类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 深度 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 通道数量 | 界面 | 内存大小 | 速度 | 内存大小 | 最大电源电流 | 比特数 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 密度 | 议定书 | 核心架构 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | A/D转换器数量 | 可编程I/O数 | 格式 | 功率 - 输出 | 集成缓存 | 无线电频率系列/标准 | 内存(字) | UART 通道数 | 敏感度 | 数据率（最大） | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 串行I/O数 | 接收器数 | 调制 | 外部中断数量 | 灵敏度(dBm) | 总线兼容性 | 片上数据 RAM 宽度 | [医]GPIO | DMA通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||
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 | AT86RF231-ZF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | Industrial grade | -40°C~125°C | Tray | 2009 | yes | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.8V~3.6V | 2.4GHz | 8 | 128B SRAM | 12.3mA | 0 | 6LoWPAN, WirelessHART™, Zigbee® | 3dBm | 802.15.4, General ISM > 1GHz | 2Mbps | SPI | 10.3mA~12.3mA | 7.4mA~14mA | 1 | O-QPSK | -101 dBm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC2570RHAR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 40-VFQFN Exposed Pad | 40 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 40 | 仅TxRx | 2V~3.6V | QUAD | 260 | 3V | 0.5mm | 2.4GHz | CC2570 | 40 | 3.6V | 3V | 1 | SPI, UART | ANT™ | 4dBm | General ISM > 1GHZ | 1Mbps | SPI, UART | 23.7mA | 25.9mA~34.3mA | GFSK | -86 dBm | SPI; UART | 1mm | 6mm | 6mm | 900μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC430F5125IRGZT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 有 | 2kB | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48 | 139.989945mg | 30 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 48 | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 2V~3.6V | QUAD | 260 | 3.3V | 0.5mm | 300MHz~348MHz 389MHz~464MHz 779MHz~928MHz | CC430F5125 | 48 | I2C, SPI, UART | 16kB Flash 2kB SRAM | 16 | 16b | 2 | MSP430 | 13dBm | General ISM < 1GHz | 2 | 1 | 500kBaud | I2C, IrDA, JTAG, SPI, UART | 15mA~18.5mA | 15mA~36mA | 2FSK, 2GFSK, ASK, MSK, OOK | -117 dBm | 1mm | 7mm | 7mm | 900μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NRF52832-QFAA-T | Nordic Semiconductor ASA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | -40°C | Industrial grade | 表面贴装 | 48-VFQFN Exposed Pad | YES | 85°C | Tray | 2014 | 活跃 | 2 (1 Year) | 48 | TxRx + MCU | 8542.39.00.01 | 1.7V~3.6V | QUAD | 无铅 | 未说明 | 1 | 3V | 0.4mm | 2.4GHz | 未说明 | S-XQCC-N48 | INDUSTRIAL | 512kB Flash 64kB RAM | ANT, Bluetooth v5.0 | 4dBm | Bluetooth | -96dBm | 2Mbps | I2S, SPI, UART | 5.4mA | 7.5mA | GFSK | 32 | 0.95mm | 6mm | 6mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RF430F5978IRGCR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 44 | 4kB | ACTIVE (Last Updated: 5 days ago) | 表面贴装 | 表面贴装 | 64-VFQFN Exposed Pad | 64 | 227.391525mg | FLASH | -40°C~85°C | Tape & Reel (TR) | MSP430™ | e4 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 2V~3.6V | QUAD | 无铅 | 260 | 3V | 0.5mm | 300MHz~348MHz 389MHz~464MHz 779MHz~928MHz | 未说明 | 430F5978 | 64 | 不合格 | 3.3V | I2C, IrDA, SPI, UART | 32kB Flash 1.74kB EEPROM 4kB RAM | 12 | 32 | 16b | 2 | MSP430 | 8 | 13dBm | General ISM < 1GHz | 1 | 500kBaud | I2C, IrDA, JTAG, SPI, UART | 15mA~18.5mA | 15mA~36mA | 2FSK, 2GFSK, ASK, MSK, OOK | -117 dBm | 27 | 1mm | 9mm | 9mm | 880μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | CYBL10161-56LQXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 36 | 有 | 16kB | 表面贴装 | 表面贴装 | 56-UFQFN Exposed Pad | FLASH | -40°C~105°C | Tray | 2011 | Obsolete | 3 (168 Hours) | 56 | TxRx + MCU | 1.8V~5.5V | QUAD | 无铅 | 1.8V | 2.4GHz | S-XQCC-N56 | I2C, SPI, UART | 128kB Flash 8kB ROM 16kB SRAM | 32b | 4 | Bluetooth v4.1 | ARM | YES | 36 | 3dBm | Bluetooth | 16000 | 1Mbps | I2C, SPI, UART | 16.4mA~21.5mA | 12.5mA~20mA | GFSK | -91 dBm | I2C | 0.6mm | 7mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SI1080-A-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 11 | 768 | 有 | 768B | 表面贴装 | 36-WFQFN Exposed Pad | YES | 36 | 92.589543mg | FLASH | -40°C~85°C | Tray | 2000 | 活跃 | 2 (1 Year) | 36 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 2.4V | 0.5mm | 142MHz~1.05GHz | 3.6V | I2C, SPI, UART | 25 MHz | 16kB Flash 768B RAM | 8 | YES | NO | 8b | NO | 4 | 8051 | 8 | 20dBm | General ISM < 1GHz | 1Mbps | 1 | I2C, SPI, UART | 10.7mA~13.7mA | 70mA~85mA | 4FSK, 4GFSK, FSK, GFSK, OOK | -126 dBm | 15 | 0.8mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SI1061-A-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 11 | 32768 | 有 | 4kB | 36-WFQFN Exposed Pad | YES | 36 | 92.589543mg | FLASH | -40°C~85°C | Tray | 2000 | 活跃 | 2 (1 Year) | 36 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 2.4V | 0.5mm | 142MHz~1.05GHz | 3.6V | I2C, SPI, UART | 25 MHz | 32kB Flash 4kB RAM | 8 | YES | NO | 8b | NO | 4 | 8051 | 8 | 20dBm | General ISM < 1GHz | 1Mbps | 1 | I2C, SPI, UART | 10.7mA~13.7mA | 70mA~85mA | 4FSK, 4GFSK, FSK, GFSK, OOK | -126 dBm | 15 | 0.8mm | 6mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CC430F6135IRGCT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 2kB | 表面贴装 | 64-VFQFN Exposed Pad | YES | 64 | 有 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 64 | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 2V~3.6V | QUAD | 260 | 1 | 2.2V | 0.5mm | 300MHz~348MHz 389MHz~464MHz 779MHz~928MHz | CC430F6135 | 64 | I2C, SPI, UART | 16kB Flash 2kB SRAM | 12 | 16b | 128 kb | RISC | 8 | 13dBm | General ISM < 1GHz | 1 | 500kBaud | I2C, IrDA, JTAG, SPI, UART | 15mA~18.5mA | 15mA~36mA | 2FSK, 2GFSK, ASK, MSK, OOK | -117 dBm | 44 | 9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF233-ZF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 32 | Industrial grade | -40°C~125°C | Tray | 2014 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 未说明 | 1 | 3V | 0.5mm | 2.4GHz | 未说明 | AT86RF233 | 3V | 16 | 128B SRAM | 6LoWPAN, Zigbee® | 4dBm | 802.15.4, General ISM > 1GHz | 2Mbps | SPI | 11.3mA~11.8mA | 7.2mA~13.8mA | O-QPSK | -101 dBm | 1mm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LTC5800HWR-WHMA#PBF | Linear Technology/Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 72-VFQFN Exposed Pad | YES | 72 | -55°C~105°C | Tray | Dust Networks®, SmartMesh®, WirelessHART | e4 | 活跃 | 3 (168 Hours) | 72 | 5A002 | TxRx + MCU | Silver (Ag) | 8542.31.00.01 | 2.1V~3.76V | QUAD | 无铅 | 未说明 | 1 | 3.6V | 0.5mm | 2.4GHz | 未说明 | LTC5800 | 72 | I2C, SPI, UART | 512kB Flash 72kB SRAM | WirelessHART | 8dBm | 802.15.4 | 250kbps | I2C, JTAG, SPI, UART | 4.7mA | 5.6mA~9.9mA | -95 dBm | 27 | 1mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CC2620F128RGZR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 5 days ago) | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48 | 31 | -40°C~85°C | Tape & Reel (TR) | SimpleLink™ | e4 | yes | 活跃 | 3 (168 Hours) | 48 | 5A992C | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~3.8V | QUAD | 无铅 | 260 | 3V | 0.5mm | 2.4GHz | 未说明 | CC2620 | I2C, SPI, UART | 128kB Flash 28kB SRAM | 32 | YES | YES | YES | NO | 1 Mb | Zigbee® | 5dBm | 802.15.4 | 250kbps | I2C, I2S, SPI, UART | 5.9mA | 9.1mA | -100 dBm | 31 | 1mm | 7mm | 7mm | 900μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CC1100RTKG3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NRND (Last Updated: 5 days ago) | Tin | 表面贴装 | 表面贴装 | 20-VFQFN Exposed Pad | 20 | -40°C~85°C | Tube | e3 | yes | 不用于新设计 | 3 (168 Hours) | 20 | 仅TxRx | 8542.39.00.01 | 1.8V~3.6V | QUAD | 无铅 | 260 | 1 | 3V | 0.5mm | 4mm | 300MHz~348MHz 400MHz~464MHz 800MHz~928MHz | 未说明 | CC1100 | 20 | 不合格 | 3.3V | 1.8/3.6V | 10dBm | General ISM < 1GHz | 500kBaud | SPI | 13.9mA~15.9mA | 12.3mA~31.1mA | 2FSK, ASK, GFSK, MSK, OOK | -111 dBm | 900μm | 4mm | 4mm | 850μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AX5043-1-TA05 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | LAST SHIPMENTS (Last Updated: 1 week ago) | 表面贴装 | 表面贴装 | 28-VFQFN Exposed Pad | 28 | -40°C~85°C | Tape & Reel (TR) | 2004 | Discontinued | 1 (Unlimited) | 仅TxRx | 1.8V~3.6V | 27MHz~1.05GHz | SPI, UART | 16dBm Max | General ISM < 1GHz | 125kbps | SPI, UART | 6.5mA~11mA | 7.5mA~48mA | 4FSK, ASK, AFSK, FSK, GFSK, GMSK, MSK, PSK | -137 dBm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NRF24L01P-R7 | Nordic Semiconductor ASA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 20-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 2007 | 活跃 | 2 (1 Year) | 20 | 仅TxRx | 8542.39.00.01 | 1.9V~3.6V | QUAD | 无铅 | 1 | 3V | 0.5mm | 4mm | 2.4GHz | S-XQCC-N20 | 不合格 | 3V | 126 | 0dBm | General ISM > 1GHZ | 2Mbps | SPI | 12.6mA~13.5mA | 7mA~11.3mA | GFSK | -94 dBm | 0.95mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKW31Z256VHT4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | -40°C | 表面贴装 | 48-VFQFN | YES | 105°C | Tray | 2015 | 活跃 | 3 (168 Hours) | 48 | 5A992 | TxRx + MCU | 8542.31.00.01 | 1.71V~3.6V | QUAD | 无铅 | 未说明 | 3.3V | 2.4GHz | 未说明 | S-XQCC-N48 | INDUSTRIAL | 256kB Flash 64kB RAM | Bluetooth v4.2 | 4dBm | Bluetooth | -102dBm | I2C, SPI, UART | 6.2mA | 6mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT86RF232-ZXR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | Commercial grade | 0°C~70°C | Tape & Reel (TR) | 2009 | yes | 活跃 | 3 (168 Hours) | 仅TxRx | 1.8V~3.6V | 2.4GHz | 128B SRAM | 13.8mA | 0 | 6LoWPAN, Zigbee® | 3dBm | 802.15.4, General ISM > 1GHz | 250kbps | SPI | 11.3mA~11.8mA | 7.2mA~13.8mA | 1 | O-QPSK | -100 dBm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NRF24L01 | Nordic Semiconductor ASA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 20-VFQFN Exposed Pad | YES | 20 | -40°C~85°C | Tray | 2005 | 活跃 | 3 (168 Hours) | 20 | 仅TxRx | 8542.39.00.01 | 1.9V~3.6V | QUAD | 1 | 3V | 0.5mm | 4mm | 2.4GHz | 3V | 0dBm | General ISM > 1GHZ | 2Mbps | SPI | 11.1mA~12.3mA | 7mA~11.3mA | GFSK | -85 dBm | 0.95mm | 4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CC2500RTK | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 表面贴装 | 表面贴装 | 20-VFQFN Exposed Pad | 20 | -40°C~85°C | Tube | e4 | no | Obsolete | 3 (168 Hours) | 20 | 仅TxRx | 8542.39.00.01 | 1.8V~3.6V | QUAD | 260 | 1 | 3V | 0.5mm | 4mm | 2.4GHz | CC2500 | 20 | 1.8/3.6V | 0 b | 1dBm | General ISM > 1GHZ | 500kBaud | SPI | 13.3mA~19.6mA | 11.1mA~21.5mA | 2FSK, GFSK, MSK, OOK | -104 dBm | 0.9mm | 4mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYW20704UA2KFFB1G | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 49-VFBGA, FCBGA | YES | -30°C~85°C | Tray | 活跃 | 3 (168 Hours) | 49 | TxRx + MCU | 3.3V | BOTTOM | BALL | 1 | 3.3V | 0.5mm | 2.4GHz | R-PBGA-B49 | Bluetooth v4.1 +EDR | 9dBm | Bluetooth | -96dBm | 3Mbps | I2C, I2S, SPI, UART, USB | 38mA | 4DQPSK, 8DPSK, GFSK | 8 | 1mm | 4.5mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATWILC1000B-MU-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 40-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 2016 | e3 | yes | 活跃 | 2 (1 Year) | 40 | TxRx + MCU | Matte Tin (Sn) | 1.62V~3.6V | QUAD | 无铅 | 3.3V | 0.4mm | 2.4GHz | ATWILC1000 | S-PQCC-N40 | I2C, SDIO, SPI, UART | 128kB ROM 224kB RAM | 802.11b/g/n | 20.5dBm | WiFi | 72.2Mbps | I2C, SDIO, SPI, UART | 52.5mA~58.5mA | 244mA~294mA | CCK, DSSS, OFDM | -98 dBm | 9 | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TRF6901PTR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-LQFP | YES | 48 | 181.692094mg | -40°C~85°C | Tape & Reel (TR) | e4 | Obsolete | 1 (Unlimited) | 48 | 仅TxRx | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | 1.8V~3.6V | QUAD | 鸥翼 | 260 | 1 | 2.7V | 0.5mm | 7mm | 860MHz~930MHz | TRF6901 | 48 | 3.3V | 0.04mA | 8dBm | General ISM < 1GHz | 64kbps | SPI | 18mA | 26mA~32mA | ASK, FSK, OOK | 1.6mm | 7mm | 7mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR21E16A-MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 16 | 有 | 8kB | Tin | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | FLASH | -40°C~125°C | Tray | 2016 | SMART™ SAM R21 | e3 | yes | 活跃 | 3 (168 Hours) | 32 | TxRx + MCU | 1.8V~3.6V | QUAD | 无铅 | 0.5mm | 2.4GHz | ATSAMR21E | I2C, SPI, UART, USART, USB | 48 MHz | 64kB Flash 8kB SRAM | 32 | YES | YES | 32b | YES | NO | 3 | ARM | 8 | CORTEX-M0 | YES | 16 | 固定点 | 4dBm | YES | General ISM > 1GHZ | 8000 | 250kbps | I2C, SPI, UART, USART, USB | 11.3mA~11.8mA | 7.2mA~13.8mA | 4 | O-QPSK | 14 | -99 dBm | 8 | 12 | 1mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | CC1110F32RSPR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4kB | 表面贴装 | 表面贴装 | 36-VFQFN Exposed Pad | 36 | 92.589543mg | 21 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | Obsolete | 3 (168 Hours) | 36 | TxRx + MCU | Nickel/Palladium/Gold (Ni/Pd/Au) | 2V~3.6V | QUAD | 260 | 1 | 3V | 0.5mm | 300MHz~348MHz 391MHz~464MHz 782MHz~928MHz | CC1110 | 36 | 3V | SPI, USART | 32kB Flash 4kB SRAM | 16b | 3 | 8051 | 10dBm | General ISM < 1GHz | 500kBaud | I2S, USART | 16.2mA~21.5mA | 18mA~36.2mA | 2FSK, ASK, GFSK, MSK, OOK | -112 dBm | 0.9mm | 6mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BLUENRG-234 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 34-XFBGA, WLCSP | -40°C~105°C | Tape & Reel (TR) | BlueNRG | 活跃 | 1 (Unlimited) | TxRx + MCU | 1.7V~3.6V | 未说明 | 2.4GHz | 未说明 | 256kB Flash 24kB RAM | Bluetooth v5.0 | 8dBm | Bluetooth | -88dBm | 1Mbps | I2C, SPI, UART | 7.7mA~14.5mA | 6.6mA~28.8mA | GFSK | 14 | Non-RoHS Compliant |