类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 应用 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 端口的数量 | 电源电流 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 数据总线宽度 | 消费者集成电路类型 | 总线兼容性 | 最大数据传输率 | 发射器数量 | 驱动接口标准 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png) | 89HPES24N3YDBXG | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 420-LBGA | Tray | PRECISE™ | Obsolete | 4 (72 Hours) | 开关接口 | 3.3V | IDT89HPES24 | PCI Express | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES24T61ZCBXG | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 420-LBGA | Tray | PRECISE™ | Obsolete | 4 (72 Hours) | 开关接口 | 3.3V | IDT89HPES24 | PCI Express | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES24N3AZCBX | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 420-LBGA | Tray | PRECISE™ | Obsolete | 4 (72 Hours) | 开关接口 | 3.3V | IDT89HPES24 | PCI Express | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HPES8NT2ZBBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 324 | 70°C | 1999 | e1 | yes | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.5mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | TSI381-66ILV | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 144 | 66MHz | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | 144 | 3.3V | 1.26V | INDUSTRIAL | BUS CONTROLLER, PCI | 32b | PCI | IEEE 1149.6; IEEE 1149.1 | 1.8mm | 13mm | 13mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
 | CS82C59A | Intersil (Renesas Electronics America) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PLCC | 28 | Bulk | 2001 | 活跃 | 5.5V | 1mA | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TSI352-66CQY | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | PQFP | 160 | 66MHz | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 160 | Matte Tin (Sn) - annealed | 85°C | 0°C | QUAD | 鸥翼 | 260 | 3.3V | 0.65mm | 160 | 3.6V | OTHER | PCI | 32b | 4.1mm | 28mm | 28mm | 3.5mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
 | TSI721A1-16GCL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 156.25MHz | 2012 | e1 | no | 4 (72 Hours) | 143 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 245 | 1V | 未说明 | 143 | 不合格 | COMMERCIAL | 0.95V | 1 | BUS CONTROLLER, PCI | 3000mA | 16 Gbps | PCI; I2C | 625 MBps | IEEE 802.3AE | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | 89HPEB383ZBEMG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | TQFP | 128 | 33MHz | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 128 | Matte Tin (Sn) | 85°C | 0°C | QUAD | 鸥翼 | 260 | 1.05V | 0.4mm | 30 | 128 | 5V | COMMERCIAL | PCI Express | BUS CONTROLLER, PCI | 32b | ISA; PCI; SBUS; VGA; USB | 2500 MBps | 1.2mm | 14mm | 14mm | 1mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
 | TSI721A1-16GCLY | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 143 | 156.25MHz | 2012 | e1 | no | 活跃 | 4 (72 Hours) | 143 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | BOTTOM | BALL | 245 | 1V | 未说明 | 143 | 不合格 | COMMERCIAL | 0.95V | 1 | BUS CONTROLLER, PCI | 3000mA | 16 Gbps | PCI; I2C | 625 MBps | IEEE 802.3AE | 13mm | 13mm | 1.51mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||
 | 89HPES3T3ZBBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 144 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 144 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI | 1.5mm | 13mm | 13mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
 | 89HPES24T6G2ZCALG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 11 | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI, PCI Express, SMBus | 6 | BUS CONTROLLER, PCI | PCI | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
 | 89HPES3T3ZBBCG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 144 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 144 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | PCI; SMBUS | 1.5mm | 13mm | 13mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
 | 89HPES4T4ZBBCG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 144 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 144 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | PCI; SMBUS | 1.5mm | 13mm | 13mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
 | ZSSC4151AE2R | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 24 | 2016 | yes | 活跃 | 24 | 4mm | 4mm | 900μm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HPES6T6G2ZCALG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
 | 89HPES24T6G2ZBALG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
 | TW3801-TC1-CR | Intersil (Renesas Electronics America) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | TQFP | 100 | 2010 | 活跃 | 100 | 36 Mbps | 1 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HPES4T4G2ZCALGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 85°C | Tape & Reel (TR) | 2009 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | HAVING 100MHZ INPUT REFERENCE CLOCK FREQUENCY. | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | SMBUS | 625 MBps | 3.27mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
 | 89HT0816PYBBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 196 | 2012 | yes | 活跃 | 196 | I2C | 15mm | 15mm | 1.4mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HPES24T6G2ZCALGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 3.27mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
 | 89H24NT24G2ZBHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 3400mA | 192 Gbps | I2C; ISA; VGA | 2.88mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
 | 89H32NT24BG2ZBHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | Tape & Reel (TR) | 2009 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 30 | 484 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 256 Gbps | I2C; ISA; PCI; SMBUS; VGA | 32000 MBps | 2.92mm | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
 | 89H16NT16G2ZCHLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | FCBGA | 324 | 125MHz | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | 260 | 未说明 | 324 | 3.3V | PCI Express | 16 | BUS CONTROLLER, PCI | 128 Gbps | 3.02mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
 | 89HP0504UBZBNRG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 36 | 70°C | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | 36 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5mm | 未说明 | 36 | 1.26V | COMMERCIAL | 1.14V | PCI Express | 消费电路 | 0.9mm | 4mm | 7.5mm | 900μm | 符合RoHS标准 | 无铅 |