类别是'时钟/计时 - 时钟缓冲器，驱动器'
时钟/计时 - 时钟缓冲器，驱动器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 包装方式 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出量 | 引脚数量 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 功率耗散 | 最大电源电流 | 投掷配置 | 传播延迟 | 静态电流 | 接通延迟时间 | 家人 | 逻辑功能 | 数据率 | 输入数量 | 最大输入电压 | 输出特性 | 无卤素 | 输入 | 比率-输入：输出 | 电源电压限制-最大值 | 最大 I(ol) | 差分 - 输入：输出 | Prop. Delay@Nom-Sup | 传播延迟(tpd) | 最大工作周期 | 输入行数 | 输入电流 | 输出行数 | fmax-Min | 同边偏斜-最大(tskwd) | 最大结点温度（Tj） | 占空比 | 环境温度范围高 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | CDCLVP1208RHDT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 28-VFQFN Exposed Pad | 28 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 3 (168 Hours) | 28 | EAR99 | Fanout Buffer (Distribution), Multiplexer | TR | 2.375V~3.6V | QUAD | 260 | 1 | 2.5V | 2GHz | CDCLVP1208 | LVPECL | 28 | 8 | 3.6V | 2.5/3.3V | 2.375V | 1 | 73mA | 450 ps | 450 ps | CDC | LVCMOS, LVDS, LVPECL, LVTTL | 2:8 | Yes/Yes | 0.45 ns | 73mA | 2000 MHz | 0.02 ns | 1mm | 5mm | 5mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | LMK01010ISQE/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 48-WFQFN Exposed Pad | 48 | -40°C~85°C | Tape & Reel (TR) | e3 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Fanout Buffer (Distribution), Divider | Matte Tin (Sn) | TR | 702.3mW | 3.15V~3.45V | QUAD | 260 | 1 | 3.3V | 0.5mm | 1.6GHz | LMK01010 | LVDS | 48 | 8 | 3.45V | 3.3V | 1 | 160mA | 160mA | 160mA | Clock | 1:8 | 0.0005 A | Yes/Yes | 5μA | 0.03 ns | 800μm | 7mm | 7mm | 750μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | MC100LVE111FNR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 1 day ago) | Tin | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | -40°C~85°C | Tape & Reel (TR) | 2006 | 100LVE | e3 | yes | 活跃 | 3 (168 Hours) | 28 | Fanout Buffer (Distribution) | NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V | 3V~3.8V | QUAD | J BEND | 260 | 1 | 3.3V | 1.5GHz | 40 | MC100LVE111 | ECL, PECL | 28 | 18 | 3.3V | 3.8V | +-3/+-3.8V | 3V | 1 | 55mA | 650 ps | 700 ps | 无卤素 | ECL, PECL | 1:9 | Yes/Yes | 0.65 ns | 0.05 ns | 4.57mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | MC100EP11DTR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | 3GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | 100EP | e3 | yes | 活跃 | 3 (168 Hours) | 8 | Fanout Buffer (Distribution) | Tin (Sn) | NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V | 3V~5.5V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 40 | MC100EP11 | ECL, PECL | 8 | 4 | 5.5V | -3.0/-5.5V | 3V | 1 | 300 ps | 300 ps | 4.12V | 无卤素 | ECL, PECL | 1:2 | Yes/Yes | 0.32 ns | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | SY89832UMG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 1 | Industrial grade | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | 16-MLF® (3x3) | 2.5GHz | -40°C~85°C | Tube | 2000 | Precision Edge® | 活跃 | 2 (1 Year) | Fanout Buffer (Distribution), Translator | 85°C | -40°C | 2.375V~2.625V | 2.5GHz | SY89832 | LVDS | 4 | 2.5V | 1 | 1 | 2.625V | 2.375V | 75mA | 570 ps | 570 ps | Clock | 2 | CML, LVDS, LVPECL | 1:4 | Yes/Yes | 85°C | 900μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | LMK00105SQE/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 24-WFQFN Exposed Pad | 24 | -40°C~85°C | Tape & Reel (TR) | e3 | yes | 活跃 | 1 (Unlimited) | 24 | EAR99 | Fanout Buffer (Distribution), Multiplexer, Translator | Matte Tin (Sn) | TR | 2.375V~3.45V | QUAD | 260 | 1 | 3.3V | 200MHz | LMK00105 | LVCMOS | 24 | 5 | 1 | 25mA | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, SSTL, Crystal | 2:5 | Yes/No | 2.8 ns | 2.8 ns | 800μm | 4mm | 4mm | 750μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AD9510BCPZ-REEL7 | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 2 weeks ago) | Tin | 表面贴装 | 64-VFQFN Exposed Pad, CSP | YES | 64 | 1.2GHz | -40°C~85°C | Tape & Reel (TR) | e3 | no | 活跃 | 3 (168 Hours) | 64 | EAR99 | Fanout Buffer (Distribution), Divider | 3.135V~3.465V | QUAD | 无铅 | 260 | 1 | 3.3V | 0.5mm | 40 | AD9510 | CMOS, LVDS, LVPECL | 64 | 8 | 不合格 | 3.465V | 3.3V | 1 | Clock | 2:8 | Yes/Yes | 0.695 ns | 9mm | 9mm | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SY58608UMG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | -40°C~85°C | Tube | 2015 | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 16 | EAR99 | Fanout Buffer (Distribution) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.375V~2.635V | QUAD | 260 | 1 | 2.5V | 3GHz | 40 | SY58608 | LVDS | 2 | 2.5V | 55mA | 280 ps | 420 ps | Buffer | 2.5V | CML, LVDS, LVPECL | 1:2 | Yes/Yes | 1 | 850μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CDCLVC1310RHBR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 5 days ago) | Gold | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 2 (1 Year) | 32 | EAR99 | Fanout Buffer (Distribution), Multiplexer | ALSO OPERATES IN 3.3 V | TR | 2.375V~3.465V | QUAD | 260 | 1 | 2.5V | 200MHz | CDCLVC1310 | LVCMOS | 32 | 10 | 2.625V | 2.5/3.3V | 2.375V | 1 | 2 ns | 2 ns | CDC | HCSL, LVCMOS, LVDS, LVPECL, SSTL, Crystal | 3:10 | 0.024 A | Yes/No | 0.05 ns | 55 % | 1mm | 5mm | 5mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
 | CDCVF2310PW | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 24-TSSOP (0.173, 4.40mm Width) | 24 | 89.499445mg | -40°C~85°C | Tube | e4 | yes | 活跃 | 1 (Unlimited) | 24 | EAR99 | Fanout Buffer (Distribution) | 2.3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 2.5V | 0.65mm | 200MHz | CDCVF2310 | 24 | 10 | 3.6V | 2.5/3.3V | 2.3V | 1 | 80μA | 2.8 ns | 3.5 ns | CDC | Clock | 3-STATE WITH SERIES RESISTOR | LVTTL | 1:10 | No/No | 5μA | 1.2mm | 7.8mm | 4.4mm | 1mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | LTC6957IDD-3#PBF | Linear Technology/Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 1 week ago) | 表面贴装 | 表面贴装 | 12-WFDFN Exposed Pad | 12 | 300MHz | -40°C~85°C | Tube | 2006 | e3 | 活跃 | 1 (Unlimited) | 12 | EAR99 | Fanout Buffer (Distribution) | Matte Tin (Sn) | 3.15V~3.45V | DUAL | 无铅 | 260 | 1 | 3.3V | 0.45mm | 30 | LTC6957 | CMOS | 12 | 2 | 1 | Inverting | CML, CMOS, LVDS, LVPECL | 1:2 | Yes/No | 150°C | 800μm | 3mm | 3mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SY89874UMG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, 16-MLF® | 16 | -40°C~85°C | Tube | 2008 | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 16 | SMD/SMT | Fanout Buffer (Distribution), Divider | Nickel/Palladium/Gold (Ni/Pd/Au) | CAN ALSO OPERATE WITH 3.3V SUPPLY | 2.375V~3.63V | QUAD | 260 | 1 | 2.5V | 0.5mm | 2.5GHz | 40 | SY89874 | LVPECL | 2 | 3.63V | 1 | 50mA | 730 ps | 75mA | Clock | 4V | CML, HSTL, LVDS, LVPECL | 1:2 | Yes/Yes | 850μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | SY89853UMG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad, 32-MLF® | 32 | 2.5GHz | -40°C~85°C | Tube | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 32 | Multiplexer | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES AT 3.3V SUPPLY | 2.375V~3.6V | QUAD | 260 | 2 | 2.5V | 0.5mm | 40 | SY89853 | LVPECL | 1 | 2 | 210mW | DPST | 400 ps | 85mA | CML, LVDS, PECL | 2:1 | Yes/Yes | 0.9mm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CDCLVP1102RGTT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 2 (1 Year) | 16 | EAR99 | Fanout Buffer (Distribution) | 虚端子 | TR | 2.375V~3.6V | QUAD | 260 | 1 | 2.5V | 0.5mm | 2GHz | CDCLVP1102 | LVPECL | 16 | 2 | 1 | 100mA | 33mA | 450 ps | 450 ps | CDC | LVCMOS, LVDS, LVPECL, LVTTL | 1:2 | Yes/Yes | 0.45 ns | 33mA | 1mm | 3mm | 3mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | SI5330F-B00214-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 24-VFQFN Exposed Pad | YES | 24 | -40°C~85°C | Tray | 1997 | 活跃 | 2 (1 Year) | 24 | Fanout Buffer (Distribution), Translator | 1.71V~3.63V | QUAD | 1 | 3.3V | 0.5mm | 200MHz | SI5330 | CMOS | 24 | 8 | 3.3V | 3.63V | 2.97V | 1 | 10mA | 4 ns | 2.5 ns | Clock | CMOS, HSTL, LVTTL, SSTL | 1:8 | No/No | 60 % | 55 % | 850μm | 4mm | 4mm | 无 | Unknown | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SY89838UMG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad, 32-MLF® | 32 | -40°C~85°C | Tube | 2000 | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 32 | Fanout Buffer (Distribution), Multiplexer | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.375V~2.625V | QUAD | 1 | 2.5V | 2GHz | SY89838 | LVDS | 2.5V | 1 | 250mA | 350mA | 700 ps | 350mA | 1 ns | 4V | CML, LVDS, LVPECL | 2:8 | Yes/Yes | 0.04 ns | 2 | 8 | 0.04 ns | 800μm | 5mm | 5mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| SY89858UMG | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad, 32-MLF® | 32 | 3GHz | -40°C~85°C | Tube | 2000 | Precision Edge® | e4 | 活跃 | 2 (1 Year) | 32 | Fanout Buffer (Distribution) | Nickel/Palladium/Gold (Ni/Pd/Au) | CAN ALSO OPERATE WITH 3.3V SUPPLY | 2.375V~3.6V | QUAD | 260 | 1 | 2.5V | 0.5mm | 40 | SY89858 | LVPECL | 16 | 3.3V | 2.625V | 2.375V | 1 | 380 ps | 380 ps | CML, LVDS, PECL | 1:8 | Yes/Yes | 3000 MHz | 0.03 ns | 0.95mm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | NB6N11SMNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 23 hours ago) | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | -40°C~85°C | Tube | 2007 | AnyLevel™ ECLinPS MAX™ | yes | 活跃 | 1 (Unlimited) | 16 | Fanout Buffer (Distribution), Translator | Nickel/Gold/Palladium (Ni/Au/Pd) | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 2GHz | 40 | NB6N11S | LVDS | 16 | 4 | 3.3V | 3.6V | 3V | 1 | 470 ps | 470 ps | 6N | Translator | 2.5 Gbps | 无卤素 | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:2 | Yes/Yes | 0.025 ns | 950μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||
| ZL40203LDG1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 750MHz | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | 16 | Fanout Buffer (Distribution) | ALSO OPERATES AT 3.3 V SUPPLY | 2.375V~3.465V | QUAD | 1 | 2.375V | 0.5mm | LVPECL | 16 | 3.465V | 2.625V | 2.5/3.3V | 2.375V | 1 | 2 ns | CML, HCSL, LVCMOS, LVDS, LVPECL | 1:4 | Yes/Yes | 2 % | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC100EP210SFAG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 32-LQFP | 32 | -40°C~85°C | Tray | 2005 | 100EP | e3 | yes | 活跃 | 2 (1 Year) | 32 | Fanout Buffer (Distribution) | Tin (Sn) | 2.375V~2.625V | QUAD | 鸥翼 | 260 | 2 | 2.5V | 0.8mm | 1GHz | 40 | MC100EP210 | LVDS | 32 | 20 | 2.5V | 2 | 150mA | 675 ps | 675 ps | 2.5V | 无卤素 | LVDS, LVPECL | 1:5 | Yes/Yes | 0.675 ns | 1.6mm | 7mm | 7mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
| AD9510BCPZ | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 2 weeks ago) | Tin | 表面贴装 | 64-VFQFN Exposed Pad, CSP | YES | 64 | -40°C~85°C | Tray | e3 | no | 活跃 | 3 (168 Hours) | 64 | SMD/SMT | EAR99 | Fanout Buffer (Distribution), Divider | 3.135V~3.465V | QUAD | 260 | 1 | 3.3V | 0.5mm | 1.2GHz | 40 | AD9510 | CMOS, LVDS, LVPECL | 64 | 8 | 3.3V | 3.465V | Serial | 1 | 1.5W | Clock | 2:8 | Yes/Yes | 0.695 ns | 830μm | 9mm | 9mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | LMK00101SQE/NOPB | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | Tin | 表面贴装 | 表面贴装 | 32-WFQFN Exposed Pad | 32 | 200MHz | -40°C~85°C | Tape & Reel (TR) | e3 | yes | 活跃 | 1 (Unlimited) | 32 | EAR99 | Fanout Buffer (Distribution), Multiplexer, Translator | TR | 2.375V~3.45V | QUAD | 无铅 | 260 | 1 | 3.3V | 未说明 | LMK00101 | LVCMOS, LVTTL | 32 | 10 | 不合格 | 3.3V | 3.45V | 2.375V | 1 | 20mA | 25mA | 101 | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, SSTL, Crystal | 3:10 | Yes/No | 2.8 ns | 2.8 ns | 200 MHz | 0.025 ns | 800μm | 5mm | 5mm | 750μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | CDCLVC1108PWR | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | 16 | 250MHz | -40°C~85°C | Tape & Reel (TR) | e4 | yes | 活跃 | 1 (Unlimited) | 16 | EAR99 | Fanout Buffer (Distribution) | TR | 2.3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 2.5V | CDCLVC1108 | 16 | 8 | 2.7V | 3.3V | 2.3V | 1 | 10 ns | 10 ns | CDC | LVCMOS | 1:8 | No/No | 2 ns | 250 MHz | 0.05 ns | 1.2mm | 5mm | 4.4mm | 1mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NB6L11SMNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | -40°C~85°C | Tube | 2008 | AnyLevel™ | yes | 活跃 | 1 (Unlimited) | 16 | EAR99 | Fanout Buffer (Distribution), Translator | Nickel/Gold/Palladium (Ni/Au/Pd) | 2.375V~2.625V | QUAD | 260 | 1 | 2.5V | 0.5mm | 2GHz | 40 | NB6L11 | LVDS | 16 | 4 | 2.5V | 2.625V | 2.375V | 1 | 30mA | 450 ps | 450 ps | 6L | 无卤素 | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:2 | Yes/Yes | 0.025 ns | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | ADCLK914BCPZ-R7 | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | PRODUCTION (Last Updated: 1 week ago) | Tin | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad, CSP | 16 | -40°C~125°C | Tape & Reel (TR) | SiGe | e3 | no | 活跃 | 3 (168 Hours) | 16 | EAR99 | Buffer/Driver, Data | 2.97V~3.63V | QUAD | 260 | 1 | 3.3V | 0.5mm | 7.5GHz | 40 | ADCLK914 | HVDS | 16 | 1 | 3.3V | 1 | 202 ps | 202 ps | CML, CMOS, LVDS, LVPECL, LVTTL | 1:1 | 6V | Yes/Yes | 0.9mm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 含铅 |