类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 建筑学 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 产品条款数量 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | EPM1270GF256C4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-BGA | YES | 212 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 256 | 3A991 | 锡铅 | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM1270 | S-PBGA-B256 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 8.1 ns | MACROCELL | 980 | YES | 1.71V~1.89V | 6.2ns | 1270 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | EPM7128ELC84-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 84 | 锡铅 | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7128 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 166.7MHz | 7.5 ns | 2500 | MACROCELL | 128 | NO | 4.75V~5.25V | 7.5ns | 8 | 29.3116mm | 29.3116mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | GAL16V8D-10LPNI | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 20-DIP (0.300, 7.62mm) | 20 | 8 | -40°C~85°C TA | Bulk | 1996 | GAL®16V8 | e3 | yes | Obsolete | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | DUAL | 5V | 2.54mm | 83.3MHz | GAL16V8 | 20 | 8 | 5V | 5V | EE PLD | 5.5V | 4.5V | 130mA | 10 ns | 10 ns | PAL-TYPE | MACROCELL | 8 | 8 | 4.5V~5.5V | 64 | 5.334mm | 26.162mm | 7.62mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
 | EPM7064LC44-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 36 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 44 | 锡铅 | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7064 | 不合格 | 5.25V | 5V | EE PLD | 125MHz | 12 ns | 1250 | MACROCELL | 64 | NO | 4.75V~5.25V | 12ns | 4 | 16.5862mm | 16.5862mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
 | GAL18V10B-20LJ | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 20-LCC (J-Lead) | 20 | 10 | 0°C~75°C TA | Tube | 2000 | GAL®18V10 | e0 | Obsolete | 1 (Unlimited) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | REGISTER PRELOAD; POWER-UP RESET | 8542.39.00.01 | QUAD | J BEND | 225 | 5V | 1.27mm | 62.5MHz | 30 | GAL18V10 | 20 | 10 | 5V | 5V | EE PLD | 5.25V | 4.75V | 115mA | 20 ns | 20 ns | PAL-TYPE | MACROCELL | 10 | 7 | 4.75V~5.25V | 96 | 4.57mm | 8.9662mm | 8.9662mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||
 | CY37032VP44-100AC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-LQFP | 37 | 0°C~70°C TA | Tray | 2003 | Ultra37000™ | e0 | Obsolete | 3 (168 Hours) | 44 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 240 | 3.3V | 0.8mm | not_compliant | 30 | CY37032 | 44 | S-PQFP-G44 | 不合格 | 3.3V | 3.6V | In-System Reprogrammable™ (ISR™) CMOS | 80MHz | 12 ns | 2 | MACROCELL | 32 | YES | 1 | 3V~3.6V | 1.6mm | 10mm | 10mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||
 | ISPLSI 2096A-80LT128I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 128-LQFP | YES | 96 | -40°C~85°C TA | Tray | 2000 | ispLSI® 2000A | e0 | no | Obsolete | 3 (168 Hours) | 128 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 240 | 5V | 0.4mm | not_compliant | 30 | ISPLSI 2096 | 128 | S-PQFP-G128 | 不合格 | 5.5V | 5V | 4.5V | 系统内可编程 | 57MHz | 18.5 ns | 4000 | MACROCELL | 96 | NO | 3 | 4.5V~5.5V | 15ns | 24 | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | EPM7096LC68-12 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 68-LCC (J-Lead) | 68-PLCC (24x24) | 52 | 0°C~70°C TA | Tray | MAX® 7000 | Obsolete | 3 (168 Hours) | EPM7096 | EE PLD | 1800 | 96 | 4.75V~5.25V | 12ns | 6 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EPM7128AEFC256-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 100 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991 | 锡铅 | YES | BOTTOM | BALL | 220 | 3.3V | 1mm | compliant | 30 | EPM7128 | S-PBGA-B256 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 10 ns | 2500 | MACROCELL | 128 | YES | 3V~3.6V | 10ns | 8 | 2.1mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | EPM3512AQC208-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP | YES | 172 | 0°C~70°C TA | Tray | MAX® 3000A | e0 | Obsolete | 3 (168 Hours) | 208 | 3A991 | Tin/Lead (Sn/Pb) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPM3512 | S-PQFP-G208 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 7.5 ns | 10000 | MACROCELL | 512 | YES | 3V~3.6V | 7.5ns | 32 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | XCR3256XL-12CSG280C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 280-TFBGA, CSPBGA | YES | 164 | 0°C~70°C TA | Tray | 2003 | CoolRunner XPLA3 | e1 | yes | 活跃 | 3 (168 Hours) | 280 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 30 | 280 | S-PBGA-B280 | 不合格 | 3.6V | 3.3V | 3V | In System Programmable (min 1K program/erase cycles) | 88MHz | 12 ns | 6000 | MACROCELL | 256 | YES | 3V~3.6V | 10.8ns | 16 | 1.2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | XCR3384XL-10PQ208C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 172 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | EEPROM | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | XCR3384XL | 208 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 24 | 9000 | 102MHz | 10 | MACROCELL | 384 | YES | 3V~3.6V | 9ns | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||
 | LC4128ZC-75TN100E | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 64 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | EEPROM | -40°C~130°C TJ | Tray | 2000 | ispMACH® 4000Z | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 30 | LC4128 | 100 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.6V | 168μA | 4.2 ns | 8 | 220MHz | MACROCELL | 128 | YES | 10 | 1.7V~1.9V | 7.5ns | 1.6mm | 14mm | 14mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||
 | EPM570GT144C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | 144 | EAR99 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | EPM570 | S-PQFP-G144 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | 5M40ZM64I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 64-TFBGA | YES | 30 | -40°C~100°C TJ | Tray | 2003 | MAX® V | e1 | 活跃 | 3 (168 Hours) | 64 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 30 | 5M40Z | S-PBGA-B64 | 不合格 | 1.89V | 1.71V | 系统内可编程 | 118.3MHz | 14 ns | MACROCELL | 32 | 1.71V~1.89V | 7.5ns | 40 | 1.2mm | 4.5mm | 4.5mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | EPM570GT100C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 76 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡铅 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 235 | 1.8V | 0.5mm | 30 | EPM570 | S-PQFP-G100 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 5.4 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| EPM570GT100C4 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 76 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡铅 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 235 | 1.8V | 0.5mm | 30 | EPM570 | S-PQFP-G100 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7 ns | MACROCELL | 440 | YES | 1.71V~1.89V | 5.4ns | 570 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| EPM3064ALI44-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 34 | -40°C~85°C TA | Tray | MAX® 3000A | e3 | Obsolete | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | J BEND | 245 | 3.3V | 1.27mm | compliant | 40 | EPM3064 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 100MHz | 10 ns | 1250 | MACROCELL | 64 | YES | 3V~3.6V | 10ns | 4 | 16.5862mm | 16.5862mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| EPM570T144C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | MAX® II | e0 | 活跃 | 3 (168 Hours) | 144 | EAR99 | 锡铅 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 2.5V | 0.5mm | 30 | EPM570 | S-PQFP-G144 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 5.4 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | ATF1504AS-15AC100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64 | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-TQFP (14x14) | EEPROM | 0°C~70°C TA | Tray | 1997 | ATF15xx | Obsolete | 3 (168 Hours) | 70°C | 0°C | 100MHz | ATF1504AS | 5V | In System Programmable (min 10K program/erase cycles) | 5.25V | 4.75V | 15 ns | 15 ns | 4 | 1500 | 125MHz | 64 | 4 | 15 | 64 | 4.75V~5.25V | 15ns | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||
 | EPM7160EQC100-20 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-BQFP | YES | 84 | 0°C~70°C TA | Tray | MAX® 7000 | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.65mm | compliant | 30 | EPM7160 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 83.3MHz | 20 ns | 3200 | MACROCELL | 160 | NO | 4.75V~5.25V | 20ns | 10 | 3.65mm | 20mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| EPM7256AEFC256-5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 256-BGA | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000A | e1 | Obsolete | 3 (168 Hours) | 256 | 3A991 | 锡银铜 | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | compliant | 40 | EPM7256 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 172.4MHz | 5.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 5.5ns | 16 | 2.1mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| GAL16V8D-25LPI | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 20-DIP (0.300, 7.62mm) | 20 | 8 | -40°C~85°C TA | Bulk | 2000 | GAL®16V8 | e0 | no | Obsolete | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn/Pb) | DUAL | 225 | 5V | 2.54mm | 41.6MHz | 30 | GAL16V8 | 20 | 8 | 5V | 5V | EE PLD | 5.5V | 4.5V | 130mA | 25 ns | 25 ns | PAL-TYPE | MACROCELL | 8 | 8 | 4.5V~5.5V | 64 | 5.334mm | 26.162mm | 7.62mm | 无 | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||
 | XCR3128XL-7CSG144I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 108 | 表面贴装 | 表面贴装 | 144-TFBGA, CSPBGA | 144 | EEPROM | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e1 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | BOTTOM | BALL | 260 | 3.3V | 30 | 144 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 7.5 ns | 8 | 3000 | 119MHz | 7 | MACROCELL | 128 | YES | 2.7V~3.6V | 7ns | 1.2mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| XCR3256XL-7PQG208C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 164 | Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | EEPROM | 0°C~70°C TA | Tray | 2003 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 208 | EAR99 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 3.3V | 0.5mm | 30 | 208 | 不合格 | 3.3V | In System Programmable (min 1K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 16 | 6000 | 154MHz | 7 | MACROCELL | 256 | YES | 3V~3.6V | 7ns | 4.1mm | 28mm | 28mm | ROHS3 Compliant |