类别是'评估板 - 嵌入式 - 复杂逻辑器件(FPGA, CPLD)'
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 连接器类型 | 功率(瓦特) | 电压 - 供电 | 频率 | 工作电源电压 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 数据率 | 建筑学 | 使用的 IC/零件 | 议定书 | 消耗功率 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 敏感度 | 以太网 | 串行接口 | 接收电流 | USB | 传输电流 | 外形尺寸 | 调制 | 核数量 | 模块/板式 | 闪光大小 | 萨塔 | 内存容量/安装 | 储存界面 | 视频输出 | 扩展站点/总??线 | 数字 I/O 线 | 冷却方式 | RS-232(422,485) | 模拟输入:输出 | 协处理器 | |||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE0807-03-7AI21-A | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | Xilinx | XCZU7CG-1FBVB900I | 4 GB | 4 GB | GPIO, Serial | - 40 C | + 85 C | 128 MB | DDR4 | Zynq UltraScale+ | 1 | Box | TE0807 | 活跃 | 76 mm x 52 mm | Trenz Electronic GmbH | This product may require additional documentation to export from the United States. | -40°C ~ 85°C | TE0807 | 2.050 L x 2.990 W (52.00mm x 76.00mm) | B2B | - | 4GB | Zynq UltraScale+ XCZU7CG-1FBVB900I | 5.2 cm x 7.6 cm | MPU核心 | 128MB | - | ||||||||||||||||||||||||||||||||||||||||||||||
TE0808-05-BBE21-A | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | Xilinx | XCZU15EG-1FFVC900E | 4 GB | 4 GB | GPIO, Serial | 0 C | + 85 C | 128 MB | DDR4 | Zynq UltraScale+ | 1 | 76 mm x 52 mm | This product may require additional documentation to export from the United States. | 5.2 cm x 7.6 cm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0808-05-6BE21-A | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | Xilinx | XCZU6EG-1FFVC900E | 4 GB | 4 GB | GPIO, Serial | 0 C | + 85 C | 128 MB | DDR4 | Zynq UltraScale+ | 1 | 5.2 cm x 7.6 cm | This product may require additional documentation to export from the United States. | 5.2 cm x 7.6 cm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0808-05-6BE21-L | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | Xilinx | XCZU6EG-1FFVC900E | 4 GB | 4 GB | GPIO, Serial | 0 C | + 85 C | 128 MB | DDR4 | Zynq UltraScale+ | 1 | 5.2 cm x 7.6 cm | This product may require additional documentation to export from the United States. | 5.2 cm x 7.6 cm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TE0808-05-9BE21-A | Trenz Electronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | Xilinx | XCZU9EG-1FFVC900E | 4 GB | 4 GB | GPIO, Serial | 0 C | + 85 C | 128 MB | DDR4 | Zynq UltraScale+ | 1 | Bulk | 活跃 | 5.2 cm x 7.6 cm | Trenz Electronic GmbH | This product may require additional documentation to export from the United States. | 0°C ~ 85°C | - | 2.050 L x 2.990 W (52.00mm x 76.00mm) | B2B | - | 4GB | Zynq UltraScale+ XCZU9EG-1FFVC900E | 5.2 cm x 7.6 cm | MPU核心 | 128MB | - | |||||||||||||||||||||||||||||||||||||||||||||||
IW-G34M-SM04-4L002G-E008G-BIC | iWave Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | NXP | i.MX 8M Quad | 4 GB | 2 GB | GPIO, I2C, I2S, SPI, UART, USB | - 40 C | + 85 C | 8 GB | LPDDR4 | i.MX 8M | 1 | Bulk | 活跃 | iWave 系统 | This product may require additional documentation to export from the United States. | i.MX 8M Mini Quad | 400 MHz, 1.6 GHz | 3.3 V | 2 GB | uQseven | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
IW-G37M-SM04-4L002G-E008G-BIA | iWave Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | NXP | i.MX 8M Nano Quad | 2 GB | Ethernet, GPIO, I2C, SPI, UART, USB | - 40 C | + 85 C | 8 GB | LPDDR4 | i.MX8M Nano | 1 | Bulk | 无 | 活跃 | 67.6 mm x 37 mm | iWave 系统 | This product may require additional documentation to export from the United States. | -40°C ~ 85°C | i.MX 8M Nano Quad | 2.660 x 1.460 (67.560mm x 37.08mm) | - | 750 MHz, 1.5 GHz | 3.3 V | 1.5GHz | 2 GB | ARM® Cortex®-A53, ARM® Cortex®-M7 | 10/10/100Mbps (1), GbE | USB OTG (1) | SO-DIMM | 5 | 2GB/0GB | eMMC, MicroSD | DSI, MIPI-CSI | I²C, SPI, UART | - | - | - | ||||||||||||||||||||||||||||||||||||||
IW-G37M-SM04-4L001G-E008G-BIA | iWave Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | NXP | i.MX 8M Nano Quad | 1 GB | Ethernet, GPIO, I2C, SPI, UART, USB | - 40 C | + 85 C | 8 GB | LPDDR4 | i.MX8M Nano | 1 | Bulk | 无 | 活跃 | iWave 系统 | This product may require additional documentation to export from the United States. | -40°C ~ 85°C | i.MX 8M Nano Quad | 2.660 x 1.460 (67.560mm x 37.08mm) | - | 750 MHz, 1.5 GHz | 3.3 V | 1.5GHz | 1 GB | ARM® Cortex®-A53, ARM® Cortex®-M7 | 10/10/100Mbps (1), GbE | USB OTG (1) | SO-DIMM | 5 | 1GB/0GB | eMMC, MicroSD | DSI, MIPI-CSI | I²C, SPI, UART | - | - | - | |||||||||||||||||||||||||||||||||||||||
SOM-7569BCBCC-S5B1 | Advantech | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Atom X5-E3950 | 8 GB | 4 GB | Audio, CAN, COM, DP, eDP, Ethernet, GPIO, HDMI, I2C, LPC, PCIe, SATA, SDIO, SMBus, USB 2.0, USB 3.0 | 0 C | + 60 C | 1 | 有 | 活跃 | 84 mm x 55 mm | Advantech Corp | Intel | 0°C ~ 60°C | 3.310 x 2.170 (84.07mm x 55.12mm) | 9.5W | 1.6 GHz | 4.75 V to 20 V | 1.6GHz, 1.8GHz | Atom X5-E3940 | 10/100/1000Mbps | USB 2.0 (8), USB 3.0 (2) | 微型COM Express | 4 | 4GB/0GB | eMMC | HDMI, LVDS | - | Fan | - | ||||||||||||||||||||||||||||||||||||||||||||||
SOM-7569BCBCC-S6B1 | Advantech | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Atom X5-E3950 | 8 GB | 4 GB | Audio, CAN, COM, DP, eDP, Ethernet, GPIO, HDMI, I2C, LPC, PCIe, SATA, SDIO, SMBus, USB 2.0, USB 3.0 | 0 C | + 60 C | 1 | 4 | Watchdog | 4x PCIex1/1x PCIex4 | Box | SOM-7569 | 有 | 最后一次购买 | 84 mm x 55 mm | Advantech Corp | Intel | 0 to 60 °C | - | 3.310 x 2.170 (84.07mm x 55.12mm) | 12W | 1.6 GHz | 4.75 V to 20 V | 1.6GHz | Atom x7-E3950 | x86-64 | One 10/100/1000 | 8 USB2.0/2 USB3.0 | 微型COM Express | 4 | 2 SATA3.0 | 4GB/4GB | SATA 2.0 (2) | 1 DisplayPort/1 HDMI/1 18/24-bit LVDS | HD-A, I²C, LPC, PCIe, SMBus | 8 | Fan | 0 | - | ||||||||||||||||||||||||||||||||||||
A10S-P9-A5E-RC-SB | Critical Link | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ARM | ARM Cortex A9 | 256 kB | I2C, SPI, UART | 0 C | + 70 C | 32 kB, 512 kB | 2 GB, 4 GB | DDR4 | 1 | Bag | A10S-P9 | 活跃 | 4 in x 4 in | Critical Link LLC | Details | 0°C ~ 70°C | MitySOM | 4.000 L x 4.000 W (101.50mm x 101.50mm) | Board-to-Board (BTB) | 1.2 GHz | 5 V, 12 V | 1.2GHz | 4GB | ARM® Cortex®-A9 | MPU, FPGA Core | - | NEON™ SIMD | |||||||||||||||||||||||||||||||||||||||||||||||
5728-PJ-4AA-RC | Critical Link | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Texas Instruments, Xilinx | AM5728, Artix-7 | 4 GB | 2 GB | Audio, Ethernet, HDIM, I2C, PCIe, SATA, UART, USB 2.0, USB 3.0, Video | 0 C | + 70 C | 1 | MitySOM | Bag | 活跃 | 88 mm x 69.42 mm | Critical Link LLC | Details | 0°C ~ 70°C | MitySOM-AM57F | 3.460 L x 2.730 W (87.88mm x 69.34mm) | Edge Connector - 310, Board-to-Board (BTB) - 100 | 1.5 GHz | 5.5 V | 1.5GHz | 1GB | ARM Cortex-A15 | 小尺寸 | MPU, FPGA Core | 32MB | Artix-7 | ||||||||||||||||||||||||||||||||||||||||||||||||
MTQN-MNG3-B01 | Multi-Tech Systems, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 底座安装 | 多技术系统 | STM32L471 | 128 kB | I2C, SPI, UART, USB | - 40 C | + 85 C | SRAM | 1 MB | Flash | 50 | 蜻蜓纳米 | 2 lbs | Bulk | MTQN-MNG3 | 活跃 | 28.96 mm x 32.51 mm | Module | Multi-Tech Systems Inc. | Details | -40°C ~ 85°C | MultiTech Dragonfly™ Nano | 3.3V ~ 5V | 700 MHz, 750 MHz, 800 MHz, 900 MHz, 1.7 GHz, 1.8 GHz, 1.9 GHz | 3.3 V to 5 V | - | 375kbps | - | GPRS, GSM, LTE | - | Cellular | 不包括天线 | - | I²C, SPI, UART, USB | - | - | - | ||||||||||||||||||||||||||||||||||||||
SM-K26-XCL2GI-ED | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Xilinx | XCK26-SFVC784-2LV-I | 4 GB | 4 GB | 备用电池 | L2 | K26I | 64 MB, 16 GB | DDR4 | 16 GB | eMMC | 1 | Kria | + 100 C | - 40 C | CAN, GPIO, I2C, SDIO, SPI, UART, USB | 自适应系统模块 | Box | 活跃 | 4GB | AMD 赛灵思 | Details | -40°C ~ 100°C (TJ) | K26 | 3.030 L x 2.360 W (77.00mm x 60.00mm) | 2 x 240 Pin | 533 MHz, 1.33 GHz | 5 V | 533MHz, 1.333GHz | 4 GB | ARM® Cortex®-A53 | 15 W | - | FPGA核心 | 16GB eMMC, 64MB QSPI | Arm® Cortex®-R5F | |||||||||||||||||||||||||||||||||||||||
SM-K26-XCL2GC-ED | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Xilinx | XCK26-SFVC784-2LV-C | 4 GB | 4 GB | CAN, GPIO, I2C, SDIO, SPI, UART, USB | 0 C | + 85 C | 备用电池 | L2 | K26C | 64 MB, 16 GB | DDR4 | 16 GB | eMMC | 1 | Kria | 自适应系统模块 | Box | 活跃 | 77 mm x 60 mm x 10.9 mm | 4GB | AMD 赛灵思 | Details | 0°C ~ 85°C (TJ) | K26 | 3.030 L x 2.360 W (77.00mm x 60.00mm) | 2 x 240 Pin | 533 MHz, 1.33 GHz | 5 V | 533MHz, 1.333GHz | 4 GB | ARM® Cortex®-A53 | 15 W | - | FPGA核心 | 16GB eMMC, 64MB QSPI | Arm® Cortex®-R5F | ||||||||||||||||||||||||||||||||||||||
MTQ-MNA1-B01.R1 | Multi-Tech Systems, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 底座安装 | STM32F411 | 96 kB | I2C, SPI, UART | - 40 C | + 85 C | 512 kB | SRAM | 512 kB | Flash | 1 | 4 lbs | Box | 活跃 | 58.4 mm x 34.9 mm | Module | Multi-Tech Systems Inc. | 多技术系统 | -40°C ~ 85°C | MultiTech Dragonfly™ | 5V | 700 MHz, 1.7 GHz, 1.9 GHz | 5 V | 512kB Flash, 96kB SRAM | 375kbps | STM32F411RET | GNSS, GPS, LTE | - | Cellular, Navigation | 不包括天线 | - | I²C, SPI, UART, USB | 57mA | 57mA | - | ||||||||||||||||||||||||||||||||||||||||
MTQ-LAT3-B01.R2A-SP | Multi-Tech Systems, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 底座安装 | STM32F411 | 96 kB | 96 kB | I2C, SPI, UART, USB | - 40 C | + 85 C | 512 kB | SRAM | 512 kB | Flash | 1 | 2 lbs | Bag | 活跃 | Module | Multi-Tech Systems Inc. | 多技术系统 | -40°C ~ 85°C | MultiTech Dragonfly™ | 5V | 700 MHz, 850 MHz, 1.7 GHz, 1.9 GHz | 3.3 V to 5 VDC | 512kB Flash, 96kB SRAM | 10Mbps | STM32F411RET | 4G LTE CAT-1 (AT&T/T-Mobile) | - | Cellular | Antenna Not Included, U.FL | - | I²C, SPI, UART, USB | 58mA | 58mA | - | ||||||||||||||||||||||||||||||||||||||||
CC-WMX-ET8D-NN | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NXP | i.MX 8M Mini Quad | 2 GB | 2 GB | Bluetooth, Ethernet, I2C, PCIe, SPI, UART, USB, WiFi | - 40 C | + 85 C | 16 kB, 32 kB | LPDDR4 | 8 GB | eMMC | 50 | Box | CC-WMX | 活跃 | 45 mm x 40 mm x 3.5 mm | 2GB | Digi | Details | -40°C ~ 85°C | ConnectCore® 8M Mini | 1.770 L x 1.570 W (45.00mm x 40.00mm) | USB | 1.6 GHz | 1.6GHz | 2 GB | ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8 | Digi SMTplus | MPU核心 | - | - | ||||||||||||||||||||||||||||||||||||||||||||
PICOIMX7D10R05MSD9377 | TechNexion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ARM Cortex-A7 + M4 | 512 MB | I2S | 0 C | + 60 C | DDR3L | 1 | 40 mm x 37 mm x 3.85 mm | NXP | PICO-IMX7 | 1 GHz | 5 VDC | 512 MB | PICO | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PICOIMX6Y209R02E049377 | TechNexion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | i.MX 6UltraLite | 256 MB | 4 GB | eMMC | 10 | NXP | 900 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
FLEXIMX8MMQ18R10E169377 | TechNexion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ARM Cortex-A53 + M4 | 1 GB | JTAG | 0 C | + 60 C | LPDDR4 | 16 GB | eMMC | 10 | NXP | 1.8 GHz | 5 VDC | 1 GB | FLEX | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
FLEXIMX8MMQ18R40E16 | TechNexion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ARM Cortex-A53 + M4 | 4 GB | JTAG | 0 C | + 60 C | LPDDR4 | 16 GB | eMMC | 10 | NXP | 1.8 GHz | 5 VDC | 4 GB | FLEX | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PICOIMX6Y209R05E049377 | TechNexion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | i.MX 6UltraLite | 512 MB | 4 GB | eMMC | 1 | NXP | 900 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
EDMIMX8MQ13R40E16 | TechNexion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ARM Cortex-A53 + M4 | 4 GB | I2S | 0 C | + 60 C | LPDDR4 | 16 GB | eMMC | 10 | NXP | 1.3 GHz | 5 VDC | 4 GB | EDM Type 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
PICOIMX8MMQ18R10E16 | TechNexion | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | i.MX 8M Mini Quad | 1 GB | eMMC | 1 | NXP | 1.8 MHz |