类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | ADC通道数量 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | 总线兼容性 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||
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 | AT91SAM9G45C-CU-999 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 160 | 65536 | 有 | 64kB | Copper, Silver, Tin | 表面贴装 | 324-TFBGA | 324 | ROM | -40°C~85°C TA | Cut Tape (CT) | 2010 | SAM9G | yes | 活跃 | 3 (168 Hours) | 324 | BOTTOM | BALL | 1V | 400MHz | AT91SAM9G45 | 3.3V | 2-Wire, EBI/EMI, Ethernet, I2C, I2S, IrDA, LIN, SPI, UART, USART, USB | 3.6V | 1.65V | Internal | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | YES | YES | 16b | YES | 7 | 26 | ARM | 1.8V 3.3V | 8 | 10/100Mbps | 1 Core 32-Bit | 无 | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | AC97, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | FLASH | LCD, Touchscreen | 1.2mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6G2AVM07AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6UL | 活跃 | 3 (168 Hours) | 289 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B289 | 1.3V | 1.25V | 696MHz | MICROPROCESSOR | ARM® Cortex®-A7 | 26 | YES | YES | 16 | 固定点 | YES | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | 1.32mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | OMAPL138BZWTD4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 361-LFBGA | 361 | 16 | -40°C~90°C TJ | Tube | OMAP-L1x | e1 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 456MHz | OMAPL138 | 361 | 1.35V | 1.35V | 950mV | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | 4 | ARM | YES | YES | 浮点 | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | NO | MULTIPLE | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| OMAPL132EZWTA2 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 361-LFBGA | 361 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 200MHz | OMAPL132 | 361 | 328kB | 微处理器电路 | ARM926EJ-S | 32b | ARM | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 + PHY (1) | AC97, I2C, I2S, McASP, McBSP, MMC/SD/SDIO, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | 1.4mm | 16mm | 16mm | 900μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AMIC110BZCZA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 180224 | ACTIVE (Last Updated: 5 days ago) | 324-LFBGA | YES | 324 | 64 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 0.8mm | AMIC110 | 3.6V | 3.3V | 300MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A8 | 26MHz | 32 | YES | YES | YES | NO | 1.8V 3.3V | 1 Core 32-Bit | 无 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | FLASH | 1.4mm | 15mm | 15mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3505AZCNC | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Copper, Silver, Tin | 491-LFBGA | YES | 491 | 186 | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.65mm | 600MHz | AM3505 | 491 | 1.2V | 1.248V | I2S, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 16 | 16b | 12 | ARM | YES | YES | 浮点 | YES | 65536 | 1.8V 3.3V | 4 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography | LCD | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
 | AM3517AZERA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64kB | ACTIVE (Last Updated: 5 days ago) | 484-BBGA Exposed Pad | YES | 484 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 600MHz | AM3517 | 484 | 1.2V | 1.248V | CAN, Ethernet, I2C, SPI, UART, USB | 1.248V | 1.152V | 256kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 16 | 16b | ARM | YES | YES | 浮点 | YES | 65536 | 1.8V 3.3V | 4 | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 2.48mm | 23mm | 23mm | 1.78mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | MCIMX6L2EVN10AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 432-TFBGA | YES | 162 | -40°C~105°C TA | Tray | 2002 | i.MX6SL | e1 | 活跃 | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | 不合格 | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | 固定点 | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| AM3505AZER | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | 484-BBGA Exposed Pad | YES | 484 | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 600MHz | AM3505 | 484 | 1.2V | 1.248V | I2C, UART | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 16 | 32b | ARM | YES | YES | 浮点 | YES | 65536 | 1.8V 3.3V | 4 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 (3), USB 2.0 + PHY (1) | CAN, HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 2.48mm | 23mm | 23mm | 1.78mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | MPC8347VRAGDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.2V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6G1CVM05AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | 131 | -40°C~105°C TJ | Tray | 2002 | i.MX6UL | 活跃 | 3 (168 Hours) | 289 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B289 | 1.3V | 1.15V | 528MHz | ARM® Cortex®-A7 | 16 | YES | 16 | 128000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; SPI; UART; USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LVDS | 1.32mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9N12-CUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 105 | 217-LFBGA | YES | 217 | ROM | -40°C~85°C TA | Cut Tape (CT) | 1997 | SAM9N | e8 | yes | 活跃 | 3 (168 Hours) | 217 | Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5) | BOTTOM | BALL | 0.8mm | 400MHz | AT91SAM9N12 | 11.8/3.33.3V | EBI/EMI, I2C, SPI, UART, USART, USB | 1.1V | 900mV | Internal | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | ARM | 1.8V 3.3V | 1 Core 32-Bit | 无 | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8280CVVUPEA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 480-LBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 1994 | MPC82xx | e1 | 活跃 | 4 (72 Hours) | 480 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1.27mm | 40 | MPC8280 | S-PBGA-B480 | 1.6V | 1.53.3V | 1.45V | 450MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 32 | 32 | YES | YES | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4376BZDND80 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 491-LFBGA | 491 | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.26V | 800MHz | AM4376 | 491 | CAN, I2C, SPI, UART | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | 加密加速器 | TSC, WXGA | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8313CVRADDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 11.8/2.53.3V | 0.95V | 267MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4377BZDND100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 491-LFBGA | 491 | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.325V | 1GHz | AM4377 | 491 | CAN, I2C, SPI, UART | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | 加密加速器 | TSC, WXGA | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| AM4377BZDNA80 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 491-LFBGA | 491 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.26V | 800MHz | AM4377 | 491 | CAN, I2C, SPI, UART | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | 加密加速器 | TSC, WXGA | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | AM5718AABCXEA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | 760-BFBGA, FCBGA | YES | 760 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5718 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 固定点 | NO | 524288 | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | HDMI | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | LS1046ASE8T1A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | 0°C~105°C | Tray | 2016 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 780 | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | S-PBGA-B780 | 1.03V | 0.97V | 1.8GHz | ARM® Cortex®-A72 | 14 | YES | 64 | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | DDR4 | USB 3.0 (3) + PHY | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6DP5EYM1AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA, FCBGA | YES | -20°C~105°C TJ | Tray | 2002 | i.MX6DP | 活跃 | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.8mm | 未说明 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM4372BZDN80 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 6 days ago) | 491-LFBGA | YES | 491 | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.26V | 0.65mm | AM4372 | 1.326V | 1.21V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26MHz | 32 | YES | YES | 浮点 | YES | 65536 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 加密加速器 | TSC, WXGA | 64 | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6Y2CVM05AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 289-LFBGA | YES | -40°C~105°C TJ | Tray | 2002 | i.MX6 | Obsolete | 3 (168 Hours) | 289 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | compliant | S-PBGA-B289 | 1.5V | 1.275V | 528MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 528MHz | 16 | YES | 16 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | 1 | Multimedia; NEON™ MPE | ETHERNET, I2C, PCI, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | 1.32mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3352ZCZD72 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64kB | Copper, Silver, Tin | 324-LFBGA | YES | 324 | 1.713814g | Cache, RAM, ROM | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 324 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.26V | 0.8mm | 720MHz | AM3352 | 324 | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 1.89V | 1.71V | 320kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 28 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
| MPC8313VRAFFC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 133MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8313ECVRAFFC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant |