类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 端口的数量 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 数据总线宽度 | 最大输入电压 | 驱动器数量 | 总线兼容性 | 最大数据传输率 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | RoHS状态 | 无铅 | ||||
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.png) | 89HPES32T8ZHBX | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 500 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 500 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | not_compliant | 20 | 500 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 31mm | 31mm | 1.1mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
| 89HPES24T6G2ZCALI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | Lead, Tin | 表面贴装 | FCBGA | 324 | 85°C | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1mm | not_compliant | 未说明 | 324 | 不合格 | 13.3V | INDUSTRIAL | PCI Express | BUS CONTROLLER, PCI | 3.27mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||
| 89HPES10T4G2ZABC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 324 | 70°C | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 12.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 781mA | PCI; SMBUS | 12000 MBps | 1.4mm | 19mm | 19mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||
| 89HPES24N3YCBX | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 420 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 420 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 420 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 27mm | 27mm | 1.7mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
| 89H34H16G2ZCBL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 1156 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 6264mA | 272 Gbps | I2C; ISA; PCI; SMBUS; VGA | 34000 MBps | 3.42mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
| 89HPEB383ZANQG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 132 | 33MHz | Tape & Reel (TR) | 1999 | yes | 活跃 | 85°C | 0°C | 132 | 5V | PCI Express | 32b | 900μm | 10mm | 10mm | 900μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
| 89H48T12G2ZCBLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | FCBGA | 676 | 70°C | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 676 | 不合格 | 1.1V | 12.5/3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | I2C; ISA; PCI; SMBUS; VGA | 48000 MBps | 3.4mm | 27mm | 27mm | 3.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||
| 89HPES16T4G2ZBBXI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C | Lead, Tin | 表面贴装 | 288 | 85°C | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 288 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | not_compliant | 未说明 | 288 | 不合格 | 1.1V | 12.53.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 23mm | 23mm | 1.1mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||
| 89HPES12NT3ZBBCI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | 表面贴装 | BGA | 324 | 85°C | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI; SMBUS | 6000 MBps | 1.5mm | 19mm | 19mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
| 89H32H8G2ZCBLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | FCBGA | 484 | 125MHz | 2009 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | I2C; ISA; SMBUS; VGA | 32000 MBps | 3.34mm | 23mm | 23mm | 3.34mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||
| 89HPES48T12ZABRI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | Copper, Silver, Tin | 表面贴装 | FCBGA | 1156 | 85°C | 1999 | e1 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 2635mA | PCI | 2.82mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 含铅 | |||||||||||||||||
| 89HPES16H16ZABRI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 64 Gbps | PCI | 3.32mm | 23mm | 23mm | 3.34mm | 符合RoHS标准 | 含铅 | ||||||||||||||||
| 89HPEB383ZAEMG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | TQFP | 128 | 33MHz | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 128 | Matte Tin (Sn) | 85°C | 0°C | QUAD | 鸥翼 | 260 | 1.05V | 0.4mm | 30 | 128 | 5V | COMMERCIAL | PCI Express | BUS CONTROLLER, PCI | 32b | ISA; PCI; SBUS; VGA; USB | 2500 MBps | 1.2mm | 14mm | 14mm | 1mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
| 89HPES16T4ZHBC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | BGA | 484 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 484 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 484 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.59mm | 23mm | 23mm | 1.59mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
| 89HMPEB383ZAEMG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | QFP | 2014 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 89HPES34H16ZABL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 1156 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 3.42mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||
| 89H12NT12G2ZBHL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Lead, Tin | 表面贴装 | FCBGA | 324 | 125MHz | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 8542.39.00.01 | 225 | not_compliant | 20 | 324 | 3.3V | PCI Express | 12 | BUS CONTROLLER, PCI | 96 Gbps | 3.02mm | 19mm | 19mm | 3.02mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
| 89H12NT12G2ZBHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 3300mA | 96 Gbps | I2C; ISA; VGA | 2.88mm | 19mm | 19mm | 3.02mm | Non-RoHS Compliant | 含铅 | |||||||||||||
| 89H12NT12G2ZBHLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 125MHz | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.39.00.01 | 225 | not_compliant | 20 | 324 | 3.3V | PCI Express | 12 | BUS CONTROLLER, PCI | 96 Gbps | 3.02mm | 19mm | 19mm | 3.02mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
| 89H12NT12G2ZBHLI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 3300mA | 96 Gbps | I2C; ISA; VGA | 3.02mm | 19mm | 19mm | 3.02mm | Non-RoHS Compliant | 含铅 | |||||||||||||
| 89H16NT16G2ZBHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Lead, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 3300mA | 128 Gbps | I2C; ISA; VGA | 3.02mm | 19mm | 19mm | 3.02mm | Non-RoHS Compliant | 含铅 | ||||||||||||||
| 89HPES64H16ZABLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 125MHz | Copper, Silver, Tin | 表面贴装 | FCBGA | 12.57W | Bulk | 2017 | 70°C | 0°C | 3.3V | PCI Express | 16 | 256 Gbps | 1.6V | 64 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
| 89H16NT16G2ZBHLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 324 | 125MHz | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.39.00.01 | 225 | not_compliant | 未说明 | 324 | 3.3V | PCI Express | 16 | BUS CONTROLLER, PCI | 128 Gbps | 3.02mm | 19mm | 19mm | 3.02mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||
| 89H24NT24AG2ZBHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | 活跃 | 85°C | -40°C | 3.3V | PCI Express | 24 | 192 Gbps | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||
| 89H24NT24G2ZBHL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 324 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; PCI; SMBUS; VGA | 3.02mm | 19mm | 19mm | 3.02mm | Non-RoHS Compliant | 含铅 |