类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | EPM570T144C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 116 | 0°C~85°C TJ | Tray | MAX® II | e3 | 活跃 | 3 (168 Hours) | 144 | MATTE TIN (472) OVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | EPM570 | S-PQFP-G144 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 7 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | LC5256MB-5FN256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 141 | 表面贴装 | 表面贴装 | 256-BGA | EEPROM, SRAM | -40°C~105°C TJ | Tray | 2000 | ispXPLD® 5000MB | e1 | yes | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | YES | BOTTOM | BALL | 250 | 2.5V | 1mm | 40 | LC5256 | 256 | 不合格 | 2.5V | 系统内可编程 | 2.7V | 2.3V | 26mA | 26mA | 6 ns | 8 | 75000 | 300MHz | 48 | MACROCELL | 256 | YES | 2.3V~2.7V | 5ns | 2.1mm | 17mm | 17mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
 | XC2C64A-5VQG100C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 64 | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | ROMless | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | 真正的数字设计技术 | QUAD | 鸥翼 | 260 | 1.8V | 30 | XC2C64A | 100 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 5 ns | 5 ns | 4 | 1500 | 263MHz | 5 | MACROCELL | 64 | YES | 1.7V~1.9V | 4.6ns | 1.2mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | XC2C128-6TQG144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 100 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | ROMless | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 30 | XC2C128 | 144 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 6 ns | 8 | 3000 | 244MHz | 6 | MACROCELL | 128 | YES | 1.7V~1.9V | 5.7ns | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||
| LC4128V-5TN144C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 96 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 227.27MHz | 40 | LC4128 | 144 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 12mA | 12mA | 5 ns | 36 | 680 | MACROCELL | 128 | YES | 4 | 3V~3.6V | 8 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||
 | EPM3128ATC100-5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 80 | 0°C~70°C TA | Tray | MAX® 3000A | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | YES | QUAD | 鸥翼 | 235 | 3.3V | 0.5mm | 30 | EPM3128 | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 192.3MHz | 5 ns | 2500 | MACROCELL | 128 | YES | 3V~3.6V | 5ns | 8 | 1.27mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | XC9572XL-10CS48I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 38 | Lead, Tin | 表面贴装 | 表面贴装 | 48-FBGA, CSPBGA | 48 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | e0 | no | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 240 | 3.3V | 0.8mm | 30 | XC9572XL | 48 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 10 ns | 10 ns | 4 | 1600 | 100MHz | 10 | MACROCELL | 72 | YES | 3V~3.6V | 1.8mm | 7mm | 7mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
 | ATF750C-10SU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 10 | Tin | 表面贴装 | 表面贴装 | 24-SOIC (0.295, 7.50mm Width) | 24 | EEPROM | -40°C~85°C TA | Tube | 1997 | ATF750C(L) | e3 | yes | 活跃 | 3 (168 Hours) | 24 | NO | DUAL | 鸥翼 | 5V | 1.27mm | 90MHz | ATF750 | 5V | 5V | In System Programmable (min 1K program/erase cycles) | 5.5V | 4.5V | 10 ns | 10 ns | 750 | MACROCELL | 10 | NO | 11 | 4.5V~5.5V | 2.65mm | 15.4mm | 7.5mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||
 | ATF1508ASL-25JU84 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64 | Tin | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | EEPROM | -40°C~85°C TA | Tube | 1997 | ATF15xx | e3 | yes | 活跃 | 2 (1 Year) | 84 | QUAD | J BEND | 245 | 5V | 1.27mm | 33.3MHz | 40 | ATF1508ASL | 不合格 | 5V | In System Programmable (min 10K program/erase cycles) | 5.5V | 4.5V | 25 ns | 25 ns | 3000 | 8 | 25 | MACROCELL | 128 | YES | 4.5V~5.5V | 4.572mm | 29.3115mm | 29.3115mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||
| EPM570T100I5 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 76 | -40°C~100°C TJ | Tray | 2009 | MAX® II | e0 | 活跃 | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 2.5V | 0.5mm | 未说明 | EPM570 | S-PQFP-G100 | 不合格 | 2.625V | 1.5/3.32.5/3.3V | 2.375V | 系统内可编程 | 8.7 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 1.2mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | LC4256V-75TN100I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 64 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 178.57MHz | 30 | LC4256 | 100 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 7.5 ns | 7.5 ns | 36 | MACROCELL | 256 | YES | 10 | 3V~3.6V | 16 | 1.6mm | 14mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||
 | EPM7128SLI84-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | -40°C~85°C TA | Tray | MAX® 7000S | Obsolete | 3 (168 Hours) | 84 | EAR99 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | QUAD | J BEND | 未说明 | 5V | 1.27mm | compliant | 未说明 | EPM7128 | 不合格 | 5.5V | 3.3/55V | 4.5V | 系统内可编程 | 125MHz | 10 ns | 2500 | MACROCELL | 128 | YES | 4.5V~5.5V | 10ns | 8 | 29.3116mm | 29.3116mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| EPM7064BTC100-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 68 | 0°C~70°C TA | Tray | MAX® 7000B | e0 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn/Pb) | YES | QUAD | 鸥翼 | 235 | 2.5V | 0.5mm | compliant | 30 | EPM7064 | S-PQFP-G100 | 不合格 | 2.625V | 1.8/3.32.5V | 2.375V | 系统内可编程 | 303MHz | 3.5 ns | 1250 | MACROCELL | 64 | YES | 2.375V~2.625V | 7.5ns | 4 | 1.27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | XCR3512XL-10FT256I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 212 | 表面贴装 | 256-LBGA | YES | 256 | EEPROM | -40°C~85°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 256 | 3A991.D | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 3.3V | 1mm | not_compliant | 30 | 256 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 12000 | 97MHz | 10 | MACROCELL | 512 | YES | 2.7V~3.6V | 9ns | 32 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||
| LC4256V-75TN144E | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 96 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | EEPROM | -40°C~130°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 178.57MHz | 40 | LC4256 | 144 | 不合格 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 12.5mA | 7.5 ns | 36 | 44 | MACROCELL | 256 | YES | 4 | 3V~3.6V | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||
 | XC95288XL-7PQ208I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 168 | Lead, Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | e0 | no | 活跃 | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | XC95288XL | 208 | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 16 | 6400 | 125MHz | 7 | MACROCELL | 288 | YES | 3V~3.6V | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||
| 5M160ZT100I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TQFP | YES | 79 | -40°C~100°C TJ | Tray | MAX® V | e3 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 哑光锡 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1.8V | 0.5mm | 未说明 | 5M160Z | S-PQFP-G100 | 不合格 | 1.89V | 1.2/3.31.8V | 1.71V | 系统内可编程 | 118.3MHz | 14 ns | MACROCELL | 128 | YES | 1.71V~1.89V | 7.5ns | 160 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | ATF2500C-20PU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 24 | Tin | 通孔 | 通孔 | 40-DIP (0.600, 15.24mm) | 40 | 5.953513g | EEPROM | -40°C~85°C TA | Tube | 1997 | ATF2500C(L) | e3 | yes | 活跃 | 1 (Unlimited) | 40 | NO | DUAL | 5V | 2.54mm | 71MHz | ATF2500 | 5V | 5V | 系统内可编程 | 5.5V | 4.5V | 20 ns | 20 ns | 2500 | 20 | MACROCELL | 24 | NO | 13 | 4.5V~5.5V | 4.826mm | 52.58mm | 13.97mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||
| XC2C512-7FT256I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 212 | -40°C~85°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 256 | 3A991.D | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 1.8V | 1mm | 30 | XC2C512 | 256 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 7.5 ns | 32 | 12000 | 179MHz | 7 | MACROCELL | 512 | YES | 1.7V~1.9V | 7.1ns | 1.55mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | ATF1504BE-7AU100 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 80 | 表面贴装 | 表面贴装 | 100-TQFP | 100 | EEPROM | -40°C~85°C TA | Tray | 1997 | ATF15xx | Obsolete | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 1.8V | 0.5mm | 210MHz | ATF1504BE | 1.8V | In System Programmable (min 10K program/erase cycles) | 1.9V | 1.7V | 7 ns | 7 ns | 1500 | 32 | 7 | MACROCELL | 64 | 4 | 1.7V~1.9V | 7.5ns | 1.2mm | 14mm | 14mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| EPM7128ELC84-20 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 84-LCC (J-Lead) | YES | 68 | 0°C~70°C TA | Tray | 1998 | MAX® 7000 | e0 | Obsolete | 2 (1 Year) | 84 | EAR99 | 锡铅 | QUAD | J BEND | 220 | 5V | 1.27mm | 30 | EPM7128 | 不合格 | 5.25V | 3.3/55V | 4.75V | EE PLD | 20 ns | 2500 | MACROCELL | 128 | NO | 4.75V~5.25V | 20ns | 8 | 29.3116mm | 29.3116mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | EPM7256SRC208-7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP Exposed Pad | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000S | e3 | Obsolete | 3 (168 Hours) | 208 | 3A991 | MATTE TIN (472) OVER COPPER | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 5V | 0.5mm | compliant | 40 | EPM7256 | S-PQFP-G208 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 7.5 ns | 5000 | MACROCELL | 256 | YES | 4.75V~5.25V | 7.5ns | 16 | 4.1mm | 28mm | 28mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| XCR3384XL-12TQG144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 118 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | EEPROM | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 30 | 144 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 24 | 9000 | 83MHz | 12 | MACROCELL | 384 | YES | 3V~3.6V | 10.8ns | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||
| EPM7256SRC208-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP Exposed Pad | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000S | e0 | Obsolete | 3 (168 Hours) | 208 | 3A991 | 锡铅 | CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.5mm | 30 | EPM7256 | S-PQFP-G208 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 125MHz | 10 ns | 5000 | MACROCELL | 256 | YES | 4.75V~5.25V | 10ns | 16 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | XC95108-10PQ100I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 81 | -40°C~85°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | YES | QUAD | 鸥翼 | 225 | 5V | not_compliant | 30 | XC95108 | 100 | 不合格 | 5V | In System Programmable (min 10K program/erase cycles) | 10 ns | 8 | 2400 | MACROCELL | 108 | YES | 4.5V~5.5V | 6 | 3.4mm | 20mm | 14mm | Non-RoHS Compliant | 含铅 |