类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 端口的数量 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 数据总线宽度 | 总线兼容性 | 最大数据传输率 | 驱动接口标准 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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.png) | 89HMPEB383ZANQG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | QFN | 2016 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPEB383ZBEM8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TQFP | 128 | 503.487531mg | 33MHz | 1999 | e0 | no | Discontinued | 3 (168 Hours) | 128 | Tin/Lead (Sn/Pb) | 85°C | 0°C | 8542.31.00.01 | QUAD | 鸥翼 | 240 | 1.05V | 0.4mm | 20 | 128 | 5V | COMMERCIAL | PCI Express | BUS CONTROLLER, PCI | 32b | ISA; PCI; SBUS; VGA; USB | 2500 MBps | 1mm | 14mm | 14mm | 1mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||
| TSI721A1-16GILV | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | -40°C | YES | 143 | 85°C | e1 | yes | 活跃 | 4 (72 Hours) | 143 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 未说明 | 143 | 1.05V | INDUSTRIAL | 0.95V | BUS CONTROLLER, PCI | 156.25MHz | PCI; I2C | 625 MBps | IEEE 802.3AE | 2.15mm | 13mm | 13mm | 1.51mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||
| 89HPEB383ZBEM | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | TQFP | 128 | 33MHz | 1999 | e0 | no | Discontinued | 3 (168 Hours) | 128 | Tin/Lead (Sn/Pb) | 85°C | 0°C | 8542.31.00.01 | QUAD | 鸥翼 | 240 | 1.05V | 0.4mm | 20 | 128 | 5V | COMMERCIAL | PCI Express | BUS CONTROLLER, PCI | 32b | ISA; PCI; SBUS; VGA; USB | 2500 MBps | 1.2mm | 14mm | 14mm | 1mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||
| 89HPES48H12ZABLI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 1156 | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 2.82mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
| 89HPES4T4G2ZCAL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | FCBGA | 324 | 2009 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 30 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI | 3.27mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
| 89H32NT8AG2ZCHL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 225 | not_compliant | 20 | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||
| 89HPEB383ZBNQ8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 132 | 33MHz | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 132 | Tin/Lead (Sn/Pb) | 85°C | 0°C | QUAD | 无铅 | 240 | 1.05V | 0.5mm | not_compliant | 20 | 132 | 5V | COMMERCIAL | PCI Express | BUS CONTROLLER, PCI | 32b | ISA; PCI; SBUS; VGA; USB | 2500 MBps | 900μm | 10mm | 10mm | 900μm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
| 89HPEB383ZBNQ | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 132 | 33MHz | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 132 | Tin/Lead (Sn/Pb) | 85°C | 0°C | QUAD | 无铅 | 240 | 1.05V | 0.5mm | not_compliant | 20 | 132 | 5V | COMMERCIAL | PCI Express | BUS CONTROLLER, PCI | 32b | ISA; PCI; SBUS; VGA; USB | 2500 MBps | 900μm | 10mm | 10mm | 900μm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
| 89HPES16T4G2ZABX8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Lead, Tin | 表面贴装 | 288 | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 288 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | not_compliant | 未说明 | 288 | 不合格 | 1.1V | 1.22.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI; SMBUS | 16000 MBps | 1.7mm | 23mm | 23mm | 1.1mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
| 89HPES3T3ZBBC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 144 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 144 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI | 1.4mm | 13mm | 13mm | 1.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
| 89HPEB383ZBNQG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 132 | 33MHz | Tape & Reel (TR) | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 132 | Matte Tin (Sn) | 85°C | 0°C | QUAD | 无铅 | 260 | 1.05V | 0.5mm | 30 | 132 | 5V | COMMERCIAL | PCI Express | BUS CONTROLLER, PCI | 32b | ISA; PCI; SBUS; VGA; USB | 2500 MBps | 900μm | 10mm | 10mm | 900μm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
| 89HPES24NT3ZBBXG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | BGA | 420 | 70°C | Tape & Reel (TR) | 1999 | e1 | 3 (168 Hours) | 420 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 1mm | 不合格 | 13.3V | COMMERCIAL | PCI Express | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| 89H64H16AG2ZCBL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 1156 | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 不合格 | 1.1V | 12.5/3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 6275mA | I2C; ISA; VGA; SMBUS | 64000 MBps | 2.82mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||
| 89HPES4T4ZBNQG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 132 | 70°C | Tape & Reel (TR) | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 132 | EAR99 | 8542.39.00.01 | QUAD | 无铅 | 260 | 1V | 0.65mm | 未说明 | 132 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | PCI; SMBUS | 0.9mm | 10mm | 10mm | 900μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
| 89HPES24N3A1ZCBXG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | BGA | 420 | Tape & Reel (TR) | 1999 | e1 | 3 (168 Hours) | 420 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 3.3V | 1mm | 不合格 | 3.3V | COMMERCIAL | PCI Express | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| 89HPES24T61ZCBX8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Lead, Tin | 表面贴装 | BGA | 420 | Tape & Reel (TR) | 1999 | e0 | 3 (168 Hours) | 420 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 3.3V | 1mm | not_compliant | 不合格 | 3.3V | COMMERCIAL | PCI Express | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| 89HPES16T7ZHBX | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Lead, Tin | 表面贴装 | 320 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 320 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 320 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 25mm | 25mm | 1.59mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
| 89HPES24N3A2ZCBX | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | BGA | 420 | 1999 | PCI Express | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPEB383ZAEMG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | TQFP | 128 | 33MHz | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 128 | 85°C | 0°C | QUAD | 鸥翼 | 260 | 1.05V | 0.4mm | 30 | 128 | 5V | COMMERCIAL | PCI Express | BUS CONTROLLER, PCI | 32b | ISA; PCI; SBUS; VGA; USB | 2500 MBps | 1.2mm | 14mm | 14mm | 1mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
| 89HPES24T6G2ZBAL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI; SMBUS | 3.27mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||
| 89HPES24T6G2ZCAL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 30 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 3.42mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||
| 89H48H12G2ZCBLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | FCBGA | 676 | 125MHz | e1 | yes | 4 (72 Hours) | 676 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 676 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 384 Gbps | I2C; ISA; VGA; SMBUS | 48 MBps | 3.22mm | 27mm | 27mm | 3.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||
| 89HPES24N3A2ZCBX8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | 420 | Tape & Reel (TR) | 1999 | PCI Express | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| 89H32H8G3YAHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 2009 | PCI Express | 符合RoHS标准 |