类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 电路数量 | 端口的数量 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 数据总线宽度 | 通信IC类型 | 内存IC类型 | 消费者集成电路类型 | 总线兼容性 | 最大数据传输率 | 驱动接口标准 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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 | 89H32NT8AG2ZCHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
 | AMB0483D0RJ8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FCBGA | 655 | Tape & Reel | 2008 | e1 | no | Discontinued | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 655 | 存储器电路 | 24.5mm | 19.5mm | 2.55mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | 89HPES12N3AZCBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 324 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.5mm | 19mm | 19mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
 | TSI721A1-16GIL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | FCBGA | 143 | 156.25MHz | 2012 | e0 | no | 活跃 | 4 (72 Hours) | 143 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | BOTTOM | BALL | 225 | 1V | 143 | INDUSTRIAL | 0.95V | 1 | BUS CONTROLLER, PCI | 3000mA | 16 Gbps | PCI; I2C | 625 MBps | IEEE 802.3AE | 13mm | 13mm | 1.51mm | 无 | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||
 | 89HPES8NT2ZBBCG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 324 | 70°C | Tape & Reel (TR) | 1999 | e1 | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 1mm | 13.3V | COMMERCIAL | PCI Express | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
 | 89HPES24T3G2ZCAL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 1.1V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | SMBUS | 625 MBps | 3.42mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
 | 89HPES12N3AZGBCGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 324 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.4mm | 19mm | 19mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
.png) | 89H32H8G3YCHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 484 | 70°C | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.95V | BUS CONTROLLER, PCI | 100MHz | 6225mA | ISA; VGA | IEEE 1149.6AC; IEEE 1149.1 | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
 | 89HPES4T4G2ZCALG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 2009 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI; SMBUS | 3.27mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
 | 89H48H12G2ZCBL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 676 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 676 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 676 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 384 Gbps | I2C; ISA; VGA; SMBUS | 48 MBps | 3.22mm | 27mm | 27mm | 3.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
 | ISL54106CRZ | Intersil (Renesas Electronics America) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | QFN | YES | 70°C | 2015 | e3 | 3 (168 Hours) | 72 | Matte Tin (Sn) - annealed | QUAD | 无铅 | 0.5mm | S-PQCC-N72 | 不合格 | 3.3V | COMMERCIAL | I2C | 405mA | 消费电路 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||
 | 89H16NT16G2ZBHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 3300mA | 128 Gbps | I2C; ISA; VGA | 2.88mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
 | 89H48T12G2ZCBL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 676 | 70°C | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 676 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 676 | 不合格 | 1.1V | 12.5/3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | I2C; ISA; PCI; SMBUS; VGA | 48000 MBps | 3.4mm | 27mm | 27mm | 3.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
| 89H32NT8AG2ZCHLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 250 | 30 | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
| MC68150FN33 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | 68 | Rail/Tube | 2006 | e0 | 1 (Unlimited) | 68 | Tin/Lead (Sn85Pb15) | 85°C | -40°C | 8542.31.00.01 | QUAD | J BEND | 5V | 1.27mm | not_compliant | 68 | 不合格 | 5.5V | 5V | INDUSTRIAL | 4.5V | 微处理器电路 | 0.1mA | 4.57mm | 24.205mm | 24.205mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | TSI310A-133CE | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 304 | 133MHz | 1999 | e0 | no | Discontinued | 3 (168 Hours) | 304 | 3A001.A.3 | 锡铅 | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 225 | 2.5V | 1.27mm | 304 | 3.3V | 2.7V | COMMERCIAL | BUS CONTROLLER, PCI | 8 Gbps | 64b | 1.78mm | 31mm | 31mm | 1.7mm | 无 | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||||||
 | 89HT0808PYBABG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100 | 1999 | yes | 活跃 | 100 | I2C | 9mm | 9mm | 1.7mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MAX24288ETK+ | Microsemi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 68 | 2012 | 活跃 | 68 | 85°C | -40°C | SONET;SDH | QUAD | 1 | 1.2V | 0.4mm | 68 | INDUSTRIAL | Ethernet | 1 | ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER | 0.8mm | 8mm | 8mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | MAX24288ETK+T | Microsemi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 85°C | 2012 | 活跃 | 68 | SONET;SDH | 8542.39.00.01 | QUAD | 1 | 1.2V | 0.4mm | 68 | S-XQCC-N68 | INDUSTRIAL | Ethernet | ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER | 0.8mm | 8mm | 8mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
 | 89HPES8T5ZHBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | BGA | 324 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.5mm | 19mm | 19mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
 | 89HPES8T5AZBBC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 196 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 196 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | 20 | 196 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.5mm | 15mm | 15mm | 1.4mm | 符合RoHS标准 | 含铅 | |||||||||||||||||||||||||
 | 89HPES8T5AZBBCG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 196 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 196 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 196 | 1.1V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI; SMBUS | 3000 MBps | 1.5mm | 15mm | 15mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
| 89H48H12G2ZCBLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | FCBGA | 676 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 676 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 384 Gbps | I2C; ISA; SMBUS; VGA | 48000 MBps | 3.22mm | 27mm | 27mm | 3.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
 | 89H12NT12G2ZBHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | 260 | 30 | 324 | 3.3V | PCI Express | 12 | BUS CONTROLLER, PCI | 96 Gbps | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||
 | 89H12NT12G2ZBHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 3300mA | 96 Gbps | I2C; ISA; VGA | 2.88mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 |