类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 建筑学 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 产品条款数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | EPM7032LC44-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | 36 | 0°C~70°C TA | Tray | MAX® 7000 | Obsolete | 3 (168 Hours) | EPM7032 | EE PLD | 600 | 32 | 4.75V~5.25V | 12ns | 2 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LC4064ZC-5MN56C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 32 | 表面贴装 | 表面贴装 | 56-LFBGA, CSPBGA | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000Z | e1 | yes | 活跃 | 3 (168 Hours) | 56 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 260 | 1.8V | 0.5mm | not_compliant | 40 | LC4064 | 56 | S-PBGA-B56 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 80μA | 80μA | 5 ns | 4 | 250MHz | 484 | MACROCELL | 64 | YES | 12 | 1.7V~1.9V | 5ns | 1.35mm | 6mm | 6mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||
 | LC4256V-5FTN256BI | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 160 | 表面贴装 | 表面贴装 | 256-LBGA | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000V | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 227.27MHz | 40 | LC4256 | 256 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 12.5mA | 5 ns | 16 | MACROCELL | 256 | YES | 4 | 3V~3.6V | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||
 | EPM1270GT144C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 144 | 3A991 | 锡铅 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 1.8V | 0.5mm | 30 | EPM1270 | S-PQFP-G144 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 6.2 ns | MACROCELL | 980 | YES | 1.71V~1.89V | 6.2ns | 1270 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | EPM9560RC240-20 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 240-BFQFP Exposed Pad | YES | 191 | 0°C~70°C TA | Tray | MAX® 9000 | e0 | Obsolete | 3 (168 Hours) | 240 | Tin/Lead (Sn/Pb) | 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.5mm | compliant | 30 | EPM9560 | S-PQFP-G240 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 100MHz | 23.6 ns | 12000 | MACROCELL | 560 | YES | 4.75V~5.25V | 20ns | 35 | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | XC95144-10TQ100C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 81 | 0°C~70°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | YES | QUAD | 鸥翼 | 225 | 5V | 0.5mm | unknown | 30 | XC95144 | 100 | 不合格 | 5V | In System Programmable (min 10K program/erase cycles) | 67.7MHz | 10 ns | 8 | 3200 | MACROCELL | 144 | YES | 4.75V~5.25V | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||
 | XC95144XL-7CSG144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 117 | 表面贴装 | 表面贴装 | 144-TFBGA, CSPBGA | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e1 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 3.3V | 30 | XC95144XL | 144 | 不合格 | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 7.5 ns | 8 | 3200 | 125MHz | 7 | MACROCELL | 144 | YES | 3V~3.6V | 1.2mm | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| EPM9480RC240-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 240-BFQFP Exposed Pad | 240-RQFP (32x32) | 175 | 0°C~70°C TA | Tray | MAX® 9000 | Obsolete | 3 (168 Hours) | EPM9480 | 系统内可编程 | 10000 | 480 | 4.75V~5.25V | 15ns | 30 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LC4064V-5T48C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 | 表面贴装 | 表面贴装 | 48-LQFP | 48 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e0 | no | Obsolete | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn85Pb15) | YES | QUAD | 鸥翼 | 240 | 3.3V | 0.5mm | not_compliant | 227.27MHz | 30 | LC4064 | 48 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 12mA | 12mA | 5 ns | 36 | 272 | MACROCELL | 64 | YES | 4 | 3V~3.6V | 4 | 1.2mm | 7mm | 7mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||
 | GAL22V10D-25LJI | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 10 | -40°C~85°C TA | Bulk | 1996 | GAL®22V10 | e0 | no | Obsolete | 3 (168 Hours) | 28 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | QUAD | J BEND | 225 | 5V | 1.27mm | 38.5MHz | 30 | GAL22V10 | 28 | 10 | 5V | 5V | EE PLD | 5.5V | 4.5V | 130mA | 25 ns | 25 ns | PAL-TYPE | MACROCELL | 10 | 11 | 4.5V~5.5V | 132 | 4.572mm | 11.5062mm | 11.5062mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||
.png) | XCR3512XL-12FG324I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 260 | 表面贴装 | 324-BBGA | YES | EEPROM | -40°C~85°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 324 | 3A991.D | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | not_compliant | 30 | 324 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 12000 | 77MHz | 12 | MACROCELL | 512 | YES | 2.7V~3.6V | 10.8ns | 32 | 2.5mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | GAL22V10D-15LP | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 24-DIP (0.300, 7.62mm) | 24 | 10 | 0°C~75°C TA | Bulk | 1996 | GAL®22V10 | e0 | no | Obsolete | 3 (168 Hours) | 24 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | DUAL | 5V | 2.54mm | 83.3MHz | GAL22V10 | 24 | 10 | 5V | 5V | EE PLD | 5.25V | 4.75V | 90mA | 15 ns | 15 ns | PAL-TYPE | MACROCELL | 10 | 11 | 4.75V~5.25V | 132 | 5.334mm | 31.75mm | 7.62mm | 无 | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||||||||||
 | XCR3128XL-6CSG144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 108 | 表面贴装 | 表面贴装 | 144-TFBGA, CSPBGA | 144 | EEPROM | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e1 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 3.3V | 30 | 144 | 不合格 | 3.3V | In System Programmable (min 1K program/erase cycles) | 6 ns | 8 | 3000 | 175MHz | 6 | MACROCELL | 128 | YES | 3V~3.6V | 5.5ns | 1.2mm | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | EPM7128AETA100-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-LBGA | 100-FBGA (11x11) | 84 | -40°C~130°C TJ | Tray | MAX® 7000A | 活跃 | 3 (168 Hours) | EPM7128 | 系统内可编程 | 2500 | 128 | 3V~3.6V | 10ns | 8 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY37128VP160-83AXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 133 | Tin | 表面贴装 | 表面贴装 | 160-LQFP | 160 | EEPROM | -40°C~85°C TA | Tray | 2003 | Ultra37000™ | e3 | Obsolete | 3 (168 Hours) | 160 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 83MHz | 20 | CY37128 | 160 | 3.3V | In-System Reprogrammable™ (ISR™) CMOS | 3.6V | 3V | 15 ns | 15 ns | 3800 | 8 | 83 | MACROCELL | 128 | YES | 1 | 3V~3.6V | 1.6mm | 24mm | 24mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||
 | LC4128ZE-7MN144C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 96 | 表面贴装 | 表面贴装 | 144-TFBGA, CSPBGA | 144 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000ZE | e1 | 活跃 | 3 (168 Hours) | 144 | EAR99 | YES | BOTTOM | BALL | 1.8V | 0.5mm | not_compliant | 200MHz | LC4128 | 144 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 168μA | 168μA | 7.5 ns | 7.5 ns | 8 | 64 | MACROCELL | 128 | YES | 4 | 1.7V~1.9V | 1.1mm | 7mm | 7mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||
| LC4032C-75T48C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 | 表面贴装 | 表面贴装 | 48-LQFP | 48 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000C | e0 | no | Obsolete | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn85Pb15) | YES | QUAD | 鸥翼 | 240 | 1.8V | 0.5mm | not_compliant | 30 | LC4032 | 48 | 不合格 | 1.8V | 系统内可编程 | 1.95V | 1.65V | 1.8mA | 1.8mA | 7.5 ns | 800 | 400MHz | 128 | MACROCELL | 32 | YES | 4 | 1.65V~1.95V | 7.5ns | 2 | 7mm | 7mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||
 | ATF1508AS-10AC100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 80 | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-TQFP (14x14) | EEPROM | 0°C~70°C TA | Tray | 1997 | ATF15xx | Obsolete | 3 (168 Hours) | 70°C | 0°C | 125MHz | ATF1508AS | 5V | In System Programmable (min 10K program/erase cycles) | 5.25V | 4.75V | 10 ns | 10 ns | 8 | 3000 | 125MHz | 80 | 8 | 10 | 128 | 4.75V~5.25V | 10ns | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||
| LC4512V-75FTN256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 208 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000V | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 178.57MHz | 40 | LC4512 | 256 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 14mA | 14mA | 7.5 ns | 32 | MACROCELL | 512 | YES | 4 | 3V~3.6V | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||
 | XC2C256-7PQ208I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 173 | -40°C~85°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | 真正的数字设计技术 | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 1.8V | 0.5mm | 30 | XC2C256 | 208 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 7.5 ns | 16 | 6000 | 152MHz | 7 | MACROCELL | 256 | YES | 1.7V~1.9V | 6.7ns | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| XC9572XV-7TQ100C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 72 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | 0°C~70°C TA | Tray | 2000 | XC9500XV | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn85Pb15) | YES | QUAD | 鸥翼 | 225 | 2.5V | 0.5mm | 30 | XC9572XV | 100 | 2.5V | 2.62V | 系统内可编程 | 7.5 ns | 7.5 ns | 4 | 1600 | 125MHz | 7 | MACROCELL | 72 | YES | 2.37V~2.62V | 1.6mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||
| CY39100V388B-125MGC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 388-BBGA | 294 | 0°C~70°C TA | Tray | 2003 | Delta 39K™ ISR™ | e0 | Obsolete | 3 (168 Hours) | 388 | 锡铅 | ALSO OPERATES WITH 3.3V SUPPLY VOLTAGE | 8542.39.00.01 | BOTTOM | BALL | 225 | 2.5V | 1.27mm | unknown | 30 | CY39100 | 388 | S-PBGA-B388 | 不合格 | 2.7V | 1.5/3.32.5/3.3V | 2.3V | In-System Reprogrammable™ (ISR™) Flash | 10 ns | 144000 | MACROCELL | 1536 | YES | 2.5V 3.3V | 2.46mm | 35mm | 35mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||
 | EPM570GF256C4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 160 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | EAR99 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM570 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | EPM7032BTC44-3N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-TQFP | 44-TQFP (10x10) | 36 | 0°C~70°C TA | Tray | MAX® 7000B | Obsolete | 3 (168 Hours) | EPM7032 | 系统内可编程 | 600 | 32 | 2.375V~2.625V | 3.5ns | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY37512P208-125NXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 165 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | EEPROM | 0°C~70°C TA | Tray | 2003 | Ultra37000™ | e3 | Obsolete | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 125MHz | 20 | CY37512 | 208 | 5V | In-System Reprogrammable™ (ISR™) CMOS | 5.25V | 4.75V | 10 ns | 10 ns | 32 | MACROCELL | 512 | 1 | 4.75V~5.25V | 3.77mm | 28mm | 28mm | 无 | ROHS3 Compliant | 无铅 |