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类别是'逻辑 - 移位寄存器'

图片

产品型号

品牌

数据表

有效性

单价(CNY)

询价

认证

表面安装

材料

终端数量

Date Of Intro

Diameter after shrinking

Diameter before shrinking

External height

External width

Indicator type

Installation diameter

Internal height

Internal width

LED working life

厂商

Relative humidity

Shrink after diameter

Shrink after thickness

Shrink to diameter

Shrinking temperature

Thickness after shrinking

Type of cable accessories

包装

系列

JESD-609代码

无铅代码

零件状态

ECCN 代码

类型

端子表面处理

颜色

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度（摄氏度）

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

电源电压-最大值(Vsup)

电源

温度等级

电源电压-最小值(Vsup)

比特数

家人

输出特性

座位高度-最大

输出极性

逻辑IC类型

每个元素的比特数

筛选水平

触发器类型

传播延迟(tpd)

fmax-Min

计数方向

最大频率@Nom-Sup

饱和电流

触点

长度

宽度
74HC595PW-Q100 74HC595PW-Q100

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

NXP SEMICONDUCTORS

TSSOP

4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

16

有

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

未说明

1

0.65 mm

unknown

未说明

16

R-PDSO-G16

6 V

AUTOMOTIVE

2 V

8

HC/UH

3-STATE

1.1 mm

TRUE

串行输入并行输出

AEC-Q100

积极优势

240 ns

24 MHz

RIGHT

1

5 mm

4.4 mm

74HC165BQ 74HC165BQ

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

non-openable frames,

有

Transferred

NXP SEMICONDUCTORS

QFN

2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16

125 °C

-40 °C

PLASTIC/EPOXY

HVQCCN

LCC16,.1X.14,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

16

30mm

54mm

23mm

30mm

cable chain

50mm

e4

有

Nickel/Palladium/Gold (Ni/Pd/Au)

时钟抑制

8542.39.00.01

QUAD

无铅

260

1

0.5 mm

compliant

30

16

R-PQCC-N16

不合格

6 V

AUTOMOTIVE

2 V

8

HC/UH

1 mm

COMPLEMENTARY

并行输入 串行输出

积极优势

250 ns

20 MHz

RIGHT

24000000 Hz

1

3.5 mm

2.5 mm

74AHC595PW 74AHC595PW

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

NXP SEMICONDUCTORS

TSSOP

4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

16

有

e4

有

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

unknown

30

16

R-PDSO-G16

不合格

5.5 V

AUTOMOTIVE

2 V

8

AHC/VHC/H/U/V

3-STATE

1.1 mm

TRUE

串行输入并行输出

积极优势

20.1 ns

90 MHz

RIGHT

40000000 Hz

1

5 mm

4.4 mm

74HCT164BQ 74HCT164BQ

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

NXP SEMICONDUCTORS

QFN

2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14

125 °C

-40 °C

PLASTIC/EPOXY

HVQCCN

LCC14,.1X.12,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

14

有

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

QUAD

无铅

260

1

0.5 mm

compliant

30

14

R-PQCC-N14

不合格

5.5 V

AUTOMOTIVE

4.5 V

8

HCT

1 mm

TRUE

串行输入并行输出

积极优势

54 ns

18 MHz

RIGHT

18000000 Hz

1

3 mm

2.5 mm

74HCT164BQ 74HCT164BQ

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

QCCN, LCC14,.1X.12,20

125 °C

-40 °C

PLASTIC/EPOXY

QCCN

LCC14,.1X.12,20

RECTANGULAR

CHIP CARRIER

5 V

14

无

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

无铅

1

0.5 mm

unknown

R-PQCC-N14

不合格

AUTOMOTIVE

8

18000000 Hz

74VHCT595D 74VHCT595D

Nexperia 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

NEXPERIA

SOP-16

125 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

Polyolefin

16

2017-02-01

Cree LED

50.0 mm

1.5 mm

100.0 mm

+80...+120 °C

有

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®

e4

活跃

Non-flame-retardant heat-shrink tubing

镍钯金

black

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

compliant

30

R-PDSO-G16

5.5 V

AUTOMOTIVE

4.5 V

8

AHCT/VHCT/VT

3-STATE

1.75 mm

TRUE

串行输入并行输出

积极优势

12 ns

90 MHz

RIGHT

1

9.9 mm

3.9 mm

74AHC595D 74AHC595D

Nexperia 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

NEXPERIA

3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16

125 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

Polyolefin

16

1.25 mm

2.5 mm

Nordic Semiconductor ASA

0.38 mm

有

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®

e4

活跃

Non-flame-retardant heat shrink tube

镍钯金

Black

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

compliant

30

R-PDSO-G16

不合格

5.5 V

AUTOMOTIVE

2 V

8

AHC/VHC/H/U/V

3-STATE

1.75 mm

TRUE

串行输入并行输出

积极优势

20.1 ns

90 MHz

RIGHT

1

1 m

3.9 mm

74HC594DB 74HC594DB

Nexperia 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Obsolete

NEXPERIA

SSOP,

125 °C

-40 °C

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

5 V

16

1991-12-01

有

e4

镍钯金

PARALLEL OUTPUT IS REGISTERED; UNREGISTERED SERIAL SHIFT RIGHT OUTPUT

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

compliant

30

R-PDSO-G16

不合格

6 V

AUTOMOTIVE

2 V

8

HC/UH

2 mm

TRUE

串行输入并行输出

积极优势

225 ns

24 MHz

RIGHT

1

6.2 mm

5.3 mm

HEF4094BP HEF4094BP

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

NXP SEMICONDUCTORS

DIP

0.300 INCH, PLASTIC, SOT38-4, DIP-16

50 pF

125 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

IP65

16

ring

16 mm

≥40000 hours

45...85 %

有

e4

有

EAR99

镍钯金

PARALLEL OUTPUT IS LATCHED; UNLATCHED SERIAL SHIFT RIGHT OUTPUT

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

compliant

16

R-PDIP-T16

不合格

15 V

AUTOMOTIVE

3 V

8

4000/14000/40000

3-STATE

4.2 mm

TRUE

串行输入并行输出

积极优势

330 ns

14 MHz

RIGHT

5000000 Hz

3Pin+2Pin

19.025 mm

7.62 mm

AIP74HC164TA14.TR AIP74HC164TA14.TR

Wuxi I-core Elec 数据表

N/A

-

最小起订量: 1

倍率: 1

Tape & Reel (TR)

true

74HC

8

74HC595MT/TR 74HC595MT/TR

HGSEMI 数据表

N/A

-

最小起订量: 1

倍率: 1

Tape & Reel (TR)

true

HD74LS166AP HD74LS166AP

Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

RENESAS ELECTRONICS CORP

DIP

DIP, DIP16,.3

1

75 °C

-20 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

16

有

也可进行SISO操作

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

compliant

16

R-PDIP-T16

不合格

5.25 V

商业扩展

4.75 V

8

LS

5.06 mm

TRUE

并行输入 串行输出

积极优势

25 ns

25 MHz

RIGHT

25000000 Hz

19.2 mm

7.62 mm

74HC595PW 74HC595PW

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

NXP SEMICONDUCTORS

TSSOP

4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16

1

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

16

有

e4

有

Nickel/Palladium/Gold (Ni/Pd/Au)

用于级联的串行标准输出

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

unknown

30

16

R-PDSO-G16

不合格

6 V

AUTOMOTIVE

2 V

8

HC/UH

3-STATE

1.1 mm

TRUE

串行输入并行输出

积极优势

265 ns

24 MHz

RIGHT

20000000 Hz

5 mm

4.4 mm

74HC595PW 74HC595PW

Philips Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

飞利浦半导体

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

16

有

8542.39.00.01

DUAL

鸥翼

260

1

0.635 mm

unknown

R-PDSO-G16

不合格

AUTOMOTIVE

8

20000000 Hz

74HC595PW 74HC595PW

Nexperia 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

NEXPERIA

1

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

16

1990-09-01

有

e4

EAR99

镍钯金

用于级联的串行标准输出

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

compliant

30

R-PDSO-G16

不合格

6 V

AUTOMOTIVE

2 V

8

HC/UH

3-STATE

1.1 mm

TRUE

串行输入并行输出

积极优势

240 ns

24 MHz

RIGHT

5 mm

4.4 mm

54F164DMQB 54F164DMQB

National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

54F164DMQB 54F164DMQB

Fairchild Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

FAIRCHILD SEMICONDUCTOR CORP

DIP

DIP, DIP14,.3

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP14,.3

RECTANGULAR

IN-LINE

5 V

14

无

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

14

R-GDIP-T14

不合格

5.5 V

MILITARY

4.5 V

8

F/FAST

5.08 mm

TRUE

串行输入并行输出

38535Q/M;38534H;883B

积极优势

13 ns

90 MHz

RIGHT

19.43 mm

7.62 mm

74LV165APW 74LV165APW

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

NXP SEMICONDUCTORS

TSSOP

4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16

1

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3.3 V

16

有

e4

有

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

compliant

30

16

R-PDSO-G16

不合格

5.5 V

INDUSTRIAL

2 V

8

LV/LV-A/LVX/H

1.1 mm

COMPLEMENTARY

并行输入 串行输出

积极优势

26 ns

90 MHz

RIGHT

35000000 Hz

5 mm

4.4 mm

74AHC594PW 74AHC594PW

Nexperia 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

NEXPERIA

4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

16

有

e4

EAR99

镍钯金

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

compliant

30

R-PDSO-G16

不合格

5.5 V

AUTOMOTIVE

2 V

8

HC/UH

1.1 mm

TRUE

串行输入并行输出

积极优势

15.1 ns

90 MHz

RIGHT

1

5 mm

4.4 mm

HD74LS164P HD74LS164P

Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

RENESAS ELECTRONICS CORP

DIP

6.30 X 19.20 MM, 2.54 MM PITCH, PLASTIC, DIP-14

75 °C

-20 °C

PLASTIC/EPOXY

DIP

DIP14,.3

RECTANGULAR

IN-LINE

5 V

14

有

有

8542.39.00.01

DUAL

THROUGH-HOLE

未说明

1

2.54 mm

unknown

未说明

14

R-PDIP-T14

不合格

5.25 V

商业扩展

4.75 V

8

LS

5.06 mm

TRUE

串行输入并行输出

积极优势

32 ns

25 MHz

RIGHT

25000000 Hz

19.2 mm

7.62 mm

74AHC164D 74AHC164D

NXP Semiconductors 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

Transferred

NXP SEMICONDUCTORS

SOIC

3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14

125 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

小概要

5 V

14

有

e4

有

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

unknown

30

14

R-PDSO-G14

不合格

5.5 V

AUTOMOTIVE

2 V

8

AHC/VHC/H/U/V

1.75 mm

TRUE

串行输入并行输出

积极优势

20.5 ns

85 MHz

RIGHT

35000000 Hz

1

8.65 mm

3.9 mm

74AHC164D 74AHC164D

Nexperia 数据表

N/A

-

最小起订量: 1

倍率: 1

YES

活跃

NEXPERIA

3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14

125 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

14

有

e4

镍钯金

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

compliant

30

R-PDSO-G14

不合格

5.5 V

AUTOMOTIVE

2 V

8

AHC/VHC/H/U/V

1.75 mm

TRUE

串行输入并行输出

积极优势

20.5 ns

85 MHz

RIGHT

1

8.65 mm

3.9 mm

SN54LS164J SN54LS164J

AMD 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

ADVANCED MICRO DEVICES INC

DIP, DIP14,.3

125 °C

-55 °C

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

5 V

14

无

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-XDIP-T14

不合格

5.5 V

MILITARY

4.5 V

8

LS

TRUE

串行输入并行输出

MIL-STD-883 Class C

积极优势

32 ns

RIGHT

SN54LS164J SN54LS164J

onsemi 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

ON SEMICONDUCTOR

DIP

DIP,

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

5 V

14

Obsolete

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

14

R-CDIP-T14

不合格

5.5 V

COMMERCIAL

4.5 V

8

LS

5.08 mm

TRUE

串行输入并行输出

积极优势

32 ns

25 MHz

RIGHT

19.495 mm

7.62 mm

SN54LS164J SN54LS164J

Freescale Semiconductor 数据表

N/A

-

最小起订量: 1

倍率: 1

NO

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

DIP, DIP14,.3

125 °C

-55 °C

CERAMIC

DIP

DIP14,.3

RECTANGULAR

IN-LINE

5 V

14

无

e0

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-XDIP-T14

不合格

5 V

MILITARY

8

25000000 Hz