类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 模拟 IC - 其他类型 | 端口的数量 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 通信IC类型 | 消费者集成电路类型 | 总线兼容性 | 最大数据传输率 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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 | 89H24NT6AG2ZBHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 6 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; VGA | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
 | 89H24NT24G2ZBHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; PCI; SMBUS; VGA | 3.02mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | 89H24NT24G2ZBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 3400mA | 192 Gbps | I2C; ISA; VGA | 2.88mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||
 | 89H24NT24G2ZBHLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; PCI; SMBUS; VGA | 3.02mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | 89H24NT24G2ZAHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 125MHz | 1999 | 70°C | 0°C | 3.3V | PCI Express | 24 | 192 Gbps | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HPES6T6G2ZCALGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI | 3.27mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | 89H24NT6AG2ZBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 6 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; VGA | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
 | 89HT0808PZAABI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100 | Tape & Reel (TR) | 1999 | 活跃 | I2C | 9mm | 9mm | 1.7mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 89HT0808PZAABI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100 | 1999 | 活跃 | I2C | 9mm | 9mm | 1.7mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HT0816PZABC8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 196 | Tape & Reel (TR) | 2012 | 活跃 | I2C | 15mm | 15mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 89HT0816PZABC | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 196 | 2012 | 活跃 | I2C | 15mm | 15mm | 1.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HP0508PZBABGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100 | 2011 | yes | 活跃 | 85°C | -40°C | 100 | PCI Express | 消费电路 | 9mm | 9mm | 1.7mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | 89HT0808PZAABGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100 | Tape & Reel (TR) | 1999 | Discontinued | I2C | 9mm | 9mm | 1.7mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 89HT0808PZAAB8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100 | Tape & Reel (TR) | 1999 | 活跃 | I2C | 9mm | 9mm | 1.7mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 89HT0808PZAAB | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100 | 1999 | 活跃 | I2C | 9mm | 9mm | 1.7mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | 89H12NT12G2ZAHLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | FCBGA | 125MHz | 1999 | 85°C | -40°C | 3.3V | PCI Express | 12 | 96 Gbps | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MAX24287ETK+T | Microsemi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 68 | Tape & Reel | 2012 | 活跃 | 68 | 85°C | -40°C | SONET | 8542.39.00.01 | QUAD | 1 | 1.2V | 0.4mm | 68 | INDUSTRIAL | Ethernet | ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER | 0.8mm | 8mm | 8mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | 89H32NT8AG2ZCHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 250 | 30 | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
 | 89HPES24T6G2ZBALG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI; SMBUS | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
 | 89HPES24T3G2ZCALG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 1.1V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | SMBUS | 625 MBps | 3.42mm | 19mm | 19mm | 3.27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | 89HPES4T4ZBBC8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 144 | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 144 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | PCI; SMBUS | 1.4mm | 13mm | 13mm | 1.4mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
 | 89HPES12N3YCBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 324 | 1999 | e1 | yes | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 1.5mm | 19mm | 19mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | 89HPES3T3ZBNQG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | 132 | Tape & Reel (TR) | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 132 | EAR99 | 70°C | 0°C | 8542.39.00.01 | QUAD | 无铅 | 260 | 1V | 0.65mm | 未说明 | 132 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | PCI; SMBUS | 0.9mm | 10mm | 10mm | 900μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
 | ZSSC4161BE2R | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | -40°C | YES | 24 | 150°C | 2016 | e3 | yes | 活跃 | 1 (Unlimited) | 24 | Tin (Sn) | 8542.31.00.01 | QUAD | 无铅 | 260 | 1 | 5V | 未说明 | 24 | 5.25V | AUTOMOTIVE | 4.75V | 模拟电路 | 4mm | 4mm | 900μm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||||
 | 89H12NT12G2ZCHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 12 | BUS CONTROLLER, PCI | 3300mA | 96 Gbps | I2C; ISA; VGA | 2.88mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 |