类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 端口的数量 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 数据总线宽度 | 通信IC类型 | 总线兼容性 | 最大数据传输率 | 运输载体类型 | 驱动接口标准 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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.png) | 89HPES12N3YCBC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | BGA | 324 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 324 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 1.4mm | 19mm | 19mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||
| 89HPES24N3A1ZCBXG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 420 | 1999 | e1 | yes | 3 (168 Hours) | 420 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 420 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||
| 89H48H12G3YCHLI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | YES | 676 | 85°C | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 676 | EAR99 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 676 | 不合格 | 1.1V | 11.83.3V | INDUSTRIAL | 0.95V | BUS CONTROLLER, PCI | 100MHz | 7420mA | ISA; VGA | IEEE 1149.6AC; IEEE 1149.1 | 2.9mm | 27mm | 27mm | 3.2mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
| 89HPES16T4G2ZBBX | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Lead, Tin | 表面贴装 | 288 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 288 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | not_compliant | 20 | 288 | 不合格 | 1.1V | 12.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 908mA | PCI | 1.1mm | 23mm | 23mm | 1.1mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
| 89HPES32H8ZAAR | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 900 | 125MHz | Bulk | 1999 | e1 | no | 活跃 | 4 (72 Hours) | 900 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 245 | 1V | 未说明 | 900 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 128 Gbps | PCI | 3.42mm | 31mm | 31mm | 2.82mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||
| 89HT0816PYDBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | BGA | 196 | 100MHz | 2012 | yes | 活跃 | 196 | I2C | 15mm | 15mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
| 89HPES12NT3ZBBC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | BGA | 324 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.4mm | 19mm | 19mm | 1.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||
 | XRT81L27IV | Exar Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | 表面贴装 | LQFP | 128 | 85°C | e0 | no | 128 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 7 | 3.3V | 0.5mm | 未说明 | 128 | 不合格 | 3.3V | INDUSTRIAL | Serial | pcm收发器 | CEPT PCM-30/E-1 | 1.6mm | 20mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| 89HPES22H16ZABLI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 484 | EAR99 | Tin/Lead (Sn63Pb37) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 88 Gbps | PCI | 3.34mm | 23mm | 23mm | 3.34mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
| TSI382A-66IL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144 | 66MHz | 2004 | e0 | no | Discontinued | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.2V | 0.8mm | 144 | 3.3V | 1.26V | INDUSTRIAL | PCI | 32b | ISA; SBUS; VGA | 312.5 MBps | 1.4mm | 10mm | 10mm | 1.4mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
| 89HPES48H12ZABL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 1156 | 125MHz | Bulk | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 192 Gbps | PCI | 3.42mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
| 89HPES16NT2ZBBC8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | BGA | 70°C | Tape & Reel (TR) | 1999 | e0 | 3 (168 Hours) | 484 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 1mm | not_compliant | 不合格 | 13.3V | COMMERCIAL | PCI Express | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| 89HPES32T8ZHBXG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 500 | 125MHz | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 500 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 260 | 1V | 30 | 500 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 8 | BUS CONTROLLER, PCI | PCI | 1.7mm | 31mm | 31mm | 1.1mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
| 89HPEB383ZAEM8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TQFP | 128 | 33MHz | 1999 | e0 | no | Discontinued | 3 (168 Hours) | 128 | Tin/Lead (Sn/Pb) | 85°C | 0°C | 8542.31.00.01 | QUAD | 鸥翼 | 240 | 1.05V | 0.4mm | 20 | 128 | 5V | COMMERCIAL | PCI Express | BUS CONTROLLER, PCI | 32b | ISA; PCI; SBUS; VGA; USB | 2500 MBps | 1.2mm | 14mm | 14mm | 1mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||
| 89H64H16G3YBBL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BGA | YES | 1156 | 70°C | 1999 | e0 | no | Discontinued | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | 未说明 | 不合格 | 1.1V | 11.83.3V | COMMERCIAL | 0.95V | PCI Express | BUS CONTROLLER, PCI | 100MHz | 8625mA | ISA; VGA | 3.42mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||
| 89HPES16T4G2ZBBXGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | Copper, Silver, Tin | 表面贴装 | BGA | 288 | 85°C | 1999 | e1 | yes | 3 (168 Hours) | 288 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 288 | 不合格 | 1.1V | 12.53.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||
| 89H32NT8AG2ZCHLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 225 | not_compliant | 20 | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||
| 89H32NT24BG2ZCHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 2009 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||
| 89H32NT24AG2ZAHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Lead, Tin | 表面贴装 | FCBGA | 125MHz | 1999 | 70°C | 0°C | 3.3V | PCI Express | 24 | 256 Gbps | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| 89H48H12G3YBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 676 | 1999 | yes | EAR99 | 8542.39.00.01 | 676 | PCI Express | 27mm | 27mm | 3.2mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
| 89HPES24NT3ZBBXG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 420 | 70°C | 1999 | e1 | yes | 3 (168 Hours) | 420 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 420 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||
| 89HPES24NT3ZBBX | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 420 | 70°C | 1999 | e0 | no | 3 (168 Hours) | 420 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 420 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||
| 89HAL808G2ZBHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | BGA | 1996 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HP0504UZBNRG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | QFN | 36 | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | EAR99 | 8542.39.00.01 | 36 | PCI Express | 4mm | 7.5mm | 900μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||
| 89H24NT6AG2ZCHLI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 6 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; VGA | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 |