 活跃 | 不适用 | 2.97V~3.63V | 2.412GHz~2.484GHz 5.15GHz~5.925GHz | 866.7Mbps | 88W8997, 88PG823 | 802.11a/b/g/n/ac, Bluetooth v5.1, Class 1 and 2 | 18dBm | Bluetooth, WiFi | Antenna Not Included, U.FL | -95dBm | USB | 16QAM, 64QAM, 256QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK | ROHS3 Compliant | ||||||||
 | 700-0053-100 | Telit | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | Module | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | 1.6V~3.6V | 2.4GHz | 2MB Flash | 72Mbps | 802.11b/g/n | 17dBm | WiFi | Antenna Not Included, U.FL | -91dBm | I2C, I2S, SDIO, SPI, UART | 符合RoHS标准 | ||||||||
| RC1180-MSM | Radiocrafts AS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 30-SMD Module | -40°C~85°C | Wireless M-Bus | 活跃 | 供应商未定义 | 2V~3.6V | 868MHz~870MHz | 100Kbps | CC1110 | Wireless M-Bus | 9dBm | General ISM < 1GHz | Antenna Not Included, Castellation | UART | 37mA | FSK | 符合RoHS标准 | |||||||
| CMP9377-SA | CEL | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | Module | -40°C~85°C | 活跃 | 3 (168 Hours) | 3.3V | 2.4GHz 5GHz | 802.11a/b/g/n/ac, Bluetooth v5.0 | 20dBm | Bluetooth, WiFi | Integrated, Chip | SDIO, UART | ROHS3 Compliant | ||||||||||||
| ISP4520-US-ST | Insight SIP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 74-SMD Module | -30°C~85°C | Cut Tape (CT) | 活跃 | 5 (48 Hours) | 1.8V~3.6V | 902MHz 2.402GHz~928MHz 2.48GHz | 512kB Flash 64kB SRAM | 2Mbps | nRF52832 | Bluetooth v5.0, LoRaWAN | 22dBm | Bluetooth | Integrated, Trace | -137dBm | I2C, JTAG, SPI | 4.6mA~6.1mA | 5.4mA~118mA | Non-RoHS Compliant | |||||
| K-LC4 | RFbeam Microwave GmbH | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 通孔 | 5-SIP Module | -20°C~85°C | 活跃 | 4.75V~5.25V | 24.05GHz~24.25GHz | 13dBm | -93dBm | FSK | ROHS3 Compliant | |||||||||||||||
 | CB-OLP425I-16-0 | ConnectBlue | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 底座安装 | Module | -40°C~85°C | Bulk | 2016 | CB-OLP | Discontinued | 1 (Unlimited) | 2V~3.6V | 2.4GHz | CC2540 | Bluetooth v4.0 | 2dBm | Bluetooth | Integrated, Chip | -91dBm | SPI, UART | |||||||||
| ST60-2230C-U | Laird - Wireless & Thermal Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | 卡边缘 | Module | Industrial grade | -30°C~85°C TA | 活跃 | 不适用 | 2.97V~3.63V | 2.412GHz~2.484GHz 5.15GHz~5.925GHz | 866.7Mbps | 88W8997, 88PG823 | 802.11a/b/g/n/ac, Bluetooth v5.1, Class 1 and 2 | 18dBm | Bluetooth, WiFi | Antenna Not Included, U.FL | -95dBm | UART, USB | 16QAM, 64QAM, 256QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK | ROHS3 Compliant | |||||||
| ESP32-VAQUITA-DSPG | Espressif Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 底座安装 | Module | -40°C~125°C | ESP32 | 活跃 | 1 (Unlimited) | 2.3V~3.6V | 2.412GHz~2.484GHz | 448kB ROM 520kB SRAM | 150Mbps | 802.11b/g/n, Bluetooth 4.2 | 20.5dBm | Bluetooth, WiFi | 不包括天线 | -97dBm | ADC, I2C, I2S, SDIO, SPI, PWM, UART | 95mA~100mA | 130mA~240mA | 8DPSK, DSSS, DQPSK, OFDM | ||||||
| BGM13HBA12E6327XTSA1 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 活跃 | ||||||||||||||||||||||||
| CYW20735PB1KML1G | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 60-VFQFN Exposed Pad | -30°C~85°C | WICED | 活跃 | 3 (168 Hours) | 1.62V~3.63V | 2.402GHz~2.48GHz | 384kB RAM 2MB ROM | 2Mbps | CYW20735B1 | Bluetooth v5.0 | 12dBm | Bluetooth | 不包括天线 | -94.5dBm | ADC, I2C, I2S, PCM, PWM, SPI, UART | 8mA | 18mA | GFSK | ROHS3 Compliant | |||||
| ISM43364-W-L151 | Inventek Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | |||||||||||||||||||||||||
| AMW007-1.4.0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||
| CYW20735PB1KML1GT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 60-VFQFN Exposed Pad | -30°C~85°C | WICED | 活跃 | 3 (168 Hours) | 1.62V~3.63V | 2.402GHz~2.48GHz | 384kB RAM 2MB ROM | 2Mbps | CYW20735B1 | Bluetooth v5.0 | 12dBm | Bluetooth | 不包括天线 | -94.5dBm | ADC, I2C, I2S, PCM, PWM, SPI, UART | 8mA | 18mA | GFSK | ROHS3 Compliant | |||||
| AMW037-1.3.0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||
| BGM210L022JIF2 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 18-SMD Module | -40°C~125°C TA | 蓝壁虎 | 活跃 | 3 (168 Hours) | 1.8V~3.8V | 2.4GHz~2.4835GHz | 1MB Flash 96kB RAM | 2Mbps | EFR32BG21 | Bluetooth v5.1 | 12.5dBm | Bluetooth | PCB Trace | -104.4dBm | ADC, GPIO, I2C, I2S, IrDA, PWM, SPI, UART | 9.1mA~9.9mA | 70mA | GFSK | 符合RoHS标准 | ||||
 | BE890D2S13CT0I1000 | Telit | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 符合RoHS标准 |