类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 类型 | 子类别 | 技术 | 电压 - 供电 | 频率 | 引脚数量 | 工作频率 | 工作电源电压 | 内存大小 | 程序内存大小 | 输出功率 | 数据总线宽度 | 产品类别 | 议定书 | 频率范围 | 功率 - 输出 | 无线电频率系列/标准 | 敏感度 | 数据率(最大) | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 接收器数 | 调制 | 发射器数量 | [医]GPIO | 符合标准 | 调制技术 | 产品类别 | 职系 | 高度 | 长度 | 宽度 | |||||||||||||||||||||||||
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![]() | CYRF69213A-40LFXC | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Obsolete | 40-VFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Tray | 0°C ~ 70°C | PRoC® | TxRx + MCU | 4V ~ 5.5V | 2.4GHz | 8kB Flash, 256B SRAM | - | 4dBm | General ISM > 1GHz | -97dBm | 1Mbps | SPI, USB | 20.2mA ~ 23.4mA | 22.4mA ~ 36.6mA | DSSS, GFSK | 14 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYRF69103-40LFXC | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tray | 40-VFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Obsolete | 0°C ~ 70°C | PRoC® | TxRx + MCU | 1.8V ~ 3.6V | 2.4GHz | 8kB Flash, 256B SRAM | - | 4dBm | General ISM > 1GHz | -97dBm | 1Mbps | SPI | 18.9mA ~ 21.9mA | 21.2mA ~ 39.9mA | DSSS, GFSK | 15 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | STM32WBA52CEU6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | STM32 | 活跃 | 48-UFQFN Exposed Pad | 48-UFQFPN (7x7) | STMicroelectronics | Tray | -40°C ~ 85°C (TA) | STM32WBA | TxRx + MCU | 1.71V ~ 3.6V | 2.4GHz | 512kB Flash, 96kB RAM | Bluetooth v5.3 | - | Bluetooth | - | - | ADC, I²C, SPI, UART, USART | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBL11171-56LQXIT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Obsolete | 56-UFQFN Exposed Pad | 56-QFN (7x7) | Infineon Technologies | Tape & Reel (TR) | -40°C ~ 105°C | PRoC® | TxRx + MCU | 1.9V ~ 5.5V | 2.4GHz | 256kB Flash, 32kB SRAM | Bluetooth v4.2 | 3dBm | Bluetooth | -92dBm | - | I²C, I²S, SPI, UART | - | - | - | 36 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYWUSB6935-28SEI | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Discontinued at Digi-Key | 28-SOIC (0.295, 7.50mm Width) Exposed Pad | 28-SOIC | Infineon Technologies | Bag | -40°C ~ 85°C | WirelessUSB™ | 仅TxRx | 2.7V ~ 3.6V | 2.4GHz | - | - | 0dBm | General ISM > 1GHz | -95dBm | 62.5kbps | SPI | 57.7mA | 69.1mA | DSSS, GFSK | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYRF69313-40LTXC | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tray | 40-VFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Obsolete | 0°C ~ 70°C | PRoC® | TxRx + MCU | 4V ~ 5.25V | 2.4GHz | 8kB Flash, 256B SRAM | - | 0dBm | General ISM > 1GHz | -90dBm | 1.5Mbps | SPI, USB | 20.2mA ~ 23.4mA | 22.4mA ~ 27.7mA | DSSS, GFSK | 14 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20713A1KUFBXG | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tray | 50-UFBGA | 50-FPBGA (4.5x4) | Infineon Technologies | Obsolete | -40°C ~ 85°C | - | TxRx + MCU | 2.3V ~ 5.5V | 2.4GHz | - | Bluetooth v4.0 +EDR | 10dBm | Bluetooth | -91dBm | 3Mbps | I²C, I²S, JTAG, SPI, UART, USB | 32mA | 59mA | 4DQPSK, 8DPSK, GFSK | 8 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MAX7031MATJ50+ | Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | MAX703 | Tube | 32-WFQFN Exposed Pad | 32-TQFN (5x5) | Analog Devices Inc./Maxim Integrated | Obsolete | -40°C ~ 125°C | - | 仅TxRx | 2.1V ~ 3.6V, 4.5V ~ 5.5V | 315MHz | - | - | 13.1dBm | General ISM < 1GHz | -110dBm | 66kbps | - | 6.4mA ~ 6.8mA | 11.6mA | FSK | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA5201XT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Receiver | TSSOP | 表面贴装 | -40 to 125 °C | Receiver | 28 | 2.5, 3.3 V | ASK | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PS13-5712C | Winchen | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX1012BZ24032-E/S8B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PIC32CX1012 | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | 微芯片技术 | AEC-Q100 | -40°C ~ 125°C | Tray | PIC32CX-BZ2 | 活跃 | TxRx + MCU | 1.9V ~ 3.6V | 2.4GHz | 1MB Flash, 128kB SRAM | Bluetooth v5.2, Zigbee® | 5dBm | 802.15.4, Bluetooth | -103dBm | 2Mbps | ADC, GPIO, I2C, PWM, SPI, USART | 20.6mA | 24.9mA | GFSK, O-QPSK | 16 | 汽车 | |||||||||||||||||||||||||||||||||||||||||||
![]() | NRF54L15-CAAA-R | Nordic Semiconductor ASA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Nordic Semiconductor ASA | NRF54L15 | Tape & Reel (TR) | * | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX1012BZ24032-I/S8B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PIC32CX1012 | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | 微芯片技术 | AEC-Q100 | -40°C ~ 85°C | Tray | PIC32CX-BZ2 | 活跃 | TxRx + MCU | 1.9V ~ 3.6V | 2.4GHz | 1MB Flash, 128kB SRAM | Bluetooth v5.2, Zigbee® | 5dBm | 802.15.4, Bluetooth | -103dBm | 2Mbps | ADC, GPIO, I2C, PWM, SPI, USART | 20.6mA | 24.9mA | GFSK, O-QPSK | 16 | 汽车 | |||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX5109BZ31032-V/RTB | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Surface Mount, Wettable Flank | PIC32CX5109 | 32-VFQFN Exposed Pad | 32-VQFN (5x5) | 微芯片技术 | AEC-Q100 | -40°C ~ 105°C | Tray | PIC32CX-BZ2 | 活跃 | TxRx + MCU | 1.9V ~ 3.6V | 2.4GHz | 512kB Flash, 96kB SRAM | Bluetooth v5.2, Zigbee® | 11dBm | 802.15.4, Bluetooth | -108dBm | 2Mbps | ADC, GPIO, I2C, PWM, SPI, USART | 16mA ~ 20mA | 22mA ~ 49mA | GFSK, O-QPSK | 14 | 汽车 | |||||||||||||||||||||||||||||||||||||||||||
![]() | EM9301V02LF24B+ | EM Microelectronic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 24-WFQFN Exposed Pad | 24-QFN (5x5) | EM Microelectronic | -40°C ~ 85°C | Tape & Reel (TR) | Obsolete | 仅TxRx | 1.9V ~ 3.6V, 2.3V ~ 3.6V | 2.4GHz | Bluetooth v4.1 | 4dBm | Bluetooth | -80dBm | 5Mbps | GPIO, HCI, SPI, UART | 12.9mA ~ 13mA | 12mA ~ 12.1mA | GFSK | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IWR6843ABGABL | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 活跃 | IWR6843 | 161-TFBGA, FCCSP | 161-FC/CSP (10.4x10.4) | 德州仪器 | Tray | -40°C ~ 105°C (TJ) | - | TxRx + MCU | 1.71V ~ 1.89V, 3.135V ~ 3.465V | 60GHz ~ 64GHz | - | - | 12dBm | - | - | 900Mbps | ADC, GPIO, I2C, SPI | - | - | - | 48 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | AWR6843ABGABLQ1 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tray | 活跃 | 1.75 MB | Details | 德州仪器 | 德州仪器 | CAN-FD, I2C, GPIOs, SPI, UARTs | SMD/SMT | 1.14 V | 176 | - 40 C | 1.32 V | + 125 C | 900 Mbps | 47 I/O | 64 GHz | 有 | RF System on a Chip - SoC | 161-TFBGA, FCCSP | 161-FC/CSP (10.4x10.4) | 德州仪器 | AWR6843 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, mmWave | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.71V ~ 1.89V, 3.15V ~ 3.45V | 60GHz ~ 64GHz | 60 GHz to 64 GHz | - | 1.75 MB | 12 dBm | - | 12dBm | - | - | 900Mbps | 6 Channel | ADC, GPIO, I2C, SPI, UART | - | - | - | 48 | RF System on a Chip - SoC | 135.9 mm | ||||||||||||||||||||
![]() | IWR6843ABGABLR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 活跃 | IWR6843 | 64 GHz | 47 I/O | 900 Mbps | + 105 C | - 40 C | 1000 | SMD/SMT | CAN-FD, GPIOs, I2C, SPI, UARTs | 德州仪器 | 德州仪器 | Details | 512 kB | RF System on a Chip - SoC | 161-TFBGA, FCCSP | 161-FC/CSP (10.4x10.4) | 德州仪器 | Tape & Reel (TR) | -40°C ~ 105°C (TJ) | Reel | - | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.71V ~ 1.89V, 3.135V ~ 3.465V | 60GHz ~ 64GHz | 60 Hz to 64 GHz | - | 12 dBm | - | 12dBm | - | - | 900Mbps | 6 Channel | ADC, GPIO, I2C, SPI | - | - | - | 48 | IEC 61508 | RF System on a Chip - SoC | ||||||||||||||||||||||||
![]() | AWR6843ABGABLRQ1 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 活跃 | AWR6843 | 64 GHz | 47 I/O | + 125 C | - 40 C | 1000 | SMD/SMT | CAN-FD, I2C, GPIOs, SPI, UARTs | 德州仪器 | 德州仪器 | Details | 1.75 MB | RF System on a Chip - SoC | 161-TFBGA, FCCSP | 161-FC/CSP (10.4x10.4) | 德州仪器 | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | Reel | Automotive, AEC-Q100, mmWave | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.71V ~ 1.89V, 3.15V ~ 3.45V | 60GHz ~ 64GHz | - | - | 12dBm | - | - | 900Mbps | 6 Channel | ADC, GPIO, I2C, SPI, UART | - | - | - | 48 | RF System on a Chip - SoC | 135.9 mm | |||||||||||||||||||||||||||
![]() | AFE8092IABJ | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tube | Details | 德州仪器 | 德州仪器 | GPIO, Serial | SMD/SMT | 90 | - 40 C | + 85 C | 32.5 Gbps | 有 | 射频收发器 | 400-BFBGA, FCBGA | 400-FCBGA (17x17) | 德州仪器 | 活跃 | -40°C ~ 85°C | Tray | - | 仅TxRx | Wireless & RF Integrated Circuits | Si | - | 6GHz | - | - | 6 GHz | - | - | - | 32.5Gbps | ADC | - | - | 8 Receiver | - | 8 Transmitter | 射频收发器 | |||||||||||||||||||||||||||||
![]() | AFE7950IABJ | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 活跃 | 有 | + 85 C | - 40 C | 90 | SMD/SMT | 德州仪器 | 德州仪器 | Details | 射频收发器 | 400-BFBGA, FCBGA | 400-FCBGA (17x17) | 德州仪器 | Tray | -40°C ~ 85°C | Tray | - | 仅TxRx | Wireless & RF Integrated Circuits | - | 600MHz ~ 12GHz | - | - | 600 MHz to 12 GHz | - | - | - | 29.5Gbps | - | - | - | - | 射频收发器 | ||||||||||||||||||||||||||||||||||
![]() | CC2652R74T0RGZR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Surface Mount, Wettable Flank | 有 | 48 MHz | + 105 C | 3.8 V | - 40 C | 2500 | 1.8 V | SMD/SMT | 德州仪器 | 德州仪器 | Details | 144 kB | RF Microcontrollers - MCU | 48-VFQFN Exposed Pad | 48-VQFN (7x7) | 德州仪器 | 活跃 | -40°C ~ 105°C (TA) | 切割胶带 | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.8V ~ 3.8V | 2.4GHz ~ 2.48GHz | 2.4 GHz | 1.8 V to 3.8 V | 704kB Flash, 144kB RAM | 704 kB | 32 bit | 5dBm | 802.15.4, Bluetooth | -104dBm | 2Mbps | ADC, GPIO, I2C, I2S, JTAG, SPI, UART | 7.1mA | 7.6mA ~ 9.9mA | DSSS, O-QPSK | 31 | RF Microcontrollers - MCU | ||||||||||||||||||||||||||||
![]() | IWR6843ARQGALPR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Tape & Reel (TR) | 1.75 MB | Details | SRAM | 德州仪器 | 德州仪器 | CAN, GPIO, I2C, I2S, SDIO, SPI, UART | SMD/SMT | 1.14 V | 1000 | - 40 C | 1.32 V | + 105 C | 900 Mbps | 47 I/O | 64 GHz | IWR6843AOPEVM | 有 | RF System on a Chip - SoC | 180-VFBGA, FCBGA Exposed Pad | 180-FCBGA (15x15) | 德州仪器 | 活跃 | -40°C ~ 105°C | 切割胶带 | - | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.71V ~ 1.89V, 3.13V ~ 3.45V | 60GHz ~ 64GHz | 60 GHz to 64 GHz | 1.75MB RAM | 1.75 MB | 12 dBm | - | 15dBm | - | - | 900Mbps | 6 Channel | ADC, GPIO, I2C, SPI | - | - | - | 48 | RF System on a Chip - SoC | 0.95 mm | 14.9 mm | 14.9 mm | |||||||||||||||||
![]() | AFE8030IABJ | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 活跃 | 400-BFBGA, FCBGA | 400-FCBGA (17x17) | 德州仪器 | Tray | -40°C ~ 85°C | - | 仅TxRx | - | 6GHz | - | - | - | - | - | 32.5Gbps | SPI | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | CC1311P31T0RGZR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 有 | 48 MHz | 26 I/O | + 105 C | 3.8 V | - 40 C | 2500 | 2.1 V | SMD/SMT | I2C, SPI, UART | 德州仪器 | 德州仪器 | SRAM | SimpleLink | Details | 32 kB | RF Microcontrollers - MCU | 48-VFQFN Exposed Pad | 48-VQFN (7x7) | 德州仪器 | 活跃 | -40°C ~ 105°C (TA) | Reel | - | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.8V ~ 3.8V | 143MHz ~ 176MHz, 287MHz ~ 351MHz, 359MHz ~ 439MHz, 431MHz ~ 527MHz, 861MHz ~ 1.054GHz, 1.076GHz ~ 1.315GHz | 352kB RAM, 40kB RAM | 352 Kb | 32 bit | Wireless M-Bus | 20dBm | WiFi | -117dBm | 1Mbps | ADC, GPIO, I2C, I2S, SPI, UART | 5.4mA | 7.4mA ~ 65mA | 2FSK, 4FSK, 2GFSK, 4GFSK, DSSS, GFSK, MSK, OOK | 26 | RF Microcontrollers - MCU |