类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 厂商 | 操作温度 | 包装 | 系列 | 类型 | 电压 - 供电 | 屏蔽/屏蔽 | 频率 | 工作电源电压 | 通道数量 | 内存大小 | 输出功率 | 数据率 | 使用的 IC/零件 | 议定书 | 频率范围 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 敏感度 | 串行接口 | 接收电流 | 传输电流 | 调制 | 产品 | 特征 | 调制技术 | 高度 | 长度 | 宽度 | |||||||||||||||||||||||||||
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![]() | ZGM230SB27HGN3R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | I2C, I2S, SPI, UART | 1.8 V | - 40 C | + 85 C | 射频引脚 | 次 GHz | 有 | SMD/SMT | - 110 dBm | 4.6 mA | 30 mA | 3.8 V | 6.5 mm x 6.5 mm | Details | Z-Wave | 39 MHz | 1.8 V to 3.8 V | 64 kB | 14 dBm | 14 dBm | SiP模块 | Z-Wave, Z-Wave Long Range | ||||||||||||||||||||||||||||||||||||||
![]() | NORA-W101-00B | u-blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | CAN, GPIO, I2C, I2S, PWM, SPI, UART, USB | 3 V | - 40 C | + 85 C | PCB | 802.11 b/g/n | 有 | SMD/SMT | 500 | Stand-alone multiradio modules | 3.6 V | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | NORA-W10 | 活跃 | 10.4 mm x 14.3 mm x 1.8 mm | 82-SMD Module | u-blox | Details | -40°C ~ 85°C | 切割胶带 | NORA-W10 | 多协议模块 | 3V ~ 3.6V | 2.4 GHz | 40 Channels | 8MB Flash, 512kB SRAM | 8 dBm | 150 Mbps | - | 802.11b/g/n, Bluetooth v5.0 | 17dBm | Bluetooth, WiFi | 不包括天线 | - 96 dBm | I²C, SDIO, SPI, UART | 95mA | 130mA ~ 190mA | GFSK | 射频模块 | 功能强大的无线MCU,安全性更高 | |||||||||||||||||||
![]() | LARA-R202-03B | u-blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 2.8 V | - 20 C | + 65 C | 4.5 V | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | LARA-R202 | Obsolete | 100-SMD Module | u-blox | I2C, UART | -40°C ~ 85°C | LARA-R2 | 3.3V ~ 4.4V | 700MHz, 850MHz, 1.7GHz, 1.9GHz | 2.8 V to 4.5 V | - | 10.3Mbps | - | 3G, 4G LTE | 24dBm | Cellular | Antenna Not Included, Castellation | -115dBm | GPIO, I²C, SDIO, UART, USB | 50mA ~ 540mA | 50mA ~ 540mA | QPSK | LTE模块 | |||||||||||||||||||||||||||||||
![]() | TOBY-R200-03B | u-blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | - 20 C | + 65 C | SMD/SMT | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Obsolete | 152-SMD Module | u-blox | I2C, UART | -40°C ~ 85°C | TOBY-R2 | 3.3V ~ 4.4V | 700MHz, 850MHz, 900MHz, 1.7GHz, 1.8GHz, 1.9GHz, 2.1GHz | - | 10.3Mbps | - | GSM, LTE, UMTS | 33dBm | Cellular | Antenna Not Included, Castellation | -115dBm | GPIO, I²C, SDIO, UART, USB | 50mA ~ 540mA | 50mA ~ 540mA | GMSK, QPSK | LTE模块 | ||||||||||||||||||||||||||||||||||
![]() | MAYA-W166-00B | u-blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 3 V | - 40 C | + 85 C | PCB | WiFi 4 | 有 | 802.11 a/b/g/n, Bluetooth 5.0 | 500 | 3.6 V | 活跃 | 14.3 mm x 10.4 mm x 1.8 mm | - | 76-LGA Module | u-blox | I2S, PCM, SDIO, UART | -40°C ~ 85°C | MAYA-W1 | 3V ~ 3.6V | 2.4 GHz, 5 GHz | 3 V to 3.6 V | - | 18 dBm | 150 Mb/s | IW416 | 802.11a/b/g/n, Bluetooth v5.2 +EDR, Class 1 and 2 | 18dBm | Bluetooth, WiFi | PCB Trace | - | GPIO, I²S, SDIO, PCM, UART | - | - | 16-QAM, 64-QAM, BPSK, CCK, DSSS, OFDM | ||||||||||||||||||||||||||
![]() | MAYA-W161-00B | u-blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 3 V | - 40 C | + 85 C | Pin | WiFi 4 | 有 | 802.11 a/b/g/n, Bluetooth 5.0 | 500 | 3.6 V | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 10.4 mm x 14.3 mm x 2.5 mm | 76-LGA Module | u-blox | I2S, PCM, SDIO, UART | -40°C ~ 85°C | MAYA-W1 | 3V ~ 3.6V | 2.4 GHz, 5 GHz | 3 V to 3.6 V | - | 18 dBm | 150 Mb/s | IW416 | 802.11a/b/g/n, Bluetooth v5.2 +EDR, Class 1 and 2 | 18dBm | Bluetooth, WiFi | 不包括天线 | - | GPIO, I²S, SDIO, PCM, UART | - | - | 16-QAM, 64-QAM, BPSK, CCK, DSSS, OFDM | ||||||||||||||||||||||||||
![]() | EYSGCNZXX | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | I2C, SPI, UART | - 93 dBm | 1.8 V | - 40 C | + 85 C | 有 | SMD/SMT | 1000 | 13 mA | 16 mA | 3.6 V | Tape & Reel (TR) | 活跃 | 49-SMD Module | Kaga Electronics USA | Details | -25°C ~ 85°C (TA) | - | 1.8V ~ 3.6V | 2.402GHz ~ 2.48GHz | 1.8 V to 3.6 V | 16kB RAM | 4 dBm | 921.6kbps | nRF51822 | Bluetooth v4.2 | 2.402 GHz to 2.48 GHz | 4dBm | Bluetooth | Integrated, Chip | -93dBm | UART | 13mA | 16mA | - | 蓝牙模块 | 2 mm | 12.9 mm | 9.6 mm | ||||||||||||||||||||
![]() | EYSGJNZWY | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | I2C, SPI, UART | - 93 dBm | 1.8 V | - 20 C | + 85 C | 有 | SMD/SMT | 2000 | 13 mA | 16 mA | 3.6 V | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 28-SMD Module | Kaga Electronics USA | Details | -25°C ~ 85°C | - | 1.8V ~ 3.6V | 2.4GHz | 1.8 V to 3.6 V | 256kB Flash, 32kB RAM | 4 dBm | 1Mbps | nRF51822 | Bluetooth v4.2 | 2.402 GHz to 2.48 GHz | 4dBm | Bluetooth | Integrated, Trace | -93dBm | I²C, SPI, UART | 13mA | 10.5mA ~ 16mA | GFSK | 蓝牙模块 | 1.3 mm | 11.3 mm | 5.1 mm | ||||||||||||||||||||
![]() | EYSKBNUWB-VX | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | I2C, SPI, UART, USB | - 95 dBm | 1.7 V | - 40 C | + 85 C | 有 | SMD/SMT | 1000 | 11.1 mA | 14.8 mA | 3.6 V | Tray | 活跃 | 63-SMD Module | Kaga Electronics USA | Details | -40°C ~ 85°C | EYSKBN | 1.7V ~ 5.5V | 2.402GHz ~ 2.48GHz | 1.7 V to 3.6 V | - | 8 dBm | 2Mbps | nRF52840 | Bluetooth v5.0 | 2.402 GHz to 2.48 GHz | 8dBm | Bluetooth | PCB Trace | - | ADC, SPI, UART, USB | - | - | - | 蓝牙模块 | 2 mm | 15.4 mm | 10 mm | ||||||||||||||||||||
![]() | EYSHSNZWZ | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | I2C, SPI, UART | - 94 dBm | 1.7 V | - 40 C | + 85 C | 有 | SMD/SMT | 2000 | 12.9 mA | 16.6 mA | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 3.6 V | 8.5 mm x 3.2 mm x 0.85 mm | Module | Kaga Electronics USA | Details | -40°C ~ 85°C | EYSHSN | 1.7V ~ 3.6V | 2.4GHz | 1.7 V to 3.6 V | 512kB Flash, 64kB RAM | 4 dBm | 1Mbps | nRF52832 | Bluetooth v5.0 | 2.402 GHz to 2.48 GHz | 4dBm | Bluetooth | Integrated, Trace | -94dBm | UART | 5.4mA ~ 11.7mA | 16mA | - | 蓝牙模块 | 0.85 mm | 8.5 mm | 3.2 mm | |||||||||||||||||||
![]() | EYSNCNZWW | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | I2C, SPI, UART | - 96 dBm | 1.7 V | - 40 C | + 85 C | 有 | SMD/SMT | 1000 | 11.2 mA | 15.4 mA | 3.6 V | Tape & Reel (TR);Cut Tape (CT); | 活跃 | 49-SMD Module | Kaga Electronics USA | Details | -40°C ~ 85°C | EYSNCNZ | 1.7V ~ 3.6V | 2.402GHz ~ 2.48GHz | 1.7 V to 3.6 V | 192kB Flash, 24kB RAM | 4 dBm | 2Mbps | nRF52811 | Bluetooth v5.2, Thread, Zigbee® | 2.402 GHz to 2.48 GHz | 4dBm | 802.15.4, Bluetooth | Integrated, Chip | - | ADC, I²C, PDM, SPI, UART | - | - | - | 蓝牙模块 | 2 mm | 12.9 mm | 9.6 mm | ||||||||||||||||||||
![]() | WYSBHVGXG | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 802.11 ac/a/b/g/n | 3 V | - 30 C | + 85 C | 有 | WiFi | 1500 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 3.6 V | Module | Kaga Electronics USA | Details | -30°C ~ 85°C | - | 3.3V | 2.4GHz, 5GHz | 3 V to 3.6 V | - | 14 dBm | 433.3Mbps | 88W8887 | 802.11a/b/g/n/ac, Bluetooth v4.2 | 14dBm | Bluetooth, WiFi | - | -87dBm | SPI | - | - | - | ||||||||||||||||||||||||||||
![]() | EYSGJNZXX | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | SMD/SMT | 2000 | 13 mA | 16 mA | + 85 C | - 40 C | 1.8 V | - 93 dBm | I2C, SPI, UART | Details | 3.6 V | Tape & Reel (TR) | 活跃 | 28-SMD Module | Kaga Electronics USA | 有 | -40°C ~ 85°C | - | 1.8V ~ 3.6V | 2.4GHz | 1.8 V to 3.6 V | 256kB Flash, 16kB RAM | 4 dBm | - | nRF51822 | Bluetooth v4.2 | 2.402 GHz to 2.48 GHz | 4dBm | Bluetooth | Integrated, Chip | - | ADC, I²C, SPI, UART | - | - | - | 蓝牙模块 | 1.3 mm | 11.3 mm | 5.1 mm | ||||||||||||||||||||
![]() | EYSGCNZWY | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | I2C, SPI, UART | - 93 dBm | 1.7 V | - 25 C | + 85 C | 有 | SMD/SMT | 1000 | 13 mA | 16 mA | 3.6 V | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 49-SMD Module | Kaga Electronics USA | Details | -25°C ~ 85°C | - | 1.8V ~ 3.6V | 2.4GHz | 1.7 V to 3.6 V | 256kB Flash, 32kB RAM | 4 dBm | 1Mbps | nRF51822 | Bluetooth v4.2 | 2.402 GHz to 2.48 GHz | 4dBm | Bluetooth | Integrated, Chip | -93dBm | I²C, SPI, UART | 13mA | 10.5mA ~ 16mA | GFSK | 蓝牙模块 | 2 mm | 12.9 mm | 9.6 mm | ||||||||||||||||||||
![]() | EYSGCNAWY-VX | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | UART | - 93 dBm | 1.8 V | - 25 C | + 85 C | 有 | SMD/SMT | 1000 | 13 mA | 16 mA | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 3.6 V | 49-SMD Module | Kaga Electronics USA | Details | -25°C ~ 85°C (TA) | - | 1.8V ~ 3.6V | 2.402GHz ~ 2.48GHz | 1.8 V to 3.6V | - | 4 dBm | 921.6kbps | nRF51822 | Bluetooth v4.2 | 2.402 GHz to 2.48 GHz | 4dBm | Bluetooth | Integrated, Chip | -93dBm | UART | 13mA | 16mA | - | 蓝牙模块 | 2 mm | 12.9 mm | 9.6 mm | ||||||||||||||||||||
![]() | EYSLCNZWW | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | I2C, SPI, UART | - 96 dBm | 1.7 V | - 40 C | + 85 C | 有 | SMD/SMT | 1000 | 11.2 mA | 15.4 mA | 3.6 V | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 12.9 mm x 9.6 mm x 2 mm | 49-SMD Module | Kaga Electronics USA | Details | -40°C ~ 85°C | - | 1.7V ~ 3.6V | 2.4GHz ~ 2.48GHz | 1.7 V to 3.6 V | 192kB Flash, 24kB RAM | 6 dBm | - | nRF52810 | Bluetooth v5.0 | 2.402 GHz to 2.48 GHz | 6dBm | Bluetooth | - | -96dBm | I²C, SPI, UART | 4.6mA | 7mA | - | 蓝牙模块 | 2 mm | 12.9 mm | 9.6 mm | |||||||||||||||||||
![]() | EYSHJNZWZ | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | I2C, SPI, UART | - 94 dBm | 1.7 V | - 40 C | + 85 C | 有 | SMD/SMT | 2000 | 12.9 mA | 16.6 mA | 3.6 V | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 11.3 mm x 5.1 mm x 1.3 mm | Module | Kaga Electronics USA | Details | -40°C ~ 85°C | - | 1.7V ~ 3.6V | 2.4GHz | 1.7 V to 3.6 V | 512kB Flash, 64kB RAM | 4 dBm | 2Mbps | nRF52832 | Bluetooth v5.0 | 2.402 GHz to 2.48 GHz | 4dBm | Bluetooth/ANT | Integrated, Trace | -94dBm | I²C, I²S, SPI, UART | 12mA | 16mA | GFSK | 蓝牙模块 | 1.3 mm | 11.3 mm | 5.1 mm | |||||||||||||||||||
![]() | EYSKBNZWB | Kaga Electronics USA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | I2C, SPI, UART, USB | - 95 dBm | 1.7 V | - 40 C | + 85 C | 有 | SMD/SMT | 1000 | 11.1 mA | 32.7 mA | 3.6 V | 活跃 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 15.4 mm x 10 mm x 2 mm | 63-SMD Module | Kaga Electronics USA | Details | -40°C ~ 85°C (TA) | - | 1.7V ~ 5.5V | 2.402GHz ~ 2.48GHz | 1.7 V to 3.6 V | 1MB Flash, 256kB RAM | 8 dBm | 500kbps | nRF52840 | Bluetooth v5.0 | 2.402 GHz to 2.48 GHz | 8dBm | Bluetooth | Integrated, Chip | -103dBm | GPIO, USB | 11.1mA | 32.7mA | - | 蓝牙模块 | 2 mm | 15.4 mm | 10 mm | |||||||||||||||||||
![]() | ISP2053-AX-RS | Insight SiP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 104 dBm | 1.7 V | 5.5 V | - 40 C | + 105 C | NFC | 有 | SMD/SMT | 450 m' | 500 | 2.7 mA | 3.4 mA, 5.8 mA | GPIO, I2C, I2S, PWM, SPI, UART | 切割胶带 | 2.43 GHz | 1.7 V to 5.5 V | 1 MB | 3 dBm | 2 Mb/s | 2.36 GHz to 2.5 GHz | - 104 dBm | 蓝牙模块 | 1 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||
![]() | BB-APMN-Q551 | Advantech | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 底座安装 | 802.11 a/b/g/n | RS-232/422/485, SPI, UART | 3.135 V | 370 mA | 200 mA | - 40 C | + 85 C | U.FL | WiFi | WEP 64/128, WPA-PSK (TKIP), WPA2-PSK (AES) | 1 | BB-APMN-Q551 | 0.160000 oz | Tray | BB-APMN | 最后一次购买 | 3.465 V | Module | Advantech Corp | Details | -40°C ~ 85°C | AirborneM2M™ | 3.3V | 2.4 GHz, 5 GHz | 3.3 V | - | 12.6 dBm, 15 dBm, 17 dBm | 11 Mb/s, 54 Mb/s, 65 Mb/s | CC2530 | 802.11a/b/g/n | 17dBm | WiFi | Antenna Not Included, U.FL | -92dBm | SPI, UART | 200mA | 370mA | - | DSSS, CCK, OFDM | ||||||||||||||||||||
![]() | BM71BLES1FC2-0B05BA | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ADC, GPIO, I2C, SPI, UART | - 90 dBm | 1.9 V | 3.6 V | - 40 C | + 85 C | 171 | Bluetooth Low Energy (BLE) | Tray | 2.44 GHz | 1.9 V to 3.6 V | 0 dBm | - | Bluetooth 5.0 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATWINC3400-MR210UA142 | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2.7 V | 3.6 V | - 40 C | + 85 C | U.FL | 802.11 b/g/n | 有 | 50 | I2C, SPI, UART | Tray | 2.4 GHz | 18.3 dBm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BM70BLE01FC2-0B05BA | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Bluetooth Low Energy (BLE) | ADC, GPIO, I2C, SPI, UART | - 90 dBm | 1.9 V | 3.6 V | - 40 C | + 85 C | SMD/SMT | 136 | 10 mA | 10 mA | Details | Tray | Unshielded | 2.44 GHz | 1.9 V to 3.6 V | 0 dBm | 8.6 kb/s | Bluetooth 5.0 | 2.402 GHz to 2.48 GHz | - 90 dBm | PWM | 蓝牙模块 | 1.6 mm | 15 mm | 12 mm | ||||||||||||||||||||||||||||||||||
![]() | BM64SPKS1MC2-00M3AA | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Class 1, Class 2 | UART | - 90 dBm | 3.2 V | 4.2 V | - 20 C | + 70 C | Integrated | SMD/SMT | 56 | Details | Tray | Shielded | 2.44 GHz | 3.2 V to 4.2 V | 15 dBm | 1 Mb/s | Bluetooth 5.0 | 2.402 GHz to 2.48 GHz | 蓝牙模块 | 2.5 mm | 32 mm | 15 mm | |||||||||||||||||||||||||||||||||||||
![]() | BM64SPKS1MC2-0003AA | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Class 1, Class 2 | UART | - 90 dBm | 3.2 V | 4.2 V | - 20 C | + 70 C | Integrated | SMD/SMT | 56 | Details | Tray | Shielded | 2.44 GHz | 3.2 V to 4.2 V | 15 dBm | 2 Mb/s | Bluetooth 5.0 | 2.402 GHz to 2.48 GHz | 蓝牙模块 | 2.5 mm | 32 mm | 15 mm |