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我的订单 我的询价 0755-82520436 3307104213

类别是'评估板 - 嵌入式 - 复杂逻辑器件(FPGA, CPLD)'

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产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

安装类型

包装/外壳

厂商

操作温度

系列

尺寸/尺寸

连接器类型

功率(瓦特)

电压 - 供电

频率

工作电源电压

内存大小

速度

内存大小

核心处理器

数据率

建筑学

使用的 IC/零件

议定书

消耗功率

功率 - 输出

无线电频率系列/标准

天线类型

敏感度

以太网

串行接口

接收电流

USB

传输电流

外形尺寸

调制

核数量

模块/板式

闪光大小

萨塔

内存容量/安装

储存界面

视频输出

扩展站点/总??线

数字 I/O 线

冷却方式

RS-232(422,485)

模拟输入:输出

协处理器

TE0807-03-7AI21-A TE0807-03-7AI21-A

Trenz Electronic 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

Xilinx

XCZU7CG-1FBVB900I

4 GB

4 GB

GPIO, Serial

- 40 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

Box

TE0807

活跃

76 mm x 52 mm

Trenz Electronic GmbH

This product may require additional documentation to export from the United States.

-40°C ~ 85°C

TE0807

2.050 L x 2.990 W (52.00mm x 76.00mm)

B2B

-

4GB

Zynq UltraScale+ XCZU7CG-1FBVB900I

5.2 cm x 7.6 cm

MPU核心

128MB

-

TE0808-05-BBE21-A TE0808-05-BBE21-A

Trenz Electronic 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

Xilinx

XCZU15EG-1FFVC900E

4 GB

4 GB

GPIO, Serial

0 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

76 mm x 52 mm

This product may require additional documentation to export from the United States.

5.2 cm x 7.6 cm

TE0808-05-6BE21-A TE0808-05-6BE21-A

Trenz Electronic 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

Xilinx

XCZU6EG-1FFVC900E

4 GB

4 GB

GPIO, Serial

0 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

5.2 cm x 7.6 cm

This product may require additional documentation to export from the United States.

5.2 cm x 7.6 cm

TE0808-05-6BE21-L TE0808-05-6BE21-L

Trenz Electronic 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

Xilinx

XCZU6EG-1FFVC900E

4 GB

4 GB

GPIO, Serial

0 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

5.2 cm x 7.6 cm

This product may require additional documentation to export from the United States.

5.2 cm x 7.6 cm

TE0808-05-9BE21-A TE0808-05-9BE21-A

Trenz Electronic 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

Xilinx

XCZU9EG-1FFVC900E

4 GB

4 GB

GPIO, Serial

0 C

+ 85 C

128 MB

DDR4

Zynq UltraScale+

1

Bulk

活跃

5.2 cm x 7.6 cm

Trenz Electronic GmbH

This product may require additional documentation to export from the United States.

0°C ~ 85°C

-

2.050 L x 2.990 W (52.00mm x 76.00mm)

B2B

-

4GB

Zynq UltraScale+ XCZU9EG-1FFVC900E

5.2 cm x 7.6 cm

MPU核心

128MB

-

IW-G34M-SM04-4L002G-E008G-BIC IW-G34M-SM04-4L002G-E008G-BIC

iWave Systems 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

NXP

i.MX 8M Quad

4 GB

2 GB

GPIO, I2C, I2S, SPI, UART, USB

- 40 C

+ 85 C

8 GB

LPDDR4

i.MX 8M

1

Bulk

活跃

iWave 系统

This product may require additional documentation to export from the United States.

i.MX 8M Mini Quad

400 MHz, 1.6 GHz

3.3 V

2 GB

uQseven

IW-G37M-SM04-4L002G-E008G-BIA IW-G37M-SM04-4L002G-E008G-BIA

iWave Systems 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

NXP

i.MX 8M Nano Quad

2 GB

Ethernet, GPIO, I2C, SPI, UART, USB

- 40 C

+ 85 C

8 GB

LPDDR4

i.MX8M Nano

1

Bulk

活跃

67.6 mm x 37 mm

iWave 系统

This product may require additional documentation to export from the United States.

-40°C ~ 85°C

i.MX 8M Nano Quad

2.660 x 1.460 (67.560mm x 37.08mm)

-

750 MHz, 1.5 GHz

3.3 V

1.5GHz

2 GB

ARM® Cortex®-A53, ARM® Cortex®-M7

10/10/100Mbps (1), GbE

USB OTG (1)

SO-DIMM

5

2GB/0GB

eMMC, MicroSD

DSI, MIPI-CSI

I²C, SPI, UART

-

-

-

IW-G37M-SM04-4L001G-E008G-BIA IW-G37M-SM04-4L001G-E008G-BIA

iWave Systems 数据表

N/A

-

最小起订量: 1

倍率: 1

Details

NXP

i.MX 8M Nano Quad

1 GB

Ethernet, GPIO, I2C, SPI, UART, USB

- 40 C

+ 85 C

8 GB

LPDDR4

i.MX8M Nano

1

Bulk

活跃

iWave 系统

This product may require additional documentation to export from the United States.

-40°C ~ 85°C

i.MX 8M Nano Quad

2.660 x 1.460 (67.560mm x 37.08mm)

-

750 MHz, 1.5 GHz

3.3 V

1.5GHz

1 GB

ARM® Cortex®-A53, ARM® Cortex®-M7

10/10/100Mbps (1), GbE

USB OTG (1)

SO-DIMM

5

1GB/0GB

eMMC, MicroSD

DSI, MIPI-CSI

I²C, SPI, UART

-

-

-

SOM-7569BCBCC-S5B1 SOM-7569BCBCC-S5B1

Advantech 数据表

N/A

-

最小起订量: 1

倍率: 1

Atom X5-E3950

8 GB

4 GB

Audio, CAN, COM, DP, eDP, Ethernet, GPIO, HDMI, I2C, LPC, PCIe, SATA, SDIO, SMBus, USB 2.0, USB 3.0

0 C

+ 60 C

1

活跃

84 mm x 55 mm

Advantech Corp

Intel

0°C ~ 60°C

3.310 x 2.170 (84.07mm x 55.12mm)

9.5W

1.6 GHz

4.75 V to 20 V

1.6GHz, 1.8GHz

Atom X5-E3940

10/100/1000Mbps

USB 2.0 (8), USB 3.0 (2)

微型COM Express

4

4GB/0GB

eMMC

HDMI, LVDS

-

Fan

-

SOM-7569BCBCC-S6B1 SOM-7569BCBCC-S6B1

Advantech 数据表

N/A

-

最小起订量: 1

倍率: 1

Atom X5-E3950

8 GB

4 GB

Audio, CAN, COM, DP, eDP, Ethernet, GPIO, HDMI, I2C, LPC, PCIe, SATA, SDIO, SMBus, USB 2.0, USB 3.0

0 C

+ 60 C

1

4

Watchdog

4x PCIex1/1x PCIex4

Box

SOM-7569

最后一次购买

84 mm x 55 mm

Advantech Corp

Intel

0 to 60 °C

-

3.310 x 2.170 (84.07mm x 55.12mm)

12W

1.6 GHz

4.75 V to 20 V

1.6GHz

Atom x7-E3950

x86-64

One 10/100/1000

8 USB2.0/2 USB3.0

微型COM Express

4

2 SATA3.0

4GB/4GB

SATA 2.0 (2)

1 DisplayPort/1 HDMI/1 18/24-bit LVDS

HD-A, I²C, LPC, PCIe, SMBus

8

Fan

0

-

A10S-P9-A5E-RC-SB A10S-P9-A5E-RC-SB

Critical Link 数据表

N/A

-

最小起订量: 1

倍率: 1

ARM

ARM Cortex A9

256 kB

I2C, SPI, UART

0 C

+ 70 C

32 kB, 512 kB

2 GB, 4 GB

DDR4

1

Bag

A10S-P9

活跃

4 in x 4 in

Critical Link LLC

Details

0°C ~ 70°C

MitySOM

4.000 L x 4.000 W (101.50mm x 101.50mm)

Board-to-Board (BTB)

1.2 GHz

5 V, 12 V

1.2GHz

4GB

ARM® Cortex®-A9

MPU, FPGA Core

-

NEON™ SIMD

5728-PJ-4AA-RC 5728-PJ-4AA-RC

Critical Link 数据表

N/A

-

最小起订量: 1

倍率: 1

Texas Instruments, Xilinx

AM5728, Artix-7

4 GB

2 GB

Audio, Ethernet, HDIM, I2C, PCIe, SATA, UART, USB 2.0, USB 3.0, Video

0 C

+ 70 C

1

MitySOM

Bag

活跃

88 mm x 69.42 mm

Critical Link LLC

Details

0°C ~ 70°C

MitySOM-AM57F

3.460 L x 2.730 W (87.88mm x 69.34mm)

Edge Connector - 310, Board-to-Board (BTB) - 100

1.5 GHz

5.5 V

1.5GHz

1GB

ARM Cortex-A15

小尺寸

MPU, FPGA Core

32MB

Artix-7

MTQN-MNG3-B01 MTQN-MNG3-B01

Multi-Tech Systems, Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

底座安装

多技术系统

STM32L471

128 kB

I2C, SPI, UART, USB

- 40 C

+ 85 C

SRAM

1 MB

Flash

50

蜻蜓纳米

2 lbs

Bulk

MTQN-MNG3

活跃

28.96 mm x 32.51 mm

Module

Multi-Tech Systems Inc.

Details

-40°C ~ 85°C

MultiTech Dragonfly™ Nano

3.3V ~ 5V

700 MHz, 750 MHz, 800 MHz, 900 MHz, 1.7 GHz, 1.8 GHz, 1.9 GHz

3.3 V to 5 V

-

375kbps

-

GPRS, GSM, LTE

-

Cellular

不包括天线

-

I²C, SPI, UART, USB

-

-

-

SM-K26-XCL2GI-ED SM-K26-XCL2GI-ED

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

Xilinx

XCK26-SFVC784-2LV-I

4 GB

4 GB

备用电池

L2

K26I

64 MB, 16 GB

DDR4

16 GB

eMMC

1

Kria

+ 100 C

- 40 C

CAN, GPIO, I2C, SDIO, SPI, UART, USB

自适应系统模块

Box

活跃

4GB

AMD 赛灵思

Details

-40°C ~ 100°C (TJ)

K26

3.030 L x 2.360 W (77.00mm x 60.00mm)

2 x 240 Pin

533 MHz, 1.33 GHz

5 V

533MHz, 1.333GHz

4 GB

ARM® Cortex®-A53

15 W

-

FPGA核心

16GB eMMC, 64MB QSPI

Arm® Cortex®-R5F

SM-K26-XCL2GC-ED SM-K26-XCL2GC-ED

Xilinx 数据表

N/A

-

最小起订量: 1

倍率: 1

Xilinx

XCK26-SFVC784-2LV-C

4 GB

4 GB

CAN, GPIO, I2C, SDIO, SPI, UART, USB

0 C

+ 85 C

备用电池

L2

K26C

64 MB, 16 GB

DDR4

16 GB

eMMC

1

Kria

自适应系统模块

Box

活跃

77 mm x 60 mm x 10.9 mm

4GB

AMD 赛灵思

Details

0°C ~ 85°C (TJ)

K26

3.030 L x 2.360 W (77.00mm x 60.00mm)

2 x 240 Pin

533 MHz, 1.33 GHz

5 V

533MHz, 1.333GHz

4 GB

ARM® Cortex®-A53

15 W

-

FPGA核心

16GB eMMC, 64MB QSPI

Arm® Cortex®-R5F

MTQ-MNA1-B01.R1 MTQ-MNA1-B01.R1

Multi-Tech Systems, Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

底座安装

STM32F411

96 kB

I2C, SPI, UART

- 40 C

+ 85 C

512 kB

SRAM

512 kB

Flash

1

4 lbs

Box

活跃

58.4 mm x 34.9 mm

Module

Multi-Tech Systems Inc.

多技术系统

-40°C ~ 85°C

MultiTech Dragonfly™

5V

700 MHz, 1.7 GHz, 1.9 GHz

5 V

512kB Flash, 96kB SRAM

375kbps

STM32F411RET

GNSS, GPS, LTE

-

Cellular, Navigation

不包括天线

-

I²C, SPI, UART, USB

57mA

57mA

-

MTQ-LAT3-B01.R2A-SP MTQ-LAT3-B01.R2A-SP

Multi-Tech Systems, Inc. 数据表

N/A

-

最小起订量: 1

倍率: 1

底座安装

STM32F411

96 kB

96 kB

I2C, SPI, UART, USB

- 40 C

+ 85 C

512 kB

SRAM

512 kB

Flash

1

2 lbs

Bag

活跃

Module

Multi-Tech Systems Inc.

多技术系统

-40°C ~ 85°C

MultiTech Dragonfly™

5V

700 MHz, 850 MHz, 1.7 GHz, 1.9 GHz

3.3 V to 5 VDC

512kB Flash, 96kB SRAM

10Mbps

STM32F411RET

4G LTE CAT-1 (AT&T/T-Mobile)

-

Cellular

Antenna Not Included, U.FL

-

I²C, SPI, UART, USB

58mA

58mA

-

CC-WMX-ET8D-NN CC-WMX-ET8D-NN

Digi 数据表

N/A

-

最小起订量: 1

倍率: 1

NXP

i.MX 8M Mini Quad

2 GB

2 GB

Bluetooth, Ethernet, I2C, PCIe, SPI, UART, USB, WiFi

- 40 C

+ 85 C

16 kB, 32 kB

LPDDR4

8 GB

eMMC

50

Box

CC-WMX

活跃

45 mm x 40 mm x 3.5 mm

2GB

Digi

Details

-40°C ~ 85°C

ConnectCore® 8M Mini

1.770 L x 1.570 W (45.00mm x 40.00mm)

USB

1.6 GHz

1.6GHz

2 GB

ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8

Digi SMTplus

MPU核心

-

-

PICOIMX7D10R05MSD9377 PICOIMX7D10R05MSD9377

TechNexion 数据表

N/A

-

最小起订量: 1

倍率: 1

ARM Cortex-A7 + M4

512 MB

I2S

0 C

+ 60 C

DDR3L

1

40 mm x 37 mm x 3.85 mm

NXP

PICO-IMX7

1 GHz

5 VDC

512 MB

PICO

PICOIMX6Y209R02E049377 PICOIMX6Y209R02E049377

TechNexion 数据表

N/A

-

最小起订量: 1

倍率: 1

i.MX 6UltraLite

256 MB

4 GB

eMMC

10

NXP

900 MHz

FLEXIMX8MMQ18R10E169377 FLEXIMX8MMQ18R10E169377

TechNexion 数据表

N/A

-

最小起订量: 1

倍率: 1

ARM Cortex-A53 + M4

1 GB

JTAG

0 C

+ 60 C

LPDDR4

16 GB

eMMC

10

NXP

1.8 GHz

5 VDC

1 GB

FLEX

FLEXIMX8MMQ18R40E16 FLEXIMX8MMQ18R40E16

TechNexion 数据表

N/A

-

最小起订量: 1

倍率: 1

ARM Cortex-A53 + M4

4 GB

JTAG

0 C

+ 60 C

LPDDR4

16 GB

eMMC

10

NXP

1.8 GHz

5 VDC

4 GB

FLEX

PICOIMX6Y209R05E049377 PICOIMX6Y209R05E049377

TechNexion 数据表

N/A

-

最小起订量: 1

倍率: 1

i.MX 6UltraLite

512 MB

4 GB

eMMC

1

NXP

900 MHz

EDMIMX8MQ13R40E16 EDMIMX8MQ13R40E16

TechNexion 数据表

N/A

-

最小起订量: 1

倍率: 1

ARM Cortex-A53 + M4

4 GB

I2S

0 C

+ 60 C

LPDDR4

16 GB

eMMC

10

NXP

1.3 GHz

5 VDC

4 GB

EDM Type 1

PICOIMX8MMQ18R10E16 PICOIMX8MMQ18R10E16

TechNexion 数据表

N/A

-

最小起订量: 1

倍率: 1

i.MX 8M Mini Quad

1 GB

eMMC

1

NXP

1.8 MHz