类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电容量 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 最高频率 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 速度等级 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | ADC通道数量 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | PWM通道数 | 总线兼容性 | 保安功能 | 显示和界面控制器 | SPI 通道数 | DMA通道数 | 萨塔 | USB 通道数 | 以太网通道数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | MCIMX6Q6AVT10AD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6Q | e1 | 活跃 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 未说明 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6S5DVM10AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | YES | 0°C~95°C TJ | Tray | 2002 | i.MX6S | 活跃 | 3 (168 Hours) | 624 | BOTTOM | BALL | 260 | 0.8mm | 未说明 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9G35-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 105 | 有 | 32kB | 表面贴装 | 217-LFBGA | 217 | FLASH, ROM | -40°C~85°C TA | Tray | 2004 | SAM9G | yes | 活跃 | 3 (168 Hours) | 217 | BOTTOM | BALL | 1V | 0.8mm | 400MHz | AT91SAM9G35 | 11.8/3.33.3V | 2-Wire, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB | 1.1V | 900mV | Internal | 64kB | MICROPROCESSOR, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | 32b | 6 | 26 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 10/100Mbps | 1 Core 32-Bit | 无 | DDR2, SDRAM, SRAM | USB 2.0 (3) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 4 | LCD, Touchscreen | 15mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S6AVM08AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6S | e1 | 活跃 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3351BZCE60 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | Copper, Silver, Tin | 表面贴装 | 298-LFBGA | 298 | FLASH | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 298 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 600MHz | 未说明 | AM3351 | SPI | 1.144V | 912mV | 128kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (1) | I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 64 | 1.3mm | 13mm | 13mm | 890μm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6G3CVM05AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | 131 | -40°C~105°C TJ | Tray | 2002 | i.MX6UL | 活跃 | 3 (168 Hours) | 289 | 8542.39.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B289 | 1.3V | 1.15V | 528MHz | ARM® Cortex®-A7 | 16 | YES | 16 | 128000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; SPI; UART; USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | 1.32mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | OMAPL138EZWTA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 328kB | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | 361-LFBGA | YES | 361 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 375MHz | OMAPL138 | 361 | 1.32V | 1.14V | 16kB | 微处理器电路 | ARM926EJ-S | 32b | ARM | 375 MHz | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | I2C; SPI; UART; USB | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 1.4mm | 16mm | 16mm | 900μm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3356BZCZA80 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 324-LFBGA | YES | 324 | 1.713814g | L2 Cache, RAM, ROM | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.26V | 0.8mm | 800MHz | AM3356 | 1.26V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| OMAPL138EZCEA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 361-LFBGA | YES | 361 | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 375MHz | OMAPL138 | 361 | 微处理器电路 | ARM926EJ-S | ARM | 375 MHz | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | I2C; SPI; UART; USB | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 1.3mm | 13mm | 13mm | 890μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3356BZCZ80 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | 324-LFBGA | YES | 324 | 1.713814g | L2 Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.26V | 0.8mm | 800MHz | 未说明 | AM3356 | 不合格 | 1.26V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| AM3356BZCZA60 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 表面贴装 | 324-LFBGA | 324 | 1.713814g | L2 Cache, RAM, ROM | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 600MHz | 未说明 | AM3356 | 不合格 | 1.1V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| AM1808EZWT3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 128kB | ACTIVE (Last Updated: 1 week ago) | 361-LFBGA | YES | 361 | 789.392471mg | L1 Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | AM1808 | Ethernet, I2C, SPI, UART, USB | 1.35V | 950mV | 64kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | SATA 3Gbps (1) | 1.4mm | 16mm | 16mm | 900μm | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | AM3703CUSD100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64kB | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 423-LFBGA, FCBGA | YES | 423 | ROM | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 1GHz | AM3703 | 423 | 1.1V | 1.8V | CAN, Ethernet, I2C, SPI, UART, USB | 1.5V | 256kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 16b | ARM | YES | YES | 浮点 | YES | 65536 | 4 | 1 Core 32-Bit | 无 | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 1.4mm | 16mm | 16mm | 960μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D21C-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 196-TFBGA, CSBGA | YES | -40°C~85°C TA | Tray | 2017 | SAMA5D2 | e2 | 活跃 | 3 (168 Hours) | 196 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 0.75mm | ATSAMA5D21 | S-PBGA-B196 | 1.32V | 1.1V | 500MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | 24MHz | 26 | YES | YES | 16 | 浮点 | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.2mm | 11mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3357BZCZD30 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 324-LFBGA | YES | 324 | 1.713814g | Cache, RAM, ROM | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 300MHz | AM3357 | 1.1V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| AT91SAM9G15-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 105 | 有 | 32kB | Copper, Silver, Tin | 表面贴装 | 217-LFBGA | 217 | FLASH, ROM | -40°C~85°C TA | Tray | 2004 | SAM9G | yes | 活跃 | 3 (168 Hours) | 217 | BOTTOM | BALL | 1V | 0.8mm | 400MHz | AT91SAM9G15 | 11.8/3.33.3V | 2-Wire, EBI/EMI, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB | 1.1V | 900mV | Internal | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | YES | YES | 32b | NO | 6 | 26 | ARM | 1.8V 3.3V | 1 Core 32-Bit | 无 | LPDDR, LPSDR, DDR2, SDR, SRAM | USB 2.0 (3) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 4 | LCD, Touchscreen | 15mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3352BZCZ30 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64kB | ACTIVE (Last Updated: 1 day ago) | Copper, Silver, Tin | 324-LFBGA | 324 | 324-NFBGA(15x15) | ROM | 0°C~90°C TJ | Tray | Sitara™ | 活跃 | 3 (168 Hours) | 125°C | -40°C | 300MHz | AM3352 | 1.1V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 300MHz | 64kB | ARM® Cortex®-A8 | 32b | 10 | ARM | 300MHz | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX287CVM4B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tray | 2002 | i.MX28 | e1 | 活跃 | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | MCIMX287 | S-PBGA-B289 | 1.55V | 1.35V | 454MHz | 多功能外围设备 | ARM926EJ-S | 24MHz | YES | 128000 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | Data; DCP | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Boot Security, Cryptography, Hardware ID | Keypad, LCD, Touchscreen | 1.37mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D31A-CFU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 160 | 128kB | 324-TFBGA | YES | 324 | L1 Cache, ROM, SRAM | -40°C~85°C TA | Tray | 2014 | SAMA5D3 | yes | 活跃 | 3 (168 Hours) | 324 | BOTTOM | BALL | 1.2V | 0.5mm | 536MHz | ATSAMA5D31 | 1.2V | 2-Wire, CAN, EBI/EMI, Ethernet, I2C, SPI, UART, USART, USB | 1.32V | 1.08V | Internal | 160kB | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | 32 | 32b | 2 | 26 | ARM | YES | YES | 浮点 | YES | 1.2V 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | 1 | AES, SHA, TDES, TRNG | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| AM3352BZCZD30 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64kB | ACTIVE (Last Updated: 2 days ago) | Copper, Silver, Tin | 324-LFBGA | YES | 324 | ROM | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 300MHz | AM3352 | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 10 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| AT91SAM9263B-CU-100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 160 | 96kB | Copper, Silver, Tin | 表面贴装 | 324-TFBGA | 324 | ROM | -40°C~85°C TA | Tray | 1997 | AT91SAM | e1 | yes | 活跃 | 3 (168 Hours) | 324 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.2V | 0.8mm | 200MHz | AT91SAM9263 | 1.2V | 2-Wire, CAN, Ethernet, I2C, SPI, USART, USB | 3.6V | 1.08V | 128kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, LCD, PWM | 32 | NO | YES | 32b | NO | 3 | ARM | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps | 1 Core 32-Bit | 有 | SDRAM, SRAM | USB 2.0 (2) | AC97, CAN, EBI/EMI, I2C, ISI, MMC/SD/SDIO, SPI, SSC, UART/USART | FLASH | 4 | LCD | 2 | 1 | 790μm | 15mm | 15mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9G20B-CFU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 96 | 有 | 32kB | Copper, Silver, Tin | 表面贴装 | 247-TFBGA | 247 | FLASH, ROM | -40°C~85°C TA | Tray | 1997 | SAM9G | yes | 活跃 | 3 (168 Hours) | 247 | BOTTOM | BALL | 1V | 0.5mm | 400MHz | AT91SAM9G20 | EBI/EMI, Ethernet, I2C, I2S, IrDA, MMC, SPI, UART, USART, USB | 3.6V | 900mV | Internal | 64kB | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, POR, PWM, WDT | 32 | YES | YES | 32b | YES | 7 | ARM | 1.8V 3.3V | 3 | 4 | 10/100Mbps | 1 Core 32-Bit | 无 | SDRAM, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 2 | 1 | 810μm | 10.1mm | 10.1mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| AM3703CUS100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64kB | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 423-LFBGA, FCBGA | YES | 423 | ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 1GHz | AM3703 | 423 | 1.1V | 1.8V | I2C, SPI, UART, USB | 1.5V | 32kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 65536 | 4 | 1 Core 32-Bit | 无 | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 1.4mm | 16mm | 16mm | 960μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6S7CVM08AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6S | e1 | 活跃 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | YES | YES | 浮点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6Q5EYM10AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 624-LFBGA, FCBGA | YES | -20°C~105°C TJ | Tray | 2002 | i.MX6Q | e1 | 不用于新设计 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 1.6mm | 21mm | ROHS3 Compliant |