类别是'嵌入式 - 微控制器 - 应用特定'
嵌入式 - 微控制器 - 应用特定 (5239)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 座位高度-最大 | 地址总线宽度 | 主时钟/晶体频率-名 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 输出时钟频率-最大值 | 串行I/O数 | 总线兼容性 | 最大数据传输率 | 通信协议 | 数据编码/解码方式 | 长度 | 宽度 | |||||||||||||||||
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XCZU6CG-1FBVB900E | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | XILINX INC | BGA, BGA900,30X30,40 | 100 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.876 V | 0.825 V | 0.85 V | 900 | 有 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | ||||||||||||||||||||||||||
DHF100X650NA | IXYS Integrated Circuits Division | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
UPD6147G | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
MC68360CRC25K | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
IA8255-PDW40C | Analog Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ANALOG DEVICES INC | , | 接触制造商 | 8542.31.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
XCZU6CG-2SFVA625E | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | XILINX INC | FBGA, BGA625,25X25,32 | 100 °C | PLASTIC/EPOXY | FBGA | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 625 | 有 | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B625 | OTHER | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | ||||||||||||||||||||||||||
MM1096 | Mitsumi Electric Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MITSUMI ELECTRIC CO LTD | , | Obsolete | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||
F68-26A | ZF Micro Solutions, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU9CG-2LFFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-1156 | 4 | 110 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | 网格排列 | 0.85 V | 1156 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1156 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||||||||||||||||||||||||||
W219BHT | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | CYPRESS SEMICONDUCTOR CORP | SSOP | SSOP, | 1 | 70 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3.465 V | 3.135 V | 3.3 V | 48 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | ALSO REQUIRES AT 2.5V SUPPLY | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 0.635 mm | compliant | 未说明 | 48 | R-PDSO-G48 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.794 mm | 14.318 MHz | 166 MHz | 15.875 mm | 7.5 mm | ||||||||||||||||
ATMXT336UD-MAU316 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
SPL505YC264AT | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | SILICON LABORATORIES INC | TSSOP | TSSOP, | 85 °C | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.465 V | 3.135 V | 3.3 V | 64 | 活跃 | EAR99 | 8542.39.00.01 | DUAL | 鸥翼 | 0.5 mm | unknown | 64 | R-PDSO-G64 | OTHER | CLOCK GENERATOR, PROCESSOR SPECIFIC | 1.1 mm | 14.31818 MHz | 400 MHz | 17 mm | 6.1 mm | ||||||||||||||||||||||||
TL16C554A | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
FW82439JHX | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
TSS463-AA | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | ATMEL CORP | SOIC | SOP, SOP16,.4 | 16 MHz | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 5.5 V | 4.5 V | 5 V | 16 | 无 | e0 | 无 | 锡铅 | 8542.31.00.01 | DUAL | 鸥翼 | 1.27 mm | compliant | 16 | R-PDSO-G16 | 不合格 | AUTOMOTIVE | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 9 mA | 2.65 mm | NO | YES | 1 | 0.125 MBps | NRZ; BIPH-LEVEL(MANCHESTER) | 10.3 mm | 7.5 mm | |||||||||||||
PAS7401BV-NGI | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | MICROSEMI CORP | Obsolete | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
ICS8535AG-31 | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | TSSOP | TSSOP, TSSOP20,.25 | 1 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.465 V | 3.135 V | 3.3 V | 20 | 无 | e0 | 无 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | DUAL | 鸥翼 | 240 | 0.65 mm | not_compliant | 20 | 20 | R-PDSO-G20 | 不合格 | COMMERCIAL | CLOCK GENERATOR, OTHER | 60 mA | 1.2 mm | 40 MHz | 266 MHz | 6.5 mm | 4.4 mm | ||||||||||||||
ML60851ETBZ0MX | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
UPD6461GS-102 | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RENESAS ELECTRONICS CORP | SSOP, SSOP20,.3 | 70 °C | -20 °C | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 20 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | 鸥翼 | 0.635 mm | unknown | R-PDSO-G20 | 不合格 | COMMERCIAL | GRAPHICS PROCESSOR | |||||||||||||||||||||||||||||
COM2661-1 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 活跃 | MICROCHIP TECHNOLOGY INC | 70 °C | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | 28 | 无 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T28 | 不合格 | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | NO | 8 | 1 | ASYNC, BIT; SYNC, BYTE; BISYNC | ||||||||||||||||||||||||||
COM2661-1 | SMSC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | STANDARD MICROSYSTEMS CORP | DIP, DIP28,.6 | 70 °C | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | 28 | 无 | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 235 | 2.54 mm | unknown | R-XDIP-T28 | 不合格 | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | NO | 8 | 1 | ASYNC, BIT; SYNC, BYTE; BISYNC | ||||||||||||||||||||||
SPAK302PV16VC | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MOTOROLA INC | LFQFP, | 16 MHz | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 144 | Transferred | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G144 | 不合格 | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 1.6 mm | 24 | YES | NO | 16 | 4 | 68000 | 1.25 MBps | 20 mm | 20 mm | |||||||||||||||||||||||||
TL16C554AI | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
SCB68172C2A44 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | 飞利浦半导体 | QCCJ, LDCC44,.7SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 5 V | 44 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J44 | 不合格 | COMMERCIAL | 180 mA | |||||||||||||||||||||||||||||
NRF7000-QFAA-R | Nordic Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 |