N/A

-

Inventek Systems

Inventek

Details

多协议模块

196

Tray

Wireless & RF Modules

多协议模块

N/A

-

+ 85 C

- 40 C

GPIO, I2S, SDIO, UART

802.11az

IW611HN

N/A

-

Quectel

Quectel

Quectel Wireless Solutions

N/A

-

500

Quectel

Quectel

有

Reel

L76

Quectel Wireless Solutions

N/A

-

3 Mbps

一级

表面贴装

External

有

+ 85 C

3.6 V

0.352740 oz

- 30 C

160

1.8 V

UART

- 89 dBm

莱尔德连接

莱尔德连接

External

Details

Class 1

Industrial grade

Bluetooth Modules - 802.15.1

SMD模块

-30 to 85 °C

Tray

BT830

Bluetooth v4.0 Dual Mode Module

Wireless & RF Modules

2.44 GHz

30

3, 3.6 V

7 dBm

3 Mb/s

Bluetooth 4.0

2.402 GHz to 2.48 GHz

Industrial

- 89 dBm

蓝牙模块

1.6 mm

13 mm

8.5 mm

N/A

-

IW611HN

N/A

-

推销

1

Quectel

Quectel

Aluminium

Fins, Square

ASIC

Compliant

Quectel Wireless Solutions

40.005 mm

40.005 mm

N/A

-

Quectel

Quectel

Axial

Axial

100

-55°C ~ 150°C

Tape & Reel (TR)

PTF

0.145 Dia x 0.375 L (3.68mm x 9.53mm)

±1%

活跃

2

±5ppm/°C

1.62 kOhms

Metal Film

0.25W, 1/4W

--

Moisture Resistant

Quectel Wireless Solutions

--

N/A

-

Axial

Axial

-55°C ~ 150°C

Bulk

PTF

0.145 Dia x 0.375 L (3.68mm x 9.53mm)

±0.5%

活跃

2

±5ppm/°C

15 Ohms

Metal Film

0.25W, 1/4W

--

Moisture Resistant

--

N/A

-

表面贴装

Module

-40°C ~ 85°C

Tray

--

活跃

1.7 V ~ 3.6 V

2.4GHz

512kB Flash, 64kB RAM

60kbps

nRF52832

ANT®, Bluetooth v4.2

4dBm

Bluetooth

Integrated, Trace

-96dBm

I²C, SPI, UART

--

--

--

N/A

-

表面贴装

Module

-40°C ~ 85°C

Tray

--

活跃

1.7 V ~ 3.6 V

2.4GHz

512kB Flash, 64kB RAM

60kbps

nRF52832

ANT®, Bluetooth v4.2

4dBm

Bluetooth

Integrated, Trace

-96dBm

I²C, SPI, UART

--

--

--

N/A

-

921.6 Kbps

表面贴装

15 I/O

+ 70 C

3.6 V

- 20 C

5000

1.9 V

SMD/SMT

10 mA

I2C, SPI, UART

10 mA

Microchip

微芯片技术

SRAM

24 kB

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

RF System on a Chip - SoC

表面贴装

QFN-32

微芯片技术

QFN

-40°C ~ 85°C

Reel

IS1871

Bluetooth

Wireless & RF Integrated Circuits

Si

1.9V ~ 3.6V

2.402GHz ~ 2.48GHz

32

2.4 GHz

14.7000, 15.3000 V

256kB Flash, 32kB ROM, 24kB SRAM

0.013 A

Flash, ROM

256 kB, 32 kB

0 dBm

921.6kbps

8 bit

8051

Bluetooth v4.2

0dBm

Bluetooth

PCB Trace

- 90 dBm

6 Channel

ADC, I²C, PWM, SPI, UART

13mA

13mA

-

RF System on a Chip - SoC

0.9 mm

4 mm

4 mm

N/A

-

RN52

Obsolete

表面贴装

50-SMD Module

微芯片技术

Bulk

-40°C ~ 85°C

RN52

-

2.4GHz

16MB Flash

3Mbps

-

Bluetooth v3.0, Class 2

4dBm

Bluetooth

PCB Trace

-85dBm

AIO, I²S, SPI, UART, USB

-

-

DPSK, DQPSK, GFSK

N/A

-

最后一次购买

Murata Electronics

Bulk

*

N/A

-

Bulk

PCM-24

活跃

卡边缘

Module

Advantech Corp

Miscellaneous

-40°C ~ 85°C

-

3.3V ~ 3.6V

700MHz, 850MHz, 900MHz, 1.7GHz, 1.8GHz, 1.9GHz, 2.1GHz, 2.6GHz

-

150Mbps

-

EDGE, GPRS, GSM, HSPA+, LTE, UMTS

-

Cellular, WiFi

Whip, Tilt

-

USB

-

-

-

N/A

-

-40 - 80

Polyvinyl chloride (PVC)

Grey

-5 - 80

9.1

Colour

0.25

Braiding

无

Polyurethane (PUR)

Class 5 = flexible

According to IEC/EN 60332-1-2

N/A

-

Wireless & RF Modules

GPS模块

N/A

-

Inventek Systems

Inventek

Details

Tray

活跃

WiFi Modules - 802.11

表面贴装

44-SMD Module

Inventek Systems

648

-40°C ~ 85°C

Tray

eS-WiFi™, WICED

Wireless & RF Modules

3V ~ 3.6V

2.4GHz ~ 2.497GHz

-

72.2Mbps

BCM43362

802.11b/g/n

18dBm

WiFi

Antenna Not Included, U.FL

-93dBm

ADC, GPIO, UART, USB

-

340mA

16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

WiFi模块

N/A

-

莱尔德连接

莱尔德连接

Details

射频模块

100

Tray

Wireless & RF Modules

射频模块

N/A

-

N/A

-

Inventek Systems

Inventek

Details

Tray

活跃

多协议模块

表面贴装

54-SMD Module

Inventek Systems

196

-40°C ~ 85°C

Tray

eS-WiFi™, WICED

Wireless & RF Modules

3V ~ 3.6V

2.4GHz ~ 2.497GHz, 4.9GHz ~ 5.845GHz

2MB Flash

72.2Mbps

CYW43340, STM32F405

802.11a/b/g/n, Bluetooth v4.0

19dBm

Bluetooth, WiFi

Antenna Not Included, U.FL

-95.5dBm

ADC, GPIO, UART, USB

-

-

16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, GFSK, OFDM, QPSK

多协议模块

N/A

-

N/A

-

RYZ012

活跃

External

12 mm x 12 mm x 2.31 mm

+ 85 C

3.6 V

- 40 C

1.8 V

4.8 mA

SPI, UART

- 101 dBm

5.3 mA

Bluetooth Low Energy (BLE)

表面贴装

26-SMD Module

Renesas Electronics America Inc

Tray

-40°C ~ 85°C (TA)

-

Wireless & RF Modules

1.8V ~ 3.6V

2.4GHz

-

10 dBm

2Mbps

-

Bluetooth v5.0

10dBm

Bluetooth

不包括天线

-101dBm

SPI, UART

5.3mA

4.8mA

-

蓝牙模块

蓝牙模块

N/A

-

1000

Renesas Electronics

Renesas Electronics

Tape & Reel (TR)

RYZ012

活跃

Internal

12 mm x 12 mm x 2.31 mm

+ 85 C

3.6 V

- 40 C

1.8 V

4.8 mA

SPI, UART

- 101 dBm

5.3 mA

Bluetooth Low Energy (BLE)

Renesas Electronics

表面贴装

26-SMD Module

Renesas Electronics America Inc

有

-40°C ~ 85°C (TA)

Reel

-

Wireless & RF Modules

1.8V ~ 3.6V

2.4GHz

-

10 dBm

2Mbps

-

Bluetooth v5.0

10dBm

Bluetooth

Integrated, Trace

-101dBm

SPI, UART

5.3mA

4.8mA

-

蓝牙模块

蓝牙模块

N/A

-

RYZ012

活跃

External

12 mm x 12 mm x 2.31 mm

+ 85 C

3.6 V

- 40 C

1.8 V

4.8 mA

SPI, UART

- 101 dBm

5.3 mA

Bluetooth Low Energy (BLE)

表面贴装

26-SMD Module

Renesas Electronics America Inc

Tape & Reel (TR)

-40°C ~ 85°C (TA)

-

Wireless & RF Modules

1.8V ~ 3.6V

2.4GHz

-

10 dBm

2Mbps

-

Bluetooth v5.0

10dBm

Bluetooth

不包括天线

-101dBm

SPI, UART

5.3mA

4.8mA

-

蓝牙模块

蓝牙模块