类别是'嵌入式 - CPLD（复杂可编程逻辑器件）'
嵌入式 - CPLD（复杂可编程逻辑器件） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 时钟频率 | 传播延迟 | 接通延迟时间 | 逻辑元件/单元数 | 阀门数量 | 最高频率 | 可编程I/O数 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 宏细胞数 | JTAG BST | 专用输入数量 | 内部供电电压 | 延迟时间 tpd(1)最大 | 逻辑元素/块的数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XC95288XL-7TQG144I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 117 | Tin | 表面贴装 | 表面贴装 | 144-LQFP | 144 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 125MHz | 30 | XC95288XL | 144 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 16 | 6400 | 7 | MACROCELL | 288 | YES | 3V~3.6V | 1.6mm | 20mm | 20mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||
 | EPM7256SQC208-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000S | e3 | Obsolete | 3 (168 Hours) | 208 | 3A991 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 5V | 0.5mm | compliant | 40 | EPM7256 | S-PQFP-G208 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 125MHz | 10 ns | 5000 | MACROCELL | 256 | YES | 4.75V~5.25V | 10ns | 16 | 4.1mm | 28mm | 28mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | XCR3064XL-6VQ100C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 68 | 表面贴装 | 表面贴装 | 100-TQFP | 100 | EEPROM | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn85Pb15) | YES | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | not_compliant | 30 | XCR3064XL | 100 | 不合格 | 3.3V | In System Programmable (min 1K program/erase cycles) | 6 ns | 4 | 1500 | 192MHz | 6 | MACROCELL | 64 | YES | 3V~3.6V | 5.5ns | 1.2mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||
 | EPM7064AELC44-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 44-LCC (J-Lead) | YES | 36 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 1 (Unlimited) | 44 | EAR99 | Tin/Lead (Sn/Pb) | QUAD | J BEND | 220 | 3.3V | 1.27mm | 30 | EPM7064 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 100MHz | 10 ns | 1250 | MACROCELL | 64 | YES | 3V~3.6V | 10ns | 4 | 16.5862mm | 16.5862mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | XC9572XL-7CSG48I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 38 | 表面贴装 | 表面贴装 | 48-FBGA, CSPBGA | 48 | 48-CSBGA (7x7) | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | 活跃 | 3 (168 Hours) | 85°C | -40°C | XC9572XL | 3.3V | In System Programmable (min 10K program/erase cycles) | 7.5 ns | 4 | 1600 | 125MHz | 4 | 7 | 72 | 3V~3.6V | 7.5ns | 4 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| XCR3256XL-12TQG144I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 120 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | EEPROM | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 30 | 144 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 16 | 6000 | 88MHz | 12 | MACROCELL | 256 | YES | 2.7V~3.6V | 10.8ns | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | XC2C256-6FT256C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 184 | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e0 | no | 活跃 | 3 (168 Hours) | 256 | EAR99 | 真正的数字设计技术 | 8542.39.00.01 | BOTTOM | BALL | 240 | 1.8V | 1mm | 30 | XC2C256 | 256 | 不合格 | 1.8V | 1.9V | 系统内可编程 | 6 ns | 16 | 6000 | 256MHz | 6 | MACROCELL | 256 | YES | 1.7V~1.9V | 5.7ns | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | ATF1502AS-7JX44 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 32 | Tin | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | EEPROM | 0°C~70°C TA | Tube | 1997 | ATF15xx | e3 | yes | 活跃 | 2 (1 Year) | 44 | YES | QUAD | J BEND | 245 | 5V | 166.7MHz | 40 | ATF1502AS | 5V | In System Programmable (min 10K program/erase cycles) | 5.25V | 4.75V | 7.5 ns | 7.5 ns | 750 | 2 | 7 | MACROCELL | 32 | YES | 4.75V~5.25V | 16.586mm | 16.586mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||
| EPM3064ALC44-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 34 | 0°C~70°C TA | Tray | 1998 | MAX® 3000A | e3 | Obsolete | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | J BEND | 245 | 3.3V | 1.27mm | compliant | 40 | EPM3064 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 100MHz | 10 ns | 1250 | MACROCELL | 64 | YES | 3V~3.6V | 10ns | 4 | 16.5862mm | 16.5862mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| XC9536XL-10CS48I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | Lead, Tin | 表面贴装 | 表面贴装 | 48-FBGA, CSPBGA | 48 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | e0 | no | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn63Pb37) | YES | BOTTOM | BALL | 240 | 3.3V | 0.8mm | 30 | XC9536XL | 48 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 10 ns | 10 ns | 2 | 800 | 100MHz | 10 | MACROCELL | 36 | YES | 3V~3.6V | 1.8mm | 7mm | 7mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
| XC95288XL-6TQG144C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 117 | 表面贴装 | 表面贴装 | 144-LQFP | 144 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500XL | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 208.3MHz | 30 | XC95288XL | 144 | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 6 ns | 16 | 6400 | 6 | MACROCELL | 288 | YES | 3V~3.6V | 20mm | 20mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||
 | LC4256V-5TN176C | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 128 | 表面贴装 | 表面贴装 | 176-LQFP | 176 | EEPROM | 0°C~90°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 176 | EAR99 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 227.27MHz | 40 | LC4256 | 176 | 3.3V | 系统内可编程 | 3.6V | 3V | 12.5mA | 12.5mA | 5 ns | 5 ns | 388 | 36 | MACROCELL | 256 | YES | 4 | 3V~3.6V | 16 | 1.6mm | 24mm | 24mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||
 | 5M2210ZF324C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-LBGA | YES | 271 | 0°C~85°C TJ | Tray | 2003 | MAX® V | e1 | 活跃 | 3 (168 Hours) | 324 | 3A991 | 锡银铜 | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | 5M2210Z | S-PBGA-B324 | 不合格 | 1.89V | 1.81.2/3.3V | 1.71V | 系统内可编程 | 201.1MHz | 11.2 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 1.55mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | XC9572-10PQ100C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 72 | 表面贴装 | 表面贴装 | 100-BQFP | 100 | FLASH | 0°C~70°C TA | Tray | 1996 | XC9500 | e0 | no | Obsolete | 3 (168 Hours) | 100 | EAR99 | YES | QUAD | 鸥翼 | 225 | 5V | 0.65mm | 30 | XC9572 | 100 | 5V | In System Programmable (min 10K program/erase cycles) | 10 ns | 8 | 1600 | 66.7MHz | 10 | MACROCELL | 72 | YES | 4.75V~5.25V | 4 | 20mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||
 | XC95144XL-7TQ100I | Xilinx Inc. | 数据表 | 5505 In Stock |
| 最小起订量: 1 倍率: 1 | 10 Weeks | 81 | Lead, Tin | 表面贴装 | 表面贴装 | 100-LQFP | 100 | FLASH | -40°C~85°C TA | Tray | 1996 | XC9500XL | e0 | no | 活跃 | 3 (168 Hours) | 100 | EAR99 | YES | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | not_compliant | 30 | XC95144XL | 100 | 不合格 | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 8 | 3200 | 125MHz | 7 | MACROCELL | 144 | YES | 3V~3.6V | 1.6mm | 14mm | 14mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
 | LC4032V-75TN44I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 30 | 表面贴装 | 表面贴装 | 44-TQFP | 44 | EEPROM | -40°C~105°C TJ | Tray | 2000 | ispMACH® 4000V | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 178.57MHz | 40 | LC4032 | 44 | 3.3V | 系统内可编程 | 3.6V | 3V | 11.8mA | 11.8mA | 7.5 ns | 7.5 ns | 36 | 800 | 208 | MACROCELL | 32 | YES | 2 | 3V~3.6V | 2 | 10mm | 10mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||
 | EPM3128ATI100-10N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-TQFP | YES | 80 | -40°C~85°C TA | Tray | 1998 | MAX® 3000A | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | YES | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | compliant | 40 | EPM3128 | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 10 ns | 2500 | MACROCELL | 128 | YES | 3V~3.6V | 10ns | 8 | 1.27mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| EPM7256AEQC208-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 208-BFQFP | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 208 | 锡铅 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPM7256 | S-PQFP-G208 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 126.6MHz | 7.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 7.5ns | 16 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| EPM7256AEQC208-10 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 208-BFQFP | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 208 | 3A991 | 锡铅 | YES | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPM7256 | S-PQFP-G208 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 95.2MHz | 10 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 10ns | 16 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| EPM7512AEQC208-7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 208-BFQFP | YES | 176 | 0°C~70°C TA | Tray | MAX® 7000A | e0 | 活跃 | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPM7512 | S-PQFP-G208 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 116.3MHz | 7.5 ns | 10000 | MACROCELL | 512 | YES | 3V~3.6V | 7.5ns | 32 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | EPM7256AETI144-7N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 144-LQFP | YES | 120 | -40°C~85°C TA | Tray | MAX® 7000A | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 250 | 3.3V | 0.5mm | 30 | EPM7256 | S-PQFP-G144 | 不合格 | 3.6V | 2.5/3.33.3V | 3V | 系统内可编程 | 126.6MHz | 7.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 7.5ns | 16 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| XC2C256-6VQG100C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 80 | 0°C~70°C TA | Tray | 2001 | CoolRunner II | e3 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 真正的数字设计技术 | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 30 | XC2C256 | 100 | 不合格 | 1.8V | 系统内可编程 | 1.9V | 1.7V | 6 ns | 16 | 6000 | 256MHz | 6 | MACROCELL | 256 | YES | 1.7V~1.9V | 5.7ns | 1mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | XCR3512XL-12PQ208I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 180 | 表面贴装 | 208-BFQFP | YES | 208 | EEPROM | -40°C~85°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | 活跃 | 3 (168 Hours) | 208 | EAR99 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | 208 | 不合格 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 12000 | 77MHz | 12 | MACROCELL | 512 | YES | 2.7V~3.6V | 10.8ns | 32 | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||||
 | EPM9560RC240-15 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 240-BFQFP Exposed Pad | YES | 191 | 0°C~70°C TA | Tray | MAX® 9000 | e0 | Obsolete | 3 (168 Hours) | 240 | Tin/Lead (Sn/Pb) | 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 8542.39.00.01 | QUAD | 鸥翼 | 220 | 5V | 0.5mm | 30 | EPM9560 | S-PQFP-G240 | 不合格 | 5.25V | 3.3/55V | 4.75V | 系统内可编程 | 117.6MHz | 16.6 ns | 12000 | MACROCELL | 560 | YES | 4.75V~5.25V | 15ns | 35 | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | EPM240GM100C5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 100-TFBGA | YES | 80 | 0°C~85°C TJ | Tray | MAX® II | e1 | 活跃 | 3 (168 Hours) | 100 | EAR99 | 锡银铜 | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 40 | EPM240 | S-PBGA-B100 | 不合格 | 1.89V | 1.5/3.31.8V | 1.71V | 系统内可编程 | 7.5 ns | MACROCELL | 192 | YES | 1.71V~1.89V | 4.7ns | 240 | 符合RoHS标准 |